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41. 发明授权

US08138085B2 Laser annealing for 3-D chip integration 有权
标题翻译：激光退火3-D芯片集成
公开(公告)号：US08138085B2
公开(公告)日：2012-03-20
申请号：US13093798
申请日：2011-04-25
申请人： Howard H. Chen , Louis C. Hsu , Lawrence S. Mok , J. Campbell Scott
发明人： Howard H. Chen , Louis C. Hsu , Lawrence S. Mok , J. Campbell Scott
IPC分类号： H01L21/44
CPC分类号： H01L21/324 , H01L21/268 , H01L24/01 , H01L25/0657 , H01L27/0688 , H01L2225/06513 , H01L2225/06541 , H01L2924/14 , H01L2924/00
摘要： A laser annealing method for annealing a stacked semiconductor structure having at least two stacked layers is disclosed. A laser beam is focused on a lower layer of the stacked layers. The laser beam is then scanned to anneal features in the lower layer. The laser beam is then focused on an upper layer of the stacked layers, and the laser beam is scanned to anneal features in the upper layer. The laser has a wavelength of less than one micrometer. The beam size, depth of focus, energy dosage, and scan speed of the laser beam are programmable. Features in the lower layer are offset from features in the upper layer such that these features do not overlap along a plane parallel to a path of the laser beam. Each of the stacked layers includes active devices, such as transistors. Also, the first and second layers may be annealed simultaneously.
摘要翻译：公开了一种用于退火具有至少两个堆叠层的层叠半导体结构的激光退火方法。激光束聚焦在堆叠层的下层。然后扫描激光束以退火下层中的特征。然后将激光束聚焦在堆叠层的上层上，并且激光束被扫描以退火上层中的特征。激光器的波长小于1微米。激光束的光束尺寸，焦深，能量投射和扫描速度是可编程的。较低层中的特征偏离上层中的特征，使得这些特征不沿着与激光束的路径平行的平面重叠。堆叠层中的每一个包括诸如晶体管的有源器件。此外，第一层和第二层可以同时退火。

42. 发明授权

US07888786B2 Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device 有权
标题翻译：电子模块包括形成在微通道冷却装置上的存储器和集成电路处理器芯片
公开(公告)号：US07888786B2
公开(公告)日：2011-02-15
申请号：US11735155
申请日：2007-04-13
申请人： Paul S. Andry , Evan G. Colgan , Lawrence S. Mok , Chirag S. Patel , David E. Seeger
发明人： Paul S. Andry , Evan G. Colgan , Lawrence S. Mok , Chirag S. Patel , David E. Seeger
IPC分类号： H01L23/473 , H01L23/52
CPC分类号： H01L23/473 , H01L25/0657 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2225/06517 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/15311 , H01L2224/0401
摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.
摘要翻译：提供了用于将微通道冷却模块集成在包括多个高性能IC芯片的高密度电子模块（例如，芯片封装，系统级封装模块等）中的装置和方法。电子模块被设计成使得高性能（大功率）IC芯片被布置成靠近集成冷却模块（或冷却板）以有效地提取热量。此外，包括具有多个芯片面的大表面积硅载体的电子模块被设计成使得集成的硅冷却模块刚性地结合到这种芯片的背面以增加硅载体的结构完整性。

