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41. 发明授权

US07030002B2 Low temperature anneal to reduce defects in hydrogen-implanted, relaxed SiGe layer 有权
标题翻译：低温退火以减少氢注入，弛豫SiGe层的缺陷
公开(公告)号：US07030002B2
公开(公告)日：2006-04-18
申请号：US10780929
申请日：2004-02-17
申请人： Douglas J. Tweet , Jong-Jan Lee , Jer-Shen Maa
发明人： Douglas J. Tweet , Jong-Jan Lee , Jer-Shen Maa
IPC分类号： H01L21/28 , H01L21/13205 , H01L21/00 , H01L21/84 , H01L21/36
CPC分类号： H01L21/02381 , H01L21/0245 , H01L21/02502 , H01L21/02532 , H01L21/02694 , H01L21/324 , H01L21/3247
摘要： A method of forming a SiGe layer having a relatively high Ge content includes preparing a silicon substrate; depositing a layer of SiGe to a thickness of between about 100 nm to 500 nm, wherein the Ge content of the SiGe layer is equal to or greater than 10%, implanting H2+ ions through the SiGe layer into the substrate at a dose of between about 2×1014 cm−2 to 2×1016 cm−2, at an energy of between about 20 keV to 100+ keV; low temperature thermal annealing at a temperature of between about 200° C. to 400° C. for between about ten minutes and ten hours; high temperature thermal annealing the substrate and SiGe layer, to relax the SiGe layer, in an inert atmosphere at a temperature of between about 650° C. to 1000° C. for between about 30 seconds and 30 minutes; and depositing a layer of silicon-based material on the relaxed SiGe layer to a thickness of between about 5 nm to 30 nm.
摘要翻译：形成Ge含量较高的SiGe层的方法包括制备硅衬底; 将SiGe层沉积至约100nm至500nm的厚度，其中SiGe层的Ge含量等于或大于10％，注入H 2 O + SUP +离子通过SiGe层以约2×10 14 cm -2至2×10 16 cm -3的剂量进入衬底，在约20keV至100eKeV之间的能量; 在约200℃至400℃的温度下进行约10分钟至10小时的低温热退火; 在惰性气氛中，在约650℃至1000℃的温度下，在约30秒至30分钟之间，使衬底和SiGe层进行高温热退火以使SiGe层松弛; 以及在松弛的SiGe层上沉积一层硅基材料至约5nm至30nm的厚度。

42. 发明授权

US07008813B1 Epitaxial growth of germanium photodetector for CMOS imagers 有权
标题翻译：用于CMOS成像器的锗光电探测器的外延生长
公开(公告)号：US07008813B1
公开(公告)日：2006-03-07
申请号：US11069424
申请日：2005-02-28
申请人： Jong-Jan Lee , Jer-Shen Maa , Douglas J. Tweet , Sheng Teng Hsu
发明人： Jong-Jan Lee , Jer-Shen Maa , Douglas J. Tweet , Sheng Teng Hsu
IPC分类号： H01L21/00
CPC分类号： H01L27/14689 , H01L31/105 , H01L31/1804 , Y02E10/547 , Y02P70/521 , Y10S148/101
摘要： A method of fabricating a germanium photodetector includes preparing a silicon wafer as a silicon substrate; depositing a layer of silicon nitride on the silicon substrate; patterning and etching the silicon nitride layer; depositing a first germanium layer on the silicon nitride layer; patterning and etching the germanium layer wherein a portion of the germanium layer is in direct physical contact with the silicon substrate; depositing a layer of silicon oxide on the germanium layer wherein the germanium layer is encapsulated by the silicon oxide layer; annealing the structure at a temperature wherein the germanium melts and the other layers remain solid; growing a second, single-crystal layer of germanium on the structure by liquid phase epitaxy; selectively removing the silicon oxide layer; and completing the germanium photodetector.
摘要翻译：制造锗光电检测器的方法包括制备硅晶片作为硅衬底; 在硅衬底上沉积氮化硅层; 图案化和蚀刻氮化硅层; 在所述氮化硅层上沉积第一锗层; 图案化和蚀刻锗层，其中锗层的一部分与硅衬底直接物理接触; 在锗层上沉积氧化硅层，其中锗层被氧化硅层包封; 在锗熔融并且其它层保持固体的温度下退火该结构; 通过液相外延在结构上生长第二个锗单晶层; 选择性地除去氧化硅层; 并完成锗光电探测器。

