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1. 发明申请

US20080214014A1 ABSORBER LAYER CANDIDATES AND TECHNIQUES FOR APPLICATION 有权
标题翻译：吸收层应用的候选和技术
公开(公告)号：US20080214014A1
公开(公告)日：2008-09-04
申请号：US11681343
申请日：2007-03-02
申请人： JOSEPH M. RANISH , Bruce E. Adams
发明人： JOSEPH M. RANISH , Bruce E. Adams
IPC分类号： H01L21/31 , H01L51/40 , H01L21/469 , B05D3/02
CPC分类号： H01L21/67115 , H01L21/26513 , H01L21/268 , H01L21/2686 , H01L21/324 , H01L21/6715 , H01L29/66575
摘要： The present invention generally provides an absorber layer using carbon based materials with increased and stabled thermal absorption coefficient and economical methods to produce such an absorber layer. One embodiment of the present invention provides a method for processing a substrate comprising depositing an absorber layer on a top surface of the substrate, wherein the substrate is maintained under a first temperature, annealing the substrate in a thermal processing chamber, wherein the substrate is heated to a second temperature, and the second temperature is higher than the first temperature, and removing the absorber layer from the substrate.
摘要翻译：本发明通常提供一种使用具有增加和稳定的热吸收系数的碳基材料和生产这种吸收层的经济方法的吸收层。本发明的一个实施方案提供了一种处理衬底的方法，包括在衬底的顶表面上沉积吸收层，其中将衬底保持在第一温度下，在热处理室中退火衬底，其中衬底被加热到第二温度，第二温度高于第一温度，并且从基板除去吸收体层。

2. 发明申请

US20100023154A1 COMPENSATION TECHNIQUES FOR SUBSTRATE HEATING PROCESSES 有权
标题翻译：基板加热工艺补偿技术
公开(公告)号：US20100023154A1
公开(公告)日：2010-01-28
申请号：US12573139
申请日：2009-10-04
申请人： JOSEPH M. RANISH , BRUCE E. ADAMS
发明人： JOSEPH M. RANISH , BRUCE E. ADAMS
IPC分类号： G05D23/19 , C23C16/02 , C21D1/34 , G06F17/00
CPC分类号： C23C16/46 , C21D1/34
摘要： Methods for compensating for a thermal profile in a substrate heating process are provided herein. In some embodiments, a method of processing a substrate includes determining an initial thermal profile of a substrate that would result from subjecting the substrate to a process; determining a compensatory thermal profile based upon the initial thermal profile and a desired thermal profile; imposing the compensatory thermal profile on the substrate prior to performing the process on the substrate; and performing the process to create the desired thermal profile on the substrate. The initial substrate thermal profile can also be compensated for by adjusting a local mass heated per unit area, a local heat capacity per unit area, or an absorptivity or reflectivity of a component proximate the substrate prior to performing the process. Heat provided by an edge ring to the substrate may be controlled prior to or during the substrate heating process.
摘要翻译：本文提供了补偿基板加热过程中的热分布的方法。在一些实施例中，处理衬底的方法包括确定由衬底经受过程而导致的衬底的初始热分布; 基于初始热分布和期望的热分布确定补偿热分布; 在对衬底进行处理之前在衬底上施加补偿热分布; 并执行该过程以在衬底上产生所需的热分布。也可以通过调整在每单位面积加热的局部质量，每单位面积的局部热容量，或者在执行该过程之前靠近该衬底的部件的吸收性或反射率来补偿初始衬底热分布。由边缘环向衬底提供的热量可以在衬底加热过程之前或期间被控制。

3. 发明申请

US20080145038A1 METHOD AND APPARATUS FOR HEATING A SUBSTRATE 审中-公开
标题翻译：用于加热基材的方法和装置
公开(公告)号：US20080145038A1
公开(公告)日：2008-06-19
申请号：US11611680
申请日：2006-12-15
申请人： JOSEPH M. RANISH , Bruce E. Adams , Aaron M. Hunter
发明人： JOSEPH M. RANISH , Bruce E. Adams , Aaron M. Hunter
IPC分类号： F26B3/28
CPC分类号： H01L21/67103 , H01L21/67098 , H01L21/67109 , H01L21/68714
摘要： A method and apparatus for heating a substrate is provided herein. In one embodiment, a substrate heater includes a vessel having an upper member including a top surface for supporting a substrate thereon; a liquid disposed within and partially filling the vessel; and a heat source for providing sufficient heat to the liquid to boil the liquid. Optionally, a pressure controller for regulating the pressure within the vessel may be provided. The substrate is heated by first placing the substrate on the support surface of the vessel of the substrate heater. The liquid contained in the vessel is then boiled. As the liquid is boiling, a uniform film of heated condensation is deposited on a bottom side of the support surface. The heated condensation heats the support surface which in turn, heats the substrate.
摘要翻译：本文提供了一种用于加热衬底的方法和装置。在一个实施例中，衬底加热器包括具有上部构件的容器，所述上部构件包括用于在其上支撑衬底的顶表面; 设置在容器内并部分填充容器的液体; 以及用于向液体提供足够的热量以使液体沸腾的热源。可选地，可以提供用于调节容器内的压力的压力控制器。首先将基板放置在基板加热器的容器的支撑表面上来加热基板。然后将包含在容器中的液体煮沸。当液体沸腾时，在支撑表面的底侧上沉积有均匀的加热冷凝膜。加热的冷凝会加热支撑表面，从而加热基板。