43. 发明授权

US07856711B2 Method of forming a substrate with interposer channels for cooling the substrate 有权
标题翻译：用于具有用于冷却衬底的中介层通道形成衬底的方法
公开(公告)号：US07856711B2
公开(公告)日：2010-12-28
申请号：US12212998
申请日：2008-09-18
申请人： Minhua Lu , Lawrence S. Mok
发明人： Minhua Lu , Lawrence S. Mok
IPC分类号： H01K3/10 , H01L23/02
CPC分类号： H01L23/427 , F28D15/0266 , H01L23/433 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/10253 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165 , Y10T29/49204 , H01L2924/00 , H01L2224/0401
摘要： A method of forming structure. A substrate and an interposer are provided. The substrate includes a heat source and N continuous substrate channels on a first side of the substrate (N≧2). N interposer channels are coupled to the N substrate channels so as to form M continuous loops (1≦M≦N). Each loop independently consists of K substrate channels and K interposer channels in an alternating sequence. For each loop, K is at least 1 and is subject to an upper limit consistent with a constraint of the M loops collectively consisting of the N interposer channels and the N substrate channels. Each loop is independently open ended or closed. The first side of the substrate is connected to the interposer. The interposer is adapted to be thermally coupled to a heat sink such that the interposer is interposed between the substrate and the heat sink.
摘要翻译：一种形成结构的方法。提供了基板和插入件。衬底在衬底的第一侧上包括热源和N个连续衬底通道（N≥2）。 N个内插器通道耦合到N个衬底通道，以便形成M个连续环路（1＆amp; NlE; M＆amp; N; N）。每个回路以交替顺序独立地由K个衬底通道和K个插入器通道组成。对于每个循环，K至少为1，并且受到与由N个插入物通道和N个底物通道组成的M个回路的约束一致的上限。每个循环是独立开放的或封闭的。衬底的第一面连接到插入器。插入器适于热耦合到散热器，使得插入器插入在基板和散热器之间。

44. 发明申请

US20090011546A1 COOLING OF SUBSTRATE USING INTERPOSER CHANNELS 有权
标题翻译：使用插入式通道冷却基板
公开(公告)号：US20090011546A1
公开(公告)日：2009-01-08
申请号：US12212998
申请日：2008-09-18
申请人： Minhua Lu , Lawrence S. Mok
发明人： Minhua Lu , Lawrence S. Mok
IPC分类号： H01L21/50
CPC分类号： H01L23/427 , F28D15/0266 , H01L23/433 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/10253 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165 , Y10T29/49204 , H01L2924/00 , H01L2224/0401
摘要： A method of forming structure. A substrate and an interposer are provided. The substrate includes a heat source and N continuous substrate channels on a first side of the substrate (N≧2). N interposer channels are coupled to the N substrate channels so as to form M continuous loops (1≦M≦N). Each loop independently consists of K substrate channels and K interposer channels in an alternating sequence. For each loop, K is at least 1 and is subject to an upper limit consistent with a constraint of the M loops collectively consisting of the N interposer channels and the N substrate channels. Each loop is independently open ended or closed. The first side of the substrate is connected to the interposer. The interposer is adapted to be thermally coupled to a heat sink such that the interposer is interposed between the substrate and the heat sink.
摘要翻译：一种形成结构的方法。提供了基板和插入件。衬底在衬底的第一侧上包括热源和N个连续衬底通道（N> = 2）。 N介质通道耦合到N个衬底通道，以便形成M个连续环路（1≤M≤N）。每个回路以交替顺序独立地由K个衬底通道和K个插入器通道组成。对于每个循环，K至少为1，并且受到与由N个插入物通道和N个底物通道组成的M个回路的约束一致的上限。每个循环是独立开放的或封闭的。衬底的第一面连接到插入器。插入器适于热耦合到散热器，使得插入器插入在基板和散热器之间。

45. 发明授权

US07273091B2 Cooling apparatus for heat generating devices 失效
标题翻译：用于发热装置的冷却装置
公开(公告)号：US07273091B2
公开(公告)日：2007-09-25
申请号：US10828428
申请日：2004-04-20
申请人： Manish Bahl , Lawrence S. Mok
发明人： Manish Bahl , Lawrence S. Mok
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus for heat generating devices such as semiconductor chips comprises a parallel disk fan in the middle of a set of heat sink fins. The parallel disk fan has radial elements placed between the disks to efficiently create air flow without turbulence. Cooling efficiency is further enhanced when heat dissipation through the parallel disks of the fan is introduced.
摘要翻译：用于诸如半导体芯片的发热装置的冷却装置包括在一组散热片的中间的平行盘扇。平行盘式风扇具有放置在盘之间的径向元件，以有效地产生无湍流的气流。通过引入风扇的并列盘进行散热时，冷却效率进一步提高。