43. 发明授权

US06967112B2 Three-dimensional quantum dot structure for infrared photodetection 有权
标题翻译：用于红外光电检测的三维量子点结构
公开(公告)号：US06967112B2
公开(公告)日：2005-11-22
申请号：US10794158
申请日：2004-03-03
申请人： Jer-Shen Maa , Jong-Jan Lee , Douglas J. Tweet , Sheng Teng Hsu
发明人： Jer-Shen Maa , Jong-Jan Lee , Douglas J. Tweet , Sheng Teng Hsu
IPC分类号： H01L21/00 , H01L21/66 , H01L31/0352 , H01L31/26
CPC分类号： H01L31/035236 , B82Y10/00 , B82Y20/00
摘要： A 3D quantum dot optical path structure is provided, along with a method for selectively forming a 3D quantum dot optical path. The method comprises: forming a single crystal Si substrate with a surface; forming a Si feature in the substrate, such as a via, trench, or pillar; forming dots from a Ge or SiGe material overlying the Si feature; and, forming an optical path that includes the dots. In some aspects of the method, the Si feature has defect sites. For example, the Si feature may be formed with a miscut angle. As a result of the miscut angle, steps are formed in the Si feature plane. Then, the dots are formed in the Si feature steps. The miscut angle is in the range between 0.1 and 5 degrees, and the spacing between steps is in the range between 1 and 250 nanometers (nm).
摘要翻译：提供了3D量子点光路结构以及用于选择性地形成3D量子点光路的方法。该方法包括：用表面形成单晶Si衬底; 在衬底中形成Si特征，例如通孔，沟槽或柱; 从覆盖Si特征的Ge或SiGe材料形成点; 并且形成包括点的光路。在该方法的某些方面，Si特征具有缺陷位点。例如，Si特征可以形成为错误角度。作为误差角的结果，在Si特征平面中形成台阶。然后，在Si特征步骤中形成点。误差角在0.1和5度之间的范围内，并且步骤之间的间隔在1和250纳米（nm）之间的范围内。

44. 发明授权

US06767802B1 Methods of making relaxed silicon-germanium on insulator via layer transfer 失效
标题翻译：通过层转移在绝缘体上制造松散的硅 - 锗的方法
公开(公告)号：US06767802B1
公开(公告)日：2004-07-27
申请号：US10665944
申请日：2003-09-19
申请人： Jer-Shen Maa , Jong-Jan Lee , Douglas J. Tweet , Sheng Teng Hsu
发明人： Jer-Shen Maa , Jong-Jan Lee , Douglas J. Tweet , Sheng Teng Hsu
IPC分类号： H01L2176
CPC分类号： H01L21/76254
摘要： Methods of forming a SiGe layer overlying an insulator are provided. A layer of SiGe is deposited on a substrate and implanted with ion to form a defect region within the SiGe material below its surface. The SiGe layer is then patterned and transferred by contact bonding to an insulator on a second substrate. After contact bonding the structure is annealed to split the SiGe layer along the defect region. The splitting anneal will relax the SiGe layer. Additional annealing at higher temperatures may be used to further relax the SiGe layer. A layer of strained silicon may then be epitaxial deposited on the resulting structure of relaxed SiGe on insulator. Another method provides for epitaxially depositing a layer of silicon over the SiGe layer prior to patterning. The silicon layer would then be bonded to the insulator on the second substrate. The splitting anneal and additional anneals, if any, should then induce strain into the silicon layer. The silicon layer would then remain over the insulator after the SiGe layer is removed.
摘要翻译：提供了形成覆盖在绝缘体上的SiGe层的方法。将一层SiGe沉积在衬底上并注入离子以在其表面下方的SiGe材料内形成缺陷区。然后，通过接触粘合将SiGe层图案化并转移到第二基板上的绝缘体。在接合之后，将结构退火以沿着缺陷区域分离SiGe层。分裂退火将使SiGe层松弛。可以在较高温度下进行额外退火以进一步松弛SiGe层。然后可以将绝缘体上的松散SiGe结构外延沉积一层应变硅。另一种方法提供在图案化之前在SiGe层上外延沉积硅层。然后将硅层与第二基板上的绝缘体接合。分裂退火和额外的退火（如果有的话）应该在硅层中诱导应变。在除去SiGe层之后，硅层将保留在绝缘体上。

