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41. 发明授权

US08240185B2 Method for manufacturing cover of electronic device and cover obtained thereby 失效
标题翻译：制造电子装置盖的方法和由此得到的盖
公开(公告)号：US08240185B2
公开(公告)日：2012-08-14
申请号：US12495685
申请日：2009-06-30
申请人： Feng Jin , Gen-Ping Deng , Chun-Chi Chen
发明人： Feng Jin , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： B21D41/00 , B23D23/00
CPC分类号： B21D19/08 , Y10T29/49828
摘要： A method for manufacturing a cover of an electronic device includes steps of offering a metallic green piece comprising a top plate, a bottom plate and a connecting plate interconnecting a side of the top and bottom plates; offering a profile molding insert and a lower mold, the profile molding insert forming a shaping surface, the lower mold defining a cavity to receive an end of the green piece; putting the profile molding insert in the green piece, the shaping surface of the profiling molding insert being oriented towards the end of the green piece; inserting the end of the green piece in the cavity of the lower mold and punching the lower mold to enable the top and bottom plates at the end of the green piece bent along the shaping surface of the profile molding insert toward each other.
摘要翻译：一种用于制造电子设备的盖的方法，包括提供金属绿色部件的步骤，所述金属生片包括顶板，底板和互连顶板和底板侧的连接板; 提供型材成型插入件和下模具，所述型材成形插入件形成成形表面，所述下模具限定用于接收所述生坯件的端部的空腔; 将型材成型插入件放入绿色件中，成型模制插入件的成形表面朝着绿色件的端部定向; 将生坯件的端部插入下模具的腔体中并冲压下模具，使得在成型件的端部处的顶板和底板沿着型材成型件的成形表面彼此朝向彼此弯曲。

42. 发明授权

US08004843B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US08004843B2
公开(公告)日：2011-08-23
申请号：US12565712
申请日：2009-09-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen
发明人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components.
摘要翻译：散热装置用于散发由安装在印刷电路板上并具有不同高度的多个电子部件产生的热量。散热装置包括连接构件和安装在连接构件上并位于上述一个电子部件上的第一基座。多个连接构件延伸穿过印刷电路板并与第一基座接合以在印刷电路板上的电子部件之一上组装第一基座。第一基座和电子部件之间的距离可通过调节连接部件来调节，以使第一基座与电子部件之一紧密接触。

43. 发明授权

US07914152B2 Portable projector using an LED and related heat dissipation system 失效
标题翻译：便携式投影机采用LED和相关散热系统
公开(公告)号：US07914152B2
公开(公告)日：2011-03-29
申请号：US12024955
申请日：2008-02-01
申请人： Xu Li , Gen-Ping Deng , Chun-Chi Chen
发明人： Xu Li , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： G03B21/16
CPC分类号： G03B21/16 , G03B21/20 , G03B21/2033
摘要： A portable projector with a heat dissipation system, includes a housing and two LED light sources located in the housing. Each of the LED light sources includes a circuit aboard, an LED device mounted on the circuit aboard and a heat pipe. The heat pipe has an evaporating section thermally contacting the circuit board, and a condensing section. A fin set thermally contacts with the condensing section of the heat pipe for dissipating heat therefrom. The fin set of one LED light source is located behind the evaporating section of the heat pipe of the other light source and closely adjacent to a wall of the housing.
摘要翻译：具有散热系统的便携式投影仪包括壳体和位于壳体中的两个LED光源。每个LED光源包括一个电路，一个安装在电路上的LED装置和一个热管。热管具有与电路板热接触的蒸发部分和冷凝部分。翅片组与热管的冷凝部分热接触以从其中散热。一个LED光源的翅片组位于另一光源的热管的蒸发部分的后面，并且紧邻壳体的壁。

44. 发明授权

US07898809B2 Heat sink and method of manufacturing the same 有权
标题翻译：散热器及其制造方法
公开(公告)号：US07898809B2
公开(公告)日：2011-03-01
申请号：US12252373
申请日：2008-10-16
申请人： Yi-Jiun Li , Peng Liu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Yi-Jiun Li , Peng Liu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , H01L21/4882 , H01L2924/0002 , H01L2924/3011 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.
摘要翻译：散热器包括基板和从基板向上延伸的多个圆柱形销。圆柱销每个包括上消散部分，下安装部分和消散部分和安装部分之间的接合部分。安装部分周向地装配在基板的相应孔的下部中。接合部的直径小于安装部的直径。接合部分被基板的内壁夹住，通过在对应的孔的边缘处向下冲压基板的上表面来限定基板的相应孔的上部。

