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    • 46. 发明申请
    • RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN
    • 耐蚀组合物和形成耐力图案的方法
    • US20090226842A1
    • 2009-09-10
    • US12400203
    • 2009-03-09
    • Hiroaki ShimizuYasuhiro YoshiiYoshiyuki UtumiHideo Hada
    • Hiroaki ShimizuYasuhiro YoshiiYoshiyuki UtumiHideo Hada
    • G03F7/20G03F7/027
    • G03F7/0045G03F7/0046G03F7/0397G03F7/2041
    • A resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the acid-generator component (B) including an acid generator (B1) consisting of a compound represented by general formula (b1) shown below (wherein Q1 represents a divalent linkage group containing an oxygen atom; Y1 represents a fluorinated alkylene group of 1 to 4 carbon atoms which may have a substituent, with the proviso that the carbon atom adjacent to the sulfur atom within the —SO3− group has a fluorine atom bonded thereto; X represents a hydrocarbon group of 3 to 30 carbon atoms which may have a substituent; and A+ represents an organic cation), and the resist composition further including an organic compound (C) which generates an acid exhibiting a weaker acid strength than the acid generated from the acid generator (B1) upon exposure. [Chemical Formula 1] X-Q1Y1—SO3+A3   (b1)
    • 一种抗蚀剂组合物,其包含在酸的作用下在碱性显影液中溶解度变化的碱成分(A)和曝光时产生酸的酸发生剂成分(B),所述酸发生剂成分(B)含有酸发生剂 (b1)由下述通式(b1)表示的化合物(其中Q1表示含有氧原子的二价连接基团; Y1表示可具有取代基的1〜4个碳原子的氟化亚烷基,条件是 与-SO 3 - 基中的硫原子相邻的碳原子具有氟原子键合; X表示可以具有取代基的碳原子数3〜30的烃基,A +表示有机阳离子),抗蚀剂 组合物还包含有机化合物(C),该有机化合物(C)在曝光时产生的酸强度比酸产生剂(B1)产生的酸弱。 <?in-line-formula description =“In-line Formulas”end =“lead”?> [化学式1] <?in-line-formula description =“In-line formula”end =“tail”?> ?in-line-formula description =“In-line Formulas”end =“lead”?> X-Q1Y1-SO3 + A3(b1)<?in-line-formula description =“In-line Formulas”end =“tail “?>
    • 49. 发明授权
    • Compound, positive resist composition and resist pattern forming method
    • 化合物,正光刻胶组合物和抗蚀剂图案形成方法
    • US08389197B2
    • 2013-03-05
    • US11994602
    • 2006-06-30
    • Takako HirosakiDaiju ShionoTaku HirayamaHideo Hada
    • Takako HirosakiDaiju ShionoTaku HirayamaHideo Hada
    • G03F7/004G03F7/039G03F7/20G03F7/30
    • G03F7/0397C07C67/343C07C69/712C07C2603/74G03F7/0045
    • The present invention provides a positive resist composition and a resist pattern forming method that are capable of forming a resist pattern with a reduced level of roughness. The positive resist composition includes the compound represented by the general formula (I) below. The present invention also provides the resist pattern forming method using the positive resist composition above. [wherein, in formula (I), R11 and R12 each represents, independently, an alkyl group of 1 to 10 carbon atoms or an aromatic hydrocarbon group, and may include a hetero atom in the structure thereof; R21 to R24 each represents, independently, a hydrogen atom or an acid dissociable, dissolution inhibiting group, and two of the R21 to R24 represents a hydrogen atom and the others represents an acid dissociable, dissolution inhibiting group; X is a group represented by general formulas (Ia) or (Ib) below].
    • 本发明提供能够形成具有降低的粗糙度的抗蚀剂图案的正型抗蚀剂组合物和抗蚀剂图案形成方法。 正型抗蚀剂组合物包括由下述通式(I)表示的化合物。 本发明还提供了使用上述正型抗蚀剂组合物的抗蚀剂图案形成方法。 式(I)中,R 11和R 12分别独立地表示1〜10个碳原子的烷基或芳香族烃基,其结构中可以含有杂原子; R21〜R24各自独立地表示氢原子或酸解离的溶解抑制基团,R21〜R24中的两个表示氢原子,其余表示酸解离,溶解抑制基团。 X为下述通式(Ia)或(Ib)表示的基团。
    • 50. 发明授权
    • Materials for photoresist, photoresist composition and method of forming resist pattern
    • 用于光致抗蚀剂的材料,光致抗蚀剂组合物和形成抗蚀剂图案的方法
    • US07910284B2
    • 2011-03-22
    • US11838951
    • 2007-08-15
    • Kyoko KojimaHideo HadaDaiju Shiono
    • Kyoko KojimaHideo HadaDaiju Shiono
    • G03F7/004G03F7/30C07C63/00C07C43/23
    • C07C39/17C07C39/15G03F7/0382Y10S430/106
    • To overcome the problem that a device performance is degraded by the edge roughness of a photoresist pattern, a mixture of polynuclear phenol compounds having, in one molecule, 0 to 6 functional groups which are chemically converted due to actions of an acid with the solubility in an alkaline developer reduced is used as a material for photoresist. In the mixture, two or more triphenyl methane structures are bonded to portions other than the functional group in the nonconjugated state. Furthermore, the mixture comprises polynuclear compounds with the average number of functional groups of 2.5 or below and includes the polynuclear compounds not having any functional group per molecule by 15% or less in the term of weight ratio, and the polynuclear phenol compounds having 3 or more functional groups per molecule by 40% or less.
    • 为了克服由光致抗蚀剂图案的边缘粗糙度降低器件性能的问题,在一分子中具有0至6个官能团的多核酚化合物的混合物,其由于酸的作用而具有溶解度而化学转化 还原的碱性显影剂被用作光致抗蚀剂的材料。 在该混合物中,在非共轭状态下,将两个以上的三苯基甲烷结构键合至官能团以外的部分。 此外,该混合物包含平均官能团数为2.5或更低的多核化合物,并且包括在重量比方面每分子不具有15%或更少的任何官能团的多核化合物,并且多核苯酚化合物具有3或 每个分子更多的官能团减少40%以下。