45. 发明申请

US20060194418A1 Smooth surface liquid phase epitaxial germanium 有权
标题翻译：光滑表面液相外延锗
公开(公告)号：US20060194418A1
公开(公告)日：2006-08-31
申请号：US11339017
申请日：2006-01-25
申请人： Jong-Jan Lee , Jer-Shen Maa , Douglas Tweet , David Evans , Allen Burmaster
发明人： Jong-Jan Lee , Jer-Shen Maa , Douglas Tweet , David Evans , Allen Burmaster
IPC分类号： H01L21/20 , H01L21/311
CPC分类号： C30B19/00 , C30B29/08 , H01L21/02381 , H01L21/02488 , H01L21/02532 , H01L21/02623 , H01L21/02639 , H01L21/30625 , H01L21/7624 , H01L27/14683 , H01L27/14689 , H01L29/16 , H01L29/78 , H01L31/028 , H01L31/105 , H01L31/1126 , H01L31/1136 , H01L31/1804 , H01L31/1808 , Y02E10/547 , Y02P70/521
摘要： A method is provided for forming a liquid phase epitaxial (LPE) germanium (Ge)-on-insulator (GOI) thin-film with a smooth surface. The method provides a silicon (Si) wafer, forms a silicon nitride insulator layer overlying the Si wafer, and selectively etches the silicon nitride insulator layer, forming a Si seed access region. Then, the method conformally deposits Ge overlying the silicon nitride insulator layer and Si seed access region, forming a Ge layer with a first surface roughness, and smoothes the Ge layer using a chemical-mechanical polish (CMP) process. Typically, the method encapsulates the Ge layer and anneals the Ge layer to form a LPE Ge layer. A Ge layer is formed with a second surface roughness, less than the first surface roughness. In some aspects, the method forms an active device in the LPE Ge layer.
摘要翻译：提供一种形成具有光滑表面的液相外延（LPE）锗（Ge） - 绝缘体（GOI）薄膜的方法。该方法提供硅（Si）晶片，形成覆盖Si晶片的氮化硅绝缘体层，并且选择性地蚀刻氮化硅绝缘体层，形成Si种子接入区域。然后，该方法共同沉积覆盖氮化硅绝缘体层和Si种子访问区域的Ge，形成具有第一表面粗糙度的Ge层，并且使用化学机械抛光（CMP）工艺平滑Ge层。通常，该方法封装Ge层并退火Ge层以形成LPE Ge层。 Ge层形成有小于第一表面粗糙度的第二表面粗糙度。在某些方面，该方法在LPE Ge层中形成有源器件。

46. 发明授权

US07241670B2 Method to form relaxed SiGe layer with high Ge content using co-implantation of silicon with boron or helium and hydrogen 失效
标题翻译：使用硅与硼或氦和氢的共同注入形成具有高Ge含量的弛豫SiGe层的方法
公开(公告)号：US07241670B2
公开(公告)日：2007-07-10
申请号：US10936400
申请日：2004-09-07
申请人： Douglas J. Tweet , David R. Evans , Sheng Teng Hsu , Jer-Shen Maa
发明人： Douglas J. Tweet , David R. Evans , Sheng Teng Hsu , Jer-Shen Maa
IPC分类号： H01L21/26 , H01L21/42
CPC分类号： H01L21/02694 , H01L21/02381 , H01L21/0245 , H01L21/02532 , H01L29/1054 , Y10S438/933
摘要： A method of forming a relaxed SiGe layer having a high germanium content in a semiconductor device includes preparing a silicon substrate; depositing a strained SiGe layer; implanting ions into the strained SiGe layer, wherein the ions include silicon ions and ions selected from the group of ions consisting of boron and helium, and which further includes implanting H+ ions; annealing to relax the strained SiGe layer, thereby forming a first relaxed SiGe layer; and completing the semiconductor device.
摘要翻译：在半导体器件中形成具有高锗含量的弛豫SiGe层的方法包括制备硅衬底; 沉积应变SiGe层; 将离子注入到应变SiGe层中，其中离子包括选自由硼和氦构成的离子组的硅离子和离子，并且还包括注入H +离子; 退火以使应变SiGe层松弛，从而形成第一弛豫SiGe层; 并完成半导体器件。