4. 发明申请

US20080142208A1 METHOD AND APPARATUS FOR HEATING A SUBSTRATE 审中-公开
公开(公告)号：US20080142208A1
公开(公告)日：2008-06-19
申请号：US11611704
申请日：2006-12-15
申请人： JOSEPH M. RANISH , Bruce E. Adams , Aaron M. Hunter
发明人： JOSEPH M. RANISH , Bruce E. Adams , Aaron M. Hunter
IPC分类号： H01L21/00 , H05B3/02 , F28D15/02 , F28F27/00
CPC分类号： H01L21/67109 , F28D15/02 , F28D15/06 , F28D2021/0077 , F28F13/14 , F28F13/185
摘要： A method and apparatus for heating a substrate is provided herein. In one embodiment, a substrate heater includes a vessel having an upper member including a top surface for supporting a substrate thereon; a liquid disposed within and partially filling the vessel; and a heat source for providing sufficient heat to the liquid to boil the liquid. Optionally, a pressure controller for regulating the pressure within the vessel may be provided. The substrate is heated by first placing the substrate on the support surface of the vessel of the substrate heater. The liquid contained in the vessel is then boiled. As the liquid is boiling, a uniform film of heated condensation is deposited on a bottom side of the support surface. The heated condensation heats the support surface which in turn, heats the substrate.

5. 发明申请

US20130055952A1 REFLECTIVE DEPOSITION RINGS AND SUBSTRATE PROCESSING CHAMBERS INCORPORTING SAME 有权
标题翻译：反射沉积环和与其同时进行的基板处理室
公开(公告)号：US20130055952A1
公开(公告)日：2013-03-07
申请号：US13598828
申请日：2012-08-30
申请人： ANANTHA K. SUBRAMANI , JOSEPH M. RANISH , XIAOXIONG YUAN , ASHISH GOEL , JOUNG JOO LEE
发明人： ANANTHA K. SUBRAMANI , JOSEPH M. RANISH , XIAOXIONG YUAN , ASHISH GOEL , JOUNG JOO LEE
IPC分类号： H01L21/461 , B23Q3/00
CPC分类号： H01L21/67115 , C23C14/541 , C23C16/481 , H01L21/67248 , H01L21/68735 , H01L21/68742
摘要： Apparatus for improving temperature uniformity across a substrate are provided herein. In some embodiments, a deposition ring for use in a substrate processing system to process a substrate may include an annular body having a first surface, an opposing second surface, and a central opening passing through the first and second surfaces, wherein the second surface is configured to be disposed over a substrate support having a support surface to support a substrate having a given width, and wherein the opening is sized to expose a predominant portion of the support surface; and wherein the first surface includes at least one reflective portion configured to reflect heat energy toward a central axis of the annular body, wherein the at least one reflective portion has a surface area that is about 5 to about 50 percent of a total surface area of the first surface.
摘要翻译：本文提供了用于提高基板上的温度均匀性的装置。在一些实施例中，用于处理衬底的衬底处理系统中的沉积环可以包括具有第一表面，相对的第二表面和穿过第一表面和第二表面的中心开口的环形体，其中第二表面是被配置为设置在具有支撑表面的基板支撑件上，以支撑具有给定宽度的基板，并且其中所述开口的尺寸设定成暴露所述支撑表面的主要部分; 并且其中所述第一表面包括至少一个反射部分，所述至少一个反射部分构造成朝向所述环形体的中心轴线反射热能，其中所述至少一个反射部分的表面积为所述环形体的总表面积的约5至约50％第一个表面。