46. 发明授权

US07128135B2 Cooling device using multiple fans and heat sinks 有权
标题翻译：冷却装置使用多个风扇和散热片
公开(公告)号：US07128135B2
公开(公告)日：2006-10-31
申请号：US10988215
申请日：2004-11-12
申请人： Lawrence S. Mok , Pablo D. Quinones
发明人： Lawrence S. Mok , Pablo D. Quinones
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： The present invention is directed to a method of constructing a semiconductor chip cooling device consists of multiple fans and heat sinks to provide redundant cooling capability. Heat coming from a semiconductor chip is first distributed to several heat sinks using multiple heat pipes. The heat sinks are placed around the fan outlet such that air is pulled in near the center of the fan and then pushed to across the heat sinks. Multiple fans and heat sinks are stacked up to form a complete cooling device. An external control circuitry is used to monitor and control the fans. In case of one fan fails, the other fans will be speeded up to make up the lost of air flow.
摘要翻译：本发明涉及一种构造半导体芯片冷却装置的方法，该装置由多个风扇和散热器组成，以提供冗余冷却能力。来自半导体芯片的热量首先使用多根热管分配到多个散热器。将散热器放置在风扇出口周围，使得空气被拉到风扇中心附近，然后被推到横跨散热器。多个风扇和散热器堆叠起来形成完整的冷却装置。外部控制电路用于监控和控制风扇。如果一个风扇发生故障，其他风扇将被加速以弥补空气流量的损失。

47. 发明授权

US07002247B2 Thermal interposer for thermal management of semiconductor devices 失效
标题翻译：用于半导体器件热管理的热插入器
公开(公告)号：US07002247B2
公开(公告)日：2006-02-21
申请号：US10874297
申请日：2004-06-18
申请人： Lawrence S. Mok , Evan G. Colgan , Minhua Lu , Da-Yuan Shih
发明人： Lawrence S. Mok , Evan G. Colgan , Minhua Lu , Da-Yuan Shih
IPC分类号： H01I23/34
CPC分类号： H01L24/31 , H01L23/427 , H01L2224/16225 , H01L2224/73253 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/0132 , H01L2924/01322 , H01L2924/09701 , H01L2924/10158 , H01L2924/14 , H01L2924/15311 , H01L2924/01026 , H01L2924/01028
摘要： A thermal interposer is provided for attachment to the back surface of a semiconductor device so as to give a very low thermal resistance. In one preferred embodiment, the thermal interposer has two plates containing wick structures such as grooves. The thermal interposer is integrated with a semiconductor device so as to form a vapor chamber. In particular, the back surface of the semiconductor chip is in direct contact with the interior sealed volume of the vapor chamber, so as to greatly reduce the thermal resistance from the combination of the chip and the vapor chamber. Further, the upper plate is thermally coupled to a heat-sinking fixture such as a heat sink or a cold plate.
摘要翻译：提供了一种用于附接到半导体器件的背表面的热插入件，以便提供非常低的热阻。在一个优选实施例中，热插入件具有两个板，其中包含芯结构例如凹槽。热插入件与半导体器件集成以形成蒸气室。特别地，半导体芯片的背面与蒸发室的内部密封容积直接接触，从而大大降低了芯片与蒸气室的组合的热阻。此外，上板热耦合到诸如散热器或冷板之类的散热固定装置。

48. 发明授权

US06816371B2 Method and arrangement for enhancing the cooling capacity of portable computers 失效
标题翻译：提高便携式电脑冷却能力的方法和装置
公开(公告)号：US06816371B2
公开(公告)日：2004-11-09
申请号：US10320180
申请日：2002-12-16
申请人： Hiroaki Agata , Tarek J. Jamal-Eddine , Lawrence S. Mok
发明人： Hiroaki Agata , Tarek J. Jamal-Eddine , Lawrence S. Mok
IPC分类号： H05K720
CPC分类号： G06F1/203 , G06F2200/202
摘要： An arrangement and method for enhancing the cooling capacity of portable personal computers. More particularly, disclosed is the provision of an arrangement for increasing the cooling capacity of laptop computers which are constrained in size, weight and power consumption, through which transfers and dissipates heat from semiconductor chips located in the computer and which are to be cooled, to the rear side of a liquid-crystal display of the laptop computer.
摘要翻译：一种用于增强便携式个人计算机的冷却能力的装置和方法。更具体地，公开了提供一种用于增加膝上型计算机的冷却能力的装置，其被限制在尺寸，重量和功率消耗中，通过该装置将位于计算机中并要被冷却的半导体芯片的热量传输和散发到笔记本电脑的液晶显示器的后侧。

