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1. 再颁专利

USRE44811E1 High power light emitting diode package 有权
标题翻译：大功率发光二极管封装
公开(公告)号：USRE44811E1
公开(公告)日：2014-03-18
申请号：US13330239
申请日：2011-12-19
申请人： Seon Goo Lee , Chang Wook Kim , Kyung Taeg Han
发明人： Seon Goo Lee , Chang Wook Kim , Kyung Taeg Han
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L33/60 , H01L2924/0002 , H01L2924/12041 , H01L2924/00
摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.
摘要翻译：本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。第一钣金构件与LED芯片电连接，在凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并且具有用于传送的传热部从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧金属构件。透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

2. 发明授权

US08435808B2 Light emitting diode package and manufacturing method thereof 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US08435808B2
公开(公告)日：2013-05-07
申请号：US13281079
申请日：2011-10-25
申请人： Won Ho Jung , Hun Yong Park , Jung Chul Kang , Kyung Taeg Han
发明人： Won Ho Jung , Hun Yong Park , Jung Chul Kang , Kyung Taeg Han
IPC分类号： H01L21/00
CPC分类号： H01L33/58 , H01L33/486 , H01L2224/45139 , H01L2224/48091 , H01L2224/48247 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
摘要： A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.
摘要翻译：提供一种制造发光二极管（LED）封装的方法。该方法包括制备包装体，其包括形成有空腔的第一引线框架并且插入在该空腔的底表面的一侧上，以及插入另一侧的第二引线框架，将LED芯片安装在底表面上并电连接所述LED芯片具有所述第一引线框架和所述第二引线框架，通过所述腔体中的模制树脂形成模制部分，将与所述模制部分相对应的第一模具连接到所述封装主体，并且包括具有内表面的通孔将第二模具连接到第一模具的上表面，通过透明树脂在模制部分上形成透镜部分，并将第一模具和第二模具与包装体分离。

3. 发明申请

US20120126267A1 LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20120126267A1
公开(公告)日：2012-05-24
申请号：US13281079
申请日：2011-10-25
申请人： Won Ho JUNG , Hun Yong Park , Jung Chul Kang , Kyung Taeg Han
发明人： Won Ho JUNG , Hun Yong Park , Jung Chul Kang , Kyung Taeg Han
IPC分类号： H01L33/58 , H01L33/52
CPC分类号： H01L33/58 , H01L33/486 , H01L2224/45139 , H01L2224/48091 , H01L2224/48247 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
摘要： A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.
摘要翻译：提供一种制造发光二极管（LED）封装的方法。该方法包括制备包装体，其包括形成有空腔的第一引线框架并且插入在该空腔的底表面的一侧上，以及插入另一侧的第二引线框架，将LED芯片安装在底表面上并电连接所述LED芯片具有所述第一引线框架和所述第二引线框架，通过所述腔体中的模制树脂形成模制部分，将与所述模制部分相对应的第一模具连接到所述封装主体，并且包括具有内表面的通孔将第二模具连接到第一模具的上表面，通过透明树脂在模制部分上形成透镜部分，并将第一模具和第二模具与包装体分离。

4. 发明申请

US20110031526A1 LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20110031526A1
公开(公告)日：2011-02-10
申请号：US12907348
申请日：2010-10-19
申请人： Kyung Taeg Han , In Tae Yeo , Hun Joo Hahm , Chang Ho Song , Seong Yeon Han , Yoon Sung Na , Dae Yeon Kim , Ho Sik Ahn , Young Sam Park
发明人： Kyung Taeg Han , In Tae Yeo , Hun Joo Hahm , Chang Ho Song , Seong Yeon Han , Yoon Sung Na , Dae Yeon Kim , Ho Sik Ahn , Young Sam Park
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
摘要翻译：一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

5. 发明授权

US07833811B2 Side-emitting LED package and method of manufacturing the same 有权
标题翻译：侧面发光LED封装及其制造方法
公开(公告)号：US07833811B2
公开(公告)日：2010-11-16
申请号：US12155961
申请日：2008-06-12
申请人： Kyung Taeg Han , Myoung Soo Choi , Seon Goo Lee , Hun Joo Hahm , Seong Yeon Han , Chang Ho Song , Young Sam Park
发明人： Kyung Taeg Han , Myoung Soo Choi , Seon Goo Lee , Hun Joo Hahm , Seong Yeon Han , Chang Ho Song , Young Sam Park
IPC分类号： H01L27/15 , H01L29/24
CPC分类号： H01L33/54 , H01L24/97 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2924/12035 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00014
摘要： The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。侧发光LED封装包括其上形成有电极的基板和设置在基板上并与电极电连接的光源。侧发光LED封装还包括具有上表面的模制部件，其中心凹陷地凹陷，覆盖和保护基板和光源，以及覆盖模制部件的整个上表面的反射层，以将光从侧向反射模制部件形成透光表面。封装不限制成型件的形状，不受LED芯片尺寸的影响，从而实现了紧凑的结构。本发明还可以通过PCB工艺处理衬底，从而实现批量生产。