47. 发明申请

US20080280426A1 Gallium nitride-on-silicon interface 审中-公开
标题翻译：氮化镓在硅界面
公开(公告)号：US20080280426A1
公开(公告)日：2008-11-13
申请号：US11801210
申请日：2007-05-09
申请人： Tingkai Li , Douglas J. Tweet , Jer-Shen Maa , Sheng Teng Hsu
发明人： Tingkai Li , Douglas J. Tweet , Jer-Shen Maa , Sheng Teng Hsu
IPC分类号： H01L29/739 , H01L21/20
CPC分类号： C30B29/406 , C30B25/183 , H01L21/02381 , H01L21/02458 , H01L21/02505 , H01L21/0254 , H01L21/02642 , H01L21/02647 , H01L29/2003 , H01L29/267
摘要： A method is provided for forming a matching thermal expansion interface between silicon (Si) and gallium nitride (GaN) films. The method provides a (111) Si substrate and forms a first aluminum (Al)-containing film in compression overlying the Si substrate. Nano-column holes are formed in the first Al-containing film, which exposes regions of the underlying Si substrate. A layer of GaN layer is selectively grown from the exposed regions, covering the first Al-containing film. The GaN is grown using a lateral nanoheteroepitaxy overgrowth (LNEO) process. The above-mentioned processes are reiterated, forming a second Al-containing film in compression, forming nano-column holes in the second Al-containing film, and selectively growing a second GaN layer. Film materials such as Al2O3, Si1-xGex, InP, GaP, GaAs, AlN, AlGaN, or GaN, may be initially grown at a low temperature. By increasing the growth temperatures, a compressed layer of epitaxial GaN can be formed on a Si substrate.
摘要翻译：提供了一种在硅（Si）和氮化镓（GaN）膜之间形成匹配的热膨胀界面的方法。该方法提供（111）Si衬底并且在压缩覆盖Si衬底上形成第一含铝（Al）的膜。在第一含Al膜中形成纳米柱孔，其暴露下面的Si衬底的区域。从暴露区域选择性地生长GaN层，覆盖第一含Al膜。使用横向纳米外延生长（LNEO）工艺生长GaN。重复上述过程，在压缩中形成第二含Al膜，在第二含Al膜中形成纳米柱孔，并选择性地生长第二GaN层。可以最初在低温下生长诸如Al 2 O 3 3，Si 1-x Ge x，InP，GaP，GaAs，AlN，AlGaN或GaN的膜材料。通过增加生长温度，可以在Si衬底上形成外延GaN的压缩层。

48. 发明申请

US20080171424A1 Epitaxial growth of GaN and SiC on silicon using nanowires and nanosize nucleus methodologies 审中-公开
标题翻译：使用纳米线和纳米尺度核方法在硅上外延生长GaN和SiC
公开(公告)号：US20080171424A1
公开(公告)日：2008-07-17
申请号：US11653802
申请日：2007-01-16
申请人： Tingkai Li , Jer-Shen Maa , Douglas J. Tweet , Wei-Wei Zhuang , Sheng Teng Hsu
发明人： Tingkai Li , Jer-Shen Maa , Douglas J. Tweet , Wei-Wei Zhuang , Sheng Teng Hsu
IPC分类号： H01L21/205
CPC分类号： H01L21/02513 , H01L21/02381 , H01L21/0245 , H01L21/02529 , H01L21/0254 , H01L21/02639 , H01L21/02647 , H01L21/0265
摘要： A method of fabricating a continuous layer of a defect sensitive material on a silicon substrate includes preparing a silicon substrate; forming a nanostructure array directly on the silicon substrate; depositing a selective growth enhancing layer on the substrate; smoothing the selective growth enhancing layer; and growing a continuous layer of the defect sensitive material on the nanostructure array.
摘要翻译：在硅衬底上制造缺陷敏感材料的连续层的方法包括制备硅衬底; 在硅衬底上直接形成纳米结构阵列; 在衬底上沉积选择性生长增强层; 平滑选择性生长增强层; 并在纳米结构阵列上生长不连续的缺陷敏感材料层。