6. 发明申请

US20100059497A1 RAPID THERMAL PROCESSING LAMPHEAD WITH IMPROVED COOLING 有权
标题翻译：具有改进冷却功能的快速热处理灯
公开(公告)号：US20100059497A1
公开(公告)日：2010-03-11
申请号：US12207711
申请日：2008-09-10
申请人： JOSEPH M. RANISH , KHURSHED SORABJI , KEDARNATH SANGAM , ALEXANDER LERNER
发明人： JOSEPH M. RANISH , KHURSHED SORABJI , KEDARNATH SANGAM , ALEXANDER LERNER
IPC分类号： F27B5/14
CPC分类号： F27B17/0025 , F27D5/0037 , F27D21/0014 , H01L21/67109 , H01L21/67115
摘要： Embodiments of a lamphead and apparatus utilizing same are provided herein. In some embodiments, a lamphead for use in thermal processing may include a monolithic member having a plurality of coolant passages and a plurality of lamp passages and reflector cavities, wherein each lamp passage is configured to accommodate a lamp and each reflector cavity is shaped to act as a reflector or to receive a replaceable reflector for the lamp, and wherein the plurality of coolant passages are disposed proximate to the plurality of lamp passages; and at least one heat transfer member extending from the monolithic member into each coolant passage. In some embodiments, the lamphead may be disposed in an apparatus comprising a process chamber having a substrate support, wherein the lamphead is positioned to provide energy to the substrate support.
摘要翻译：本发明提供了一种灯头及其使用装置的实施例。在一些实施例中，用于热处理的灯头可以包括具有多个冷却剂通道和多个灯通道和反射器腔的整体构件，其中每个灯通道被配置成容纳灯，并且每个反射器空腔成形为能够起作用作为反射器或接收用于灯的可更换反射器，并且其中所述多个冷却剂通道设置成靠近所述多个灯通道; 以及至少一个传热构件，其从所述整体构件延伸到每个冷却剂通道中。在一些实施例中，灯头可以设置在包括具有基板支撑件的处理室的设备中，其中灯头被定位成向基板支撑件提供能量。

7. 发明申请

US20120270168A1 LAMPHEAD ATMOSPHERE 有权
标题翻译： LAMPHEAD大气
公开(公告)号：US20120270168A1
公开(公告)日：2012-10-25
申请号：US13445543
申请日：2012-04-12
申请人： JOSEPH M. RANISH
发明人： JOSEPH M. RANISH
IPC分类号： F27B5/16 , F27D3/00
CPC分类号： F27B17/0025 , H01L21/67115 , Y02P10/122
摘要： A method and apparatus for thermal processing of semiconductor substrates is disclosed. Each lamp of a lamp assembly is immersed in a thermally conductive atmosphere comprising oxygen. As the lamps are operated, the oxygen reacts with carbon containing species. Consumed oxygen is replaced over time until the thermal conductivity of the atmosphere falls below a tolerance threshold. The atmosphere is then evacuated and replaced.
摘要翻译：公开了半导体衬底的热处理方法和装置。将灯组件的每个灯浸入包含氧气的导热气氛中。当灯被操作时，氧与含碳物质反应。消耗的氧气随时间被更换，直到大气的热导率降到公差阈值以下。然后将空气抽真空并更换。

8. 发明申请

US20100308729A1 LAMP WITH INTERNAL FUSE SYSTEM 有权
标题翻译：带内部保险丝系统的灯
公开(公告)号：US20100308729A1
公开(公告)日：2010-12-09
申请号：US12753532
申请日：2010-04-02
申请人： BALASUBRAMANIAN RAMACHANDRAN , NYI OO MYO , JOSEPH M. RANISH , AKIO TAKAHASHI
发明人： BALASUBRAMANIAN RAMACHANDRAN , NYI OO MYO , JOSEPH M. RANISH , AKIO TAKAHASHI
IPC分类号： H01K1/66 , H01K1/14
CPC分类号： H01K1/66
摘要： Embodiments of a lamp having an internal fuse system are provided herein. In some embodiments, a lamp may include a transparent housing; a filament disposed in the housing, the filament having a main body disposed between a first end and a second end of the filament; a first conductor coupled to the filament at the first end of the filament; a first interceptor bar disposed in the housing and beneath the main body of the filament, wherein the first interceptor bar is coupled to the second end of the filament; a second conductor disposed proximate the first end of the filament and conductively coupled to the second end of the filament via the first interceptor bar, wherein the first interceptor bar is positioned such that an electrical short forms between the first and second conductors when the main body of the filament contacts the first interceptor bar.
摘要翻译：本文提供具有内部熔丝系统的灯的实施例。在一些实施例中，灯可以包括透明外壳; 设置在所述壳体中的细丝，所述细丝具有设置在所述细丝的第一端和第二端之间的主体; 在灯丝的第一端处耦合到灯丝的第一导体; 设置在所述壳体中并在所述灯丝主体下方的第一拦截棒，其中所述第一拦截杆连接到所述灯丝的第二端; 第二导体，其设置在灯丝的第一端附近并且经由第一拦截棒与导电丝的第二端导电连接，其中第一拦截棒被定位成使得当主体的灯丝接触第一拦截棒。

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