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    • 50. 发明申请
    • COMPENSATION TECHNIQUES FOR SUBSTRATE HEATING PROCESSES
    • 基板加热工艺补偿技术
    • US20080118641A1
    • 2008-05-22
    • US11561851
    • 2006-11-20
    • Joseph M. RanishBruce E. Adams
    • Joseph M. RanishBruce E. Adams
    • C23C16/46C21D1/34
    • C23C16/46C21D1/34
    • Methods for compensating for a thermal profile in a substrate heating process are provided herein. In one embodiment, a method of processing a substrate includes determining an initial thermal profile of a substrate resulting from a process; imposing a compensatory thermal profile on the substrate based on the initial thermal profile; and performing the process to create a desired thermal profile on the substrate. In other embodiments of the invention, the initial substrate thermal profile is compensated for by adjusting a local mass heated per unit area, a local heat capacity per unit area, or an absorptivity or reflectivity of a component proximate the substrate prior to performing the process. In another embodiment, the heat provided by an edge ring to the substrate may be controlled either prior to or during the substrate heating process.
    • 本文提供了补偿基板加热过程中的热分布的方法。 在一个实施例中,处理衬底的方法包括确定由工艺产生的衬底的初始热分布; 基于初始热分布在衬底上施加补偿热分布; 并执行该过程以在衬底上产生期望的热分布。 在本发明的其它实施例中,通过在执行该过程之前通过调整每单位面积加热的局部质量,每单位面积的局部热容量或靠近该衬底的组分的吸收率或反射率来补偿初始衬底热分布。 在另一个实施例中,由边缘环向衬底提供的热量可以在衬底加热过程之前或期间被控制。