会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 41. 发明授权
    • Positive resist composition and method of forming resist pattern
    • 正型抗蚀剂组合物和形成抗蚀剂图案的方法
    • US08586281B2
    • 2013-11-19
    • US13156159
    • 2011-06-08
    • Jun IwashitaMasahito YahagiKenri KonnoIsamu Takagi
    • Jun IwashitaMasahito YahagiKenri KonnoIsamu Takagi
    • G03F7/028G03F7/039G03F7/26
    • G03F7/0397G03F7/0045G03F7/0046
    • A positive resist composition including: a base component; and a sensitizer which a polymeric compound having a core portion that includes a hydrocarbon group or a heterocycle of two or more valences and at least one arm portion bonded to the core portion and represented by formula (1), and a polymeric compound having a core portion including a polymer having a molecular weight of 500 to 20,000 and at least one arm portion bonded to the core portion and represented by formula (1); and either the base component includes a resin component that generates acid upon exposure and exhibits increased solubility in an alkali developing solution under action of acid, or the positive resist composition further contains an acid generator component including a compound that generates acid upon exposure: —(X)—Y  (1) in which X represents a divalent linking group having an acid dissociable group; and Y represents a polymer chain.
    • 一种正型抗蚀剂组合物,包括:基础组分; 和具有核心部分的高分子化合物,其具有包含烃基或两价以上化合价的杂环,以及至少一个与核心部分结合并由式(1)表示的臂部分的聚合化合物和具有核心的聚合物 包括分子量为500至20,000的聚合物和至少一个结合到核心部分并由式(1)表示的臂部分; 并且基础组分包括在暴露时产生酸的树脂组分,并且在酸的作用下在碱性显影液中显示增加的溶解性,或者正型抗蚀剂组合物还含有包含在暴露时产生酸的化合物的酸产生剂组分: - ( X)-Y(1)其中X表示具有酸解离基团的二价连接基团; Y表示聚合物链。
    • 44. 发明授权
    • Positive resist composition and method of forming resist pattern
    • 正型抗蚀剂组合物和形成抗蚀剂图案的方法
    • US08232040B2
    • 2012-07-31
    • US12620339
    • 2009-11-17
    • Jun IwashitaTakeyoshi Mimura
    • Jun IwashitaTakeyoshi Mimura
    • G03F7/004G03F7/30
    • G03F7/0392G03F7/0045G03F7/0397G03F7/2041Y10S430/106Y10S430/111
    • A positive resist composition including a base material component (A) that exhibits increased solubility in an alkali developing solution under action of an acid; and an acid generator component (B) that generates an acid upon exposure, wherein the base material component (A) includes a polymeric compound (A1) having a structural unit (a10) derived from hydroxystyrene and a structural unit (a11) represented by general formula (a11-1) shown below: wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms, or a halogenated alkyl group of 1 to 5 carbon atoms; R21 represents an alkyl group; and R22 represents a group that forms an aliphatic monocyclic group of 7 to 10-membered ring together with the carbon atom to which this R22 group is bonded.
    • 一种正型抗蚀剂组合物,其包含在酸性作用下在碱性显影液中表现出增加的溶解度的基材成分(A) 以及在曝光时产生酸的酸发生剂组分(B),其中所述基材组分(A)包含具有由羟基苯乙烯衍生的结构单元(a10)的聚合化合物(A1)和由一般表示的结构单元(a11) 式(a11-1)表示:式中,R表示氢原子,碳原子数1〜5的烷基或碳原子数1〜5的卤代烷基, R21表示烷基; R 22表示与该R 22基团键合的碳原子一起形成7〜10元环的脂肪族单环基的基团。
    • 45. 发明申请
    • POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN
    • 积极抵抗组合物,形成阻力模式的方法
    • US20100248144A1
    • 2010-09-30
    • US12730070
    • 2010-03-23
    • Takeshi IWAIJun IWASHITADaichi TAKAKI
    • Takeshi IWAIJun IWASHITADaichi TAKAKI
    • G03F7/004G03F7/20
    • G03F7/40C09D133/02G03F7/0397
    • The positive resist composition including a base material component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid generator component (B) which generates acid upon exposure, the positive resist composition characterized in that in those cases where a resist film is formed on a substrate using the positive resist composition and is then subjected to a selective exposure and developing to form a hole pattern, followed by a bake treatment, a bake treatment temperature (Tf), at which the size of the hole is reduced by 10%, as compared to the size of the hole before the bake treatment, is at least 100° C.; and also that in those cases where a resist film is formed on a substrate using the positive resist composition