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41. 发明授权

US07501656B2 Light emitting diode package with diffuser and method of manufacturing the same 有权
标题翻译：具有扩散器的发光二极管封装及其制造方法
公开(公告)号：US07501656B2
公开(公告)日：2009-03-10
申请号：US11491947
申请日：2006-07-25
申请人： Seong Yeon Han , Seon Goo Lee , Chang Ho Song , Jung Kyu Park , Young Sam Park , Kyung Taeg Han
发明人： Seong Yeon Han , Seon Goo Lee , Chang Ho Song , Jung Kyu Park , Young Sam Park , Kyung Taeg Han
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： H01L33/58 , H01L33/505 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.
摘要翻译：本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

42. 发明申请

US20080171451A1 Printed circuit board connector for back light unit and chassis using the same 有权
标题翻译：印刷电路板连接器用于背光单元和机箱使用相同
公开(公告)号：US20080171451A1
公开(公告)日：2008-07-17
申请号：US12007735
申请日：2008-01-15
申请人： Chang-Ho Shin , Hun Joo Hahm , Jung Kyu Park , Won Joon Lee , Hyung Suk Kim
发明人： Chang-Ho Shin , Hun Joo Hahm , Jung Kyu Park , Won Joon Lee , Hyung Suk Kim
IPC分类号： H01R12/00
CPC分类号： H01R12/721 , H01R12/52 , H01R12/7082 , H01R12/732
摘要： There are provided a printed circuit board connector for a backlight unit and a chassis using the same. The printed circuit board connector for a backlight unit including: a horizontal supporter; a vertical supporter having one end connected to the horizontal supporter to divide the horizontal supporter into first and second areas; at least one connecting terminal formed on the horizontal supporter to be partially exposed in each of the first and second areas of the horizontal supporter, wherein the connecting terminal electrically connects printed circuit boards having one ends placed on the first and second areas, respectively.
摘要翻译：提供了一种用于背光单元的印刷电路板连接器和使用其的底座。一种用于背光单元的印刷电路板连接器，包括：水平支撑件; 垂直支撑件，其一端连接到水平支撑件，以将水平支撑件分成第一和第二区域; 至少一个形成在所述水平支撑件上的连接端子，以部分地暴露在所述水平支撑件的所述第一和第二区域中的每一个中，其中所述连接端子电连接分别具有放置在所述第一和第二区域上的一端的印刷电路板。

43. 发明授权

US07321137B2 RGB light emitting diode package with improved color mixing properties 有权
标题翻译： RGB发光二极管封装，具有改进的混色性能
公开(公告)号：US07321137B2
公开(公告)日：2008-01-22
申请号：US10959154
申请日：2004-10-07
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Jung Kyu Park , Young June Jeong
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Jung Kyu Park , Young June Jeong
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/56 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： An RGB light emitting diode package with improved color mixing properties includes red, green, and blue light emitting diode chips provided on a reflector. A photomixing material and a filler resin scatters rays so as to uniformly mix the rays emitted from the light emitting diode chips. The photomixing material and filler resin are applied onto upper sides of the light emitting diode chips while being mixed with each other, and the photomixing material is uniformly dispersed in the filler resin.
摘要翻译：具有改进的混色特性的RGB发光二极管封装包括设置在反射器上的红色，绿色和蓝色发光二极管芯片。光混合材料和填充树脂散射射线，以均匀混合从发光二极管芯片发出的光线。将光混合材料和填料树脂彼此混合地施加到发光二极管芯片的上侧，并且光混合材料均匀地分散在填充树脂中。

44. 发明申请

US20080013315A1 DIRECT-ILLUMINATION BACKLIGHT APPARATUS HAVING TRANSPARENT PLATE ACTING AS LIGHT GUIDE PLATE 失效
标题翻译：具有透明板作为光导板的直射照明装置
公开(公告)号：US20080013315A1
公开(公告)日：2008-01-17
申请号：US11860391
申请日：2007-09-24
申请人： Hyung Suk KIM , Jung Kyu Park , Ho-Sik Ahn , Young June Jeong , Young Sam Park , Hun Joo Hahm , Bum Jin Kim
发明人： Hyung Suk KIM , Jung Kyu Park , Ho-Sik Ahn , Young June Jeong , Young Sam Park , Hun Joo Hahm , Bum Jin Kim
IPC分类号： F21V13/04
CPC分类号： G02B6/0021 , G02B6/0038 , G02B6/0041 , G02F1/133603
摘要： A direct-illumination backlight apparatus using LEDs includes a flat reflective plate, an LED light source, a transparent plate, a scattering pattern, and a light guide. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel.
摘要翻译：使用LED的直接照明背光装置包括平面反射板，LED光源，透明板，散射图案和导光体。该光导用于从LED光源引入部分光，使得部分光被捕获在透明板的内部，散射图用于将捕获的光束分散在LED光源正上方的位置，从而散射的光束从透明板向LCD面板逸出。