49. 发明授权

US06326696B1 Electronic package with interconnected chips 失效
标题翻译：具有互连芯片的电子封装
公开(公告)号：US06326696B1
公开(公告)日：2001-12-04
申请号：US09018698
申请日：1998-02-04
申请人： Raymond Robert Horton , Alphonso Philip Lanzetta , Joseph Maryan Milewski , Lawrence S. Mok , Robert Kevin Montoye , Hussain Shaukatulla
发明人： Raymond Robert Horton , Alphonso Philip Lanzetta , Joseph Maryan Milewski , Lawrence S. Mok , Robert Kevin Montoye , Hussain Shaukatulla
IPC分类号： H01L2348
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/16145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/854 , H01L2224/85439 , H01L2224/85444 , H01L2224/8547 , H01L2924/00014 , H01L2924/01039 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic package which includes a circuitized substrate with a cavity and a first semiconductor chip positioned therein. The first chip is electrically coupled to conductive members located on the circuitized substrate. A second semiconductor chip is positioned on and electrically coupled to the first chip.
摘要翻译：一种电子封装，其包括具有空腔的电路化基板和位于其中的第一半导体芯片。第一芯片电耦合到位于电路化基板上的导电构件。第二半导体芯片位于第一芯片上并电耦合到第一芯片。

50. 发明授权

US5581576A Radio information broadcasting and receiving system 失效
标题翻译：无线电信息广播和接收系统
公开(公告)号：US5581576A
公开(公告)日：1996-12-03
申请号：US371621
申请日：1995-01-12
申请人： Alphonso P. Lanzetta , Lawrence S. Mok
发明人： Alphonso P. Lanzetta , Lawrence S. Mok
IPC分类号： H04H20/34 , H04H20/86 , H04L5/06 , H04L27/00 , H04L27/28
CPC分类号： H04H20/34 , H04H20/86 , H04L5/06
摘要： A radio information broadcasting and receiving system consisting of three major parts: an FM transmitter station with subcarrier multiplexing capability, an FM receiver apparatus with subcarrier demodulation capability, and a computer connected in combination with the receiver apparatus. The FM transmitter station includes sources of main programming signals first digital data signals and second digital data signals. The first and second digital data signals are modulated by subcarrier 1 and subcarrier 2 frequencies respectively and are mixed with the main program signal and then transmitted. The transmitted signals are received by a receiver apparatus including an FM receiver circuit and an FM demodulator circuit for receiving the broadcast signal and demodulating it. The demodulated main program audio frequency signal is applied through a filter/deemphasis circuit and amplifier to speaker to provide an audio output. The first subcarrier frequency signal is demodulated by a first subcarrier frequency generator to provide a digital signal of the text portion of the transmitted signal which is then applied to a first input port of this digital computer. Likewise, the second subcarrier frequency is demodulated and the resultant index digital data signal is applied to a second input port of the computer.
摘要翻译：一种无线电信息广播和接收系统，包括三个主要部分：具有子载波复用能力的FM发射机站，具有子载波解调能力的FM接收机设备，以及与接收机设备组合连接的计算机。 FM发射台包括主编程信号源，第一数字数据信号和第二数字数据信号。第一和第二数字数据信号分别由副载波1和子载波2频率调制，并与主节目信号混合后发送。所发送的信号由包括FM接收机电路和用于接收广播信号并对其进行解调的FM解调器电路的接收机装置接收。解调的主程序音频信号通过滤波器/去加重电路和放大器施加到扬声器以提供音频输出。第一副载波频率信号由第一副载波频率发生器解调，以提供发送信号的文本部分的数字信号，该数字信号然后被施加到该数字计算机的第一输入端口。类似地，解调第二副载波频率，并将所得到的索引数字数据信号施加到计算机的第二输入端口。

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