45. 发明授权

US07869217B2 Toolless locking device 失效
标题翻译：无工具锁定装置
公开(公告)号：US07869217B2
公开(公告)日：2011-01-11
申请号：US12202391
申请日：2008-09-01
申请人： Chun-Chi Chen , Hong-Cheng Yang , Jin-Biao Liu , He-Ping Liu
发明人： Chun-Chi Chen , Hong-Cheng Yang , Jin-Biao Liu , He-Ping Liu
IPC分类号： H05K7/20 , H01L23/40
CPC分类号： H01L23/4093 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located aside the heat sink, a foot portion located aside a second face of the printed circuit board, and a body portion extending through the holes of the heat sink and the printed circuit board and interconnecting the head portion and the foot portion. The foot portion includes a buckling part abutting against the second face of the printed circuit board, and a positioning part extending towards the head portion to a position above the buckling part. When the buckling part abuts against the printed circuit board, the positioning part has a portion thereof entering into the first hole.
摘要翻译：锁定装置用于将散热器固定到安装在限定第一孔的印刷电路板的第一面上的电子装置上。散热片在其中限定第二个孔。锁定装置具有紧固件，该紧固件包括位于散热器的头部的部分，位于印刷电路板的第二面的脚部以及延伸穿过散热器和印刷电路板的孔的主体部分，头部和脚部。脚部包括抵靠印刷电路板的第二面的压曲部，以及朝向头部延伸到屈曲部上方的位置的定位部。当屈曲部分抵靠印刷电路板时，定位部分的一部分进入第一孔。

46. 发明申请

US20100034309A1 MULTIPLE INPUT MULTIPLE OUTPUT ANTENNA SYSTEM, SIGNAL TRANSMISSION METHOD, SIGNAL TRANSMISSION APPARATUS, AND COMPUTER PROGRAM PRODUCT FOR THE MULTIPLE INPUT MULTIPLE OUTPUT ANTENNA SYSTEM 有权
标题翻译：多输入多输出天线系统，信号传输方法，信号传输装置和多输入多输出天线系统的计算机程序产品
公开(公告)号：US20100034309A1
公开(公告)日：2010-02-11
申请号：US12349248
申请日：2009-01-06
申请人： Hsuan-Jung Su , Wei-Shun Liao , Chia-Yi Huang , Chun-Chi Chen , Kun-Hung Lee
发明人： Hsuan-Jung Su , Wei-Shun Liao , Chia-Yi Huang , Chun-Chi Chen , Kun-Hung Lee
IPC分类号： H04B7/02
CPC分类号： H04B7/0413
摘要： A multiple input multiple output (MIMO) antenna system, a signal transmission method, a signal transmission apparatus and a computer program product for the MIMO antenna system are provided. The signal transmission method comprises the following steps of transmitting a signal with a first signal transmission mode and a first transmission power via a signal transmission channel; receiving a signal to noise ratio (SNR) of the signal; receiving an interference value of the signal transmission channel; obtaining a power weight value according to the interference value; determining a system threshold of the signal transmission channel to the SNR of the signal; determining a second signal transmission mode of the signal transmission channel based on the system threshold; and determining a second transmission power of the signal transmission channel according to the power weight value.
摘要翻译：提供了一种用于MIMO天线系统的多输入多输出（MIMO）天线系统，信号传输方法，信号传输装置和计算机程序产品。信号传输方法包括以下步骤：经由信号传输通道发送具有第一信号传输模式和第一传输功率的信号; 接收信号的信噪比（SNR）; 接收信号传输信道的干扰值; 根据干扰值获得功率权重值; 确定所述信号传输信道的系统阈值与所述信号的SNR; 基于系统阈值确定信号传输信道的第二信号传输模式; 以及根据所述功率权重值确定所述信号传输信道的第二传输功率。

47. 发明申请

US20090316362A1 HEAT DISSIPATION DEVICE HAVING AN IMPROVED FIN STRUCTURE 失效
标题翻译：具有改进的熔体结构的散热装置
公开(公告)号：US20090316362A1
公开(公告)日：2009-12-24
申请号：US12255663
申请日：2008-10-21
申请人： Wu Li , Yi-Qiang Wu , Chun-Chi Chen
发明人： Wu Li , Yi-Qiang Wu , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device adapted for dissipating heat from a heat-generating electronic element, includes a plurality of fins assembled together. Each of the fins has a rectangular body and four arch-shaped flanges extending from edges of the body to form four round corners in four corners of the body. Each main body of the fins defines a plurality of locking members thereon to engage with corresponding locking members of a corresponding front fin. The arch-shaped flanges in four respective corners of the fins cooperate with each other to form four arced faces in four corners of the assembled fins along an entire length of the assembled fins.
摘要翻译：适于从发热电子元件散热的散热装置包括组装在一起的多个翅片。每个翼片具有矩形主体和从主体的边缘延伸的四个拱形凸缘，以在主体的四个角部中形成四个圆角。翅片的每个主体在其上限定了多个锁定构件，以与对应的前鳍的对应的锁定构件接合。翅片的四个角部中的拱形凸缘彼此配合，以在装配的翅片的四个角部沿组装的翼片的整个长度形成四个弧形面。