45. 发明授权

US07217004B2 Light emitting diode array module for providing backlight and backlight unit having the same 有权
标题翻译：用于提供背光和背光单元的发光二极管阵列模块
公开(公告)号：US07217004B2
公开(公告)日：2007-05-15
申请号：US10890201
申请日：2004-07-14
申请人： Jung Kyu Park , Chang Wook Kim , Young Sam Park
发明人： Jung Kyu Park , Chang Wook Kim , Young Sam Park
IPC分类号： F21V1/00
CPC分类号： G02F1/133603 , F21K9/00 , F21Y2103/10 , F21Y2115/10 , Y10S362/80
摘要： A Light Emitting Diode (LED) array module, which can be used as backlight, includes a bar-shaped Printed Circuit Board (PCB) on which conductive patterns for transmitting power are formed, a base formed on the PCB and made of a heat conductive material, a plurality of LED chips mounted on the base in a line and electrically connected to the conductive patterns of the PCB, a reflector formed to surround the plurality of the LED chips and adapted to reflect light radiated from the plurality of LED chips upward, and a lens formed above the plurality of LED chips and reflector to have a bar shape and adapted to diffuse the light radiated from the plurality of LED chips and reflector in a horizontal direction.
摘要翻译：可用作背光的发光二极管（LED）阵列模块包括形成有用于传输功率的导电图案的条形印刷电路板（PCB），形成在PCB上并由导热材料，多个安装在基座上的LED芯片并电连接到PCB的导电图案;反射器，形成为围绕多个LED芯片并适于反射从多个LED芯片辐射的光向上，以及透镜，形成在所述多个LED芯片和所述反射器之上，以具有条形并且适于在从水平方向扩散从所述多个LED芯片和反射器辐射的光。

46. 发明授权

US07195364B2 Backlight apparatus reduced in thickness 失效
标题翻译：背光装置的厚度减小
公开(公告)号：US07195364B2
公开(公告)日：2007-03-27
申请号：US11059406
申请日：2005-02-17
申请人： Hun Joo Hahm , Hyung Suk Kim , Jung Kyu Park , Ho Sik Anh , Young Sam Park , Bum Jin Kim , Young June Jeong
发明人： Hun Joo Hahm , Hyung Suk Kim , Jung Kyu Park , Ho Sik Anh , Young Sam Park , Bum Jin Kim , Young June Jeong
IPC分类号： G01D11/28
CPC分类号： G02B6/0068 , G02B6/0016 , G02B6/0043 , G02F1/133603
摘要： In a backlight apparatus for an LCD, a plurality of bar-shaped first LED light sources are arranged on the reflective plate to laterally emit light. A plurality of light shades are arranged above the first light sources. A transparent plate is placed above the light shades. Scattering patterns are formed in the bottom of the transparent plate in positions corresponding to the light shades. A bar-shaped second LED light source is arranged at a side of the transparent plate to emit light into the transparent plate. The light source arranged at the side of the transparent plate prevents the formation of dark areas as a problem in the prior art, thereby enhancing the entire uniformity of light. Then, the backlight apparatus can be maintained thin even when applied to a large-sized LCD.
摘要翻译：在用于LCD的背光装置中，多个条形的第一LED光源被布置在反射板上以横向发光。多个浅色调布置在第一光源的上方。透明板放置在浅色调之上。散射图案形成在透明板底部的对应于浅色调的位置上。在透明板的一侧设置条状的第二LED光源，以将光发射到透明板中。布置在透明板一侧的光源防止了现有技术中的黑色区域的形成，从而增强了光的整体均匀性。然后，即使应用于大型LCD也能够使背光装置保持薄型化。