49. 发明申请

US20080315255A1 Thermal Expansion Transition Buffer Layer for Gallium Nitride on Silicon 审中-公开
标题翻译：硅上氮化镓的热膨胀转变缓冲层
公开(公告)号：US20080315255A1
公开(公告)日：2008-12-25
申请号：US12199144
申请日：2008-08-27
申请人： Jer-Shen Maa , Tingkai Li , Douglas J. Tweet , Gregory M. Stecker , Sheng Teng Hsu
发明人： Jer-Shen Maa , Tingkai Li , Douglas J. Tweet , Gregory M. Stecker , Sheng Teng Hsu
IPC分类号： H01L29/267
CPC分类号： H01L29/267 , H01L21/02381 , H01L21/02433 , H01L21/0245 , H01L21/02458 , H01L21/02502 , H01L21/0251 , H01L21/0254 , H01L21/02656 , H01L29/045 , H01L29/2003
摘要： A method is provided for forming a matching thermal expansion interface between silicon (Si) and gallium nitride (GaN) films. The method provides a (111) Si substrate with a first thermal expansion coefficient (TEC), and forms a silicon-germanium (SiGe) film overlying the Si substrate. A buffer layer is deposited overlying the SiGe film. The buffer layer may be aluminum nitride (AlN) or aluminum-gallium nitride (AlGaN). A GaN film is deposited overlying the buffer layer having a second TEC, greater than the first TEC. The SiGe film has a third TEC, with a value in between the first and second TECs. In one aspect, a graded SiGe film may be formed having a Ge content ratio in a range of about 0% to 50%, where the Ge content increases with the graded SiGe film thickness.
摘要翻译：提供了一种在硅（Si）和氮化镓（GaN）膜之间形成匹配的热膨胀界面的方法。该方法提供具有第一热膨胀系数（TEC）的（111）Si衬底，并且形成覆盖Si衬底的硅 - 锗（SiGe）膜。沉积SiGe膜上的缓冲层。缓冲层可以是氮化铝（AlN）或铝 - 氮化镓（AlGaN）。沉积GaN缓冲层，其具有大于第一TEC的第二TEC。 SiGe电影拥有第三个TEC，其值在第一和第二TEC之间。一方面，可以形成具有Ge含量比在约0％至50％的范围内的等级SiGe膜，其中Ge含量随着梯度SiGe膜厚度而增加。

50. 发明申请

US20080173895A1 Gallium nitride on silicon with a thermal expansion transition buffer layer 审中-公开
标题翻译：具有热膨胀过渡缓冲层的硅上的氮化镓
公开(公告)号：US20080173895A1
公开(公告)日：2008-07-24
申请号：US11657149
申请日：2007-01-24
申请人： Jer-Shen Maa , Tingkai Li , Douglas J. Tweet , Gregory M. Stecker , Sheng Teng Hsu
发明人： Jer-Shen Maa , Tingkai Li , Douglas J. Tweet , Gregory M. Stecker , Sheng Teng Hsu
IPC分类号： H01L29/267 , H01L21/20
CPC分类号： H01L29/267 , H01L21/02381 , H01L21/02433 , H01L21/0245 , H01L21/02458 , H01L21/02502 , H01L21/0251 , H01L21/0254 , H01L21/02656 , H01L29/045 , H01L29/2003
摘要： A method is provided for forming a matching thermal expansion interface between silicon (Si) and gallium nitride (GaN) films. The method provides a (111) Si substrate with a first thermal expansion coefficient (TEC), and forms a silicon-germanium (SiGe) film overlying the Si substrate. A buffer layer is deposited overlying the SiGe film. The buffer layer may be aluminum nitride (AlN) or aluminum-gallium nitride (AlGaN). A GaN film is deposited overlying the buffer layer having a second TEC, greater than the first TEC. The SiGe film has a third TEC, with a value in between the first and second TECs. In one aspect, a graded SiGe film may be formed having a Ge content ratio in a range of about 0% to 50%, where the Ge content increases with the graded SiGe film thickness.
摘要翻译：提供了一种在硅（Si）和氮化镓（GaN）膜之间形成匹配的热膨胀界面的方法。该方法提供具有第一热膨胀系数（TEC）的（111）Si衬底，并且形成覆盖Si衬底的硅 - 锗（SiGe）膜。沉积SiGe膜上的缓冲层。缓冲层可以是氮化铝（AlN）或铝 - 氮化镓（AlGaN）。沉积GaN缓冲层，其具有大于第一TEC的第二TEC。 SiGe电影拥有第三个TEC，其值在第一和第二TEC之间。一方面，可以形成具有Ge含量比在约0％至50％的范围内的等级SiGe膜，其中Ge含量随着梯度SiGe膜厚度而增加。

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