48. 发明申请

US20090277615A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20090277615A1
公开(公告)日：2009-11-12
申请号：US12406082
申请日：2009-03-17
申请人： Wei Li , Yi-Qiang Wu , Chun-Chi Chen
发明人： Wei Li , Yi-Qiang Wu , Chun-Chi Chen
IPC分类号： F28D15/00 , F28D21/00
CPC分类号： H01L23/427 , F28D15/0266 , F28F1/32 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a substrate, a fin assembly located on the substrate, a plurality of heat pipes connecting the substrate and the fin assembly, and a fan fixed on the substrate by a clip. The fin assembly includes a first fin unit, a second fin unit, and a third fin unit. The third fin unit is located on the substrate, the second fin unit is located on the third fin unit, and the first fin unit is located on the first fin unit. A receiving space is defined in the second and third fin unit. The fan is received in the receiving space and spaced apart from the fin assembly.
摘要翻译：散热装置包括基板，位于基板上的翅片组件，连接基板和翅片组件的多个热管，以及通过夹子固定在基板上的风扇。翅片组件包括第一翅片单元，第二翅片单元和第三翅片单元。第三鳍单元位于基板上，第二鳍单元位于第三鳍单元上，第一鳍单元位于第一鳍单元上。在第二和第三鳍单元中限定接收空间。风扇被容纳在接收空间中并与翅片组件间隔开。

49. 发明授权

US07609522B2 Heat sink assembly 失效
标题翻译：散热器组件
公开(公告)号：US07609522B2
公开(公告)日：2009-10-27
申请号：US11566020
申请日：2006-12-01
申请人： Zhao Jin , Jun Cao , Shi-wen Zhou , Chun-Chi Chen
发明人： Zhao Jin , Jun Cao , Shi-wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/4006 , F28F3/02 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly (10) compatible with an ATX motherboard (20) and a BTX motherboard (30), includes a heat sink and a plurality of fasteners (15) extending through the heat sink. The heat sink includes a base (12) defining a slot (1220) therein. The fastener is capable of sliding along the slot between a first position to a second position to make the heat sink assembly in accordance with the preferred embodiment of the present invention to be adapted for use with the ATX motherboard or the BTX motherboard.
摘要翻译：与ATX母板（20）和BTX母板（30）兼容的散热器组件（10）包括散热器和延伸穿过散热器的多个紧固件（15）。散热器包括在其中限定狭槽（1220）的基部（12）。紧固件能够在第一位置与第二位置之间沿狭槽滑动，以使得根据本发明的优选实施例的散热器组件适于与ATX主板或BTX主板一起使用。

50. 发明授权

US07537046B2 Heat dissipation device with heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US07537046B2
公开(公告)日：2009-05-26
申请号：US11695462
申请日：2007-04-02
申请人： Dong-Bo Zheng , Lei Cao , Meng Fu , Chun-Chi Chen
发明人： Dong-Bo Zheng , Lei Cao , Meng Fu , Chun-Chi Chen
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base (10) for thermally engaging with an electronic device and a plurality of fins (320) arranged on the base (10). A heat pipe (52) thermally connects the fins (320) and the base (10) for transferring heat from the base (10) to the fins (320). The heat pipe (52) comprises an evaporation section (521) sandwiched between the base (10) and the fins (320), two condensation sections (525, 526) parallel to the evaporation section (521) and thermally engaging with the fins (320), and two connecting sections (527, 528) interconnecting corresponding condensation sections (525, 526) and the evaporation section (521). The connecting sections (527, 528) form an included angle therebetween. The condensation sections (525, 526) are spaced from and extend toward each other.
摘要翻译：散热装置包括用于与电子设备热接合的基座（10）和布置在基座（10）上的多个翅片（320）。热管（52）热连接翅片（320）和底座（10），用于将热量从基座（10）传送到散热片（320）。热管（52）包括夹在基座（10）和翅片（320）之间的蒸发部分（521），与蒸发部分（521）平行的两个冷凝部分（525,526），并与翅片 320）和互连相应的冷凝部分（525,526）和蒸发部分（521）的两个连接部分（527,528）。连接部分（527,528）在它们之间形成夹角。冷凝部分（525,526）彼此间隔开并且彼此延伸。

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