47. 发明授权

US07176503B2 Light emitting diode package and light source comprising the same 失效
标题翻译：发光二极管封装和包含该发光二极管封装的光源
公开(公告)号：US07176503B2
公开(公告)日：2007-02-13
申请号：US10967212
申请日：2004-10-19
申请人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
发明人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
IPC分类号： H01L29/24 , H01L31/12
CPC分类号： H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： An LED package comprises a substrate, one or three terminals formed on a first side of the substrate, three terminals formed on a second side opposite to the first side, and two or three LEDs disposed on the substrate, one of the LEDS being electrically connected to one of the terminals formed on the first side while being electrically connected to one of the terminals formed on the second side, and other LEDS being electrically connected to two terminals formed on the first side or to two terminals formed on the second side. A light source comprises the LED packages having the structure as described above. Without being arranged in a line, the LEDs emitting the same color are differently arranged in every LED package, thereby solving the problem of non-uniform combination of the colors according to the positions of the LEDs on an LED package-mounting substrate.
摘要翻译： LED封装包括基板，形成在基板的第一侧上的一个或三个端子，形成在与第一侧相对的第二侧上的三个端子和设置在基板上的两个或三个LED，其中一个LED电连接连接到形成在第一侧上的端子中的一个端子，同时电连接到形成在第二侧上的端子之一，并且其它LEDS电连接到形成在第一侧上的两个端子或形成在第二侧上的两个端子。光源包括具有如上所述结构的LED封装。不排列成一行，发光相同颜色的LED在每个LED封装中被不同地排列，从而解决了根据LED封装安装基板上LED的位置的颜色不均匀组合的问题。

48. 外观设计

USD499075S1 Light-emitting diode 失效
公开(公告)号：USD499075S1
公开(公告)日：2004-11-30
申请号：US29199049
申请日：2004-02-09
申请人： Joon Ho Yoon , Jung Kyu Park , Young Sam Park
设计人： Joon Ho Yoon , Jung Kyu Park , Young Sam Park

49. 发明申请

US20130203856A1 FILLER COMPOSITION FOR TISSUE REINFORCEMENT 有权
标题翻译：填充组织用于组织加固
公开(公告)号：US20130203856A1
公开(公告)日：2013-08-08
申请号：US13809432
申请日：2011-07-11
申请人： Il Hwan Cho , Eui Jin Hwang , Moo Seok Seo , Young Soo Park , Byung Su Kim , Sei Kwang Hahn , Jung Kyu Park , Jun Seok Yeom , Eun Ju Oh
发明人： Il Hwan Cho , Eui Jin Hwang , Moo Seok Seo , Young Soo Park , Byung Su Kim , Sei Kwang Hahn , Jung Kyu Park , Jun Seok Yeom , Eun Ju Oh
IPC分类号： A61K8/73 , A61Q19/08 , A61K31/167
CPC分类号： A61K8/735 , A61K31/167 , A61L27/20 , A61L27/52 , A61L27/54 , A61L2300/402 , A61L2400/06 , A61Q19/08 , C08B37/0072 , C08J3/075 , C08J2305/08 , C08L5/08
摘要： The present invention relates to a filler composition for tissue reinforcement, including hyaluronic acid and alkylene diamine crosslinked hydrogel. The filler composition exhibits the positive physical properties required for tissue reinforcement, such as biocompatibility and swelling ability, as well as useful effects in that the same can remain in vivo for a long time.
摘要翻译：本发明涉及用于组织增强的填充剂组合物，包括透明质酸和亚烷基二胺交联的水凝胶。填充剂组合物显示组织增强所需的正性物理性质，例如生物相容性和溶胀能力，以及有益效果，因为它们长时间保留在体内。

50. 发明授权

US08132953B2 Light emitting diode substrate module and method of manufacturing the same, and backlight unit and method of manufacturing the same 失效
标题翻译：发光二极管基板模块及其制造方法，以及背光单元及其制造方法
公开(公告)号：US08132953B2
公开(公告)日：2012-03-13
申请号：US12244393
申请日：2008-10-02
申请人： Jung Kyu Park , Seong Ah Joo , Seung Hwan Choi
发明人： Jung Kyu Park , Seong Ah Joo , Seung Hwan Choi
IPC分类号： F21V7/04
CPC分类号： G02F1/133603 , G02F1/133605 , G02F2001/133612 , H05K1/0274 , H05K1/053 , H05K1/092 , H05K2201/10106 , H05K2201/2054 , Y10S362/80
摘要： There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing.Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.
摘要翻译：提供了一种发光二极管衬底模块及其制造方法，以及背光单元及其制造方法。根据本发明的一个方面的发光二极管衬底模块包括：金属板; 具有预定厚度并设置在金属板的整个外表面上的绝缘膜; 具有预定厚度并设置在绝缘膜的整个外表面上的反射膜; 以及通过图案印刷电连接到设置在反射膜上的驱动电路的至少一个发光二极管封装。通过图案印刷形成预定的驱动电路可以避免不必要的材料成本，通过稳定地保持反射特性可以提高光学特性。

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