6. 发明授权

US07795052B2 Chip coated light emitting diode package and manufacturing method thereof 有权
标题翻译：芯片涂层发光二极管封装及其制造方法
公开(公告)号：US07795052B2
公开(公告)日：2010-09-14
申请号：US12684578
申请日：2010-01-08
申请人： Seon Goo Lee , Kyung Taeg Han , Seong Yeon Han
发明人： Seon Goo Lee , Kyung Taeg Han , Seong Yeon Han
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L33/508 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.
摘要翻译：一种芯片涂覆的LED封装及其制造方法。芯片涂覆的LED封装包括由安装在基座上的芯片芯片组成的发光芯片和均匀地覆盖芯片裸片的外表面的树脂层。芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

7. 发明授权

US07626250B2 High power LED package and fabrication method thereof 有权
标题翻译：大功率LED封装及其制造方法
公开(公告)号：US07626250B2
公开(公告)日：2009-12-01
申请号：US11445227
申请日：2006-06-02
申请人： Seon Goo Lee , Hun Joo Hahm , Jung Kyu Park , Kyung Taeg Han , Seong Yeon Han , Dae Yeon Kim , Young Sam Park
发明人： Seon Goo Lee , Hun Joo Hahm , Jung Kyu Park , Kyung Taeg Han , Seong Yeon Han , Dae Yeon Kim , Young Sam Park
IPC分类号： H01L23/495
CPC分类号： H01L33/642 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2924/00014
摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.
摘要翻译： LED二极管封装包括用于在其上表面上安装发光部分的热连接部分，同时保持热连接部分电连接到发光部分的框架和将热连接部分和框架固定在一起的模制部件。发光部分响应于施加到其上的电流产生光，并且热连接部分的上表面超过模制部件的上表面突出到预定高度。这可以优化光源的唯一光束角度，从而使照明效率最大化，并且防止在透镜的组装过程中封装材料的溢出，否则可能会污染相邻的部件。

8. 发明申请

US20080254558A1 Side-emitting LED package and method of manufacturing the same 有权
标题翻译：侧面发光LED封装及其制造方法
公开(公告)号：US20080254558A1
公开(公告)日：2008-10-16
申请号：US12155961
申请日：2008-06-12
申请人： Kyung Taeg Han , Myoung Soo Choi , Seon Goo Lee , Hun Joo Hahm , Seong Yeon Han , Chang Ho Song , Young Sam Park
发明人： Kyung Taeg Han , Myoung Soo Choi , Seon Goo Lee , Hun Joo Hahm , Seong Yeon Han , Chang Ho Song , Young Sam Park
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L24/97 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2924/12035 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00014
摘要： The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。侧发光LED封装包括其上形成有电极的基板和设置在基板上并与电极电连接的光源。侧发光LED封装还包括具有上表面的模制部件，其中心凹陷地凹陷，覆盖和保护基板和光源，以及覆盖模制部件的整个上表面的反射层，以将光从侧向反射模制部件形成透光表面。封装不限制成型件的形状，不受LED芯片尺寸的影响，从而实现了紧凑的结构。本发明还可以通过PCB工艺处理衬底，从而实现批量生产。

9. 发明申请

US20080233666A1 Light emitting diode package with metal reflective layer and method of manufacturing the same 有权
标题翻译：具有金属反射层的发光二极管封装及其制造方法
公开(公告)号：US20080233666A1
公开(公告)日：2008-09-25
申请号：US12153719
申请日：2008-05-23
申请人： Jung Kyu Park , Seon Goo Lee , Kyung Taeg Han , Seong Yeon Han
发明人： Jung Kyu Park , Seon Goo Lee , Kyung Taeg Han , Seong Yeon Han
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L24/97 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, a light emitting diode chip disposed on the substrate, and an encapsulant covering the LED chip and the substrate to protect the LED chip. The LED package also includes a metal reflective layer surrounding side surfaces of the encapsulant to form a light transmitting surface on a top surface of the encapsulant. The invention minimizes light loss, improves luminance, can be mass-produced as a PCB type, and adopts EMC transfer molding to minimize irregular color distribution, thereby improving optical quality.
摘要翻译：本发明涉及一种具有用于聚焦并通过封装侧发光的金属反射层的LED封装及其制造方法。 LED封装包括其上形成有电极的基板，设置在基板上的发光二极管芯片以及覆盖LED芯片和基板的密封剂以保护LED芯片。 LED封装还包括围绕密封剂的侧表面的金属反射层，以在密封剂的顶表面上形成透光表面。本发明使光损失最小化，亮度提高，可以作为PCB类型批量生产，并采用EMC传递模塑，以减少不规则的颜色分布，从而提高光学质量。

10. 发明申请

US20070241362A1 Light emitting diode package and fabrication method thereof 审中-公开
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20070241362A1
公开(公告)日：2007-10-18
申请号：US11730965
申请日：2007-04-05
申请人： Kyung Taeg Han , In Tae Yeo , Hun Joo Hahm , Chang Ho Song , Seong Yeon Han , Yoon Sung Na , Dae Yeon Kim , Ho Sik Ahn , Young Sam Park
发明人： Kyung Taeg Han , In Tae Yeo , Hun Joo Hahm , Chang Ho Song , Seong Yeon Han , Yoon Sung Na , Dae Yeon Kim , Ho Sik Ahn , Young Sam Park
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
摘要翻译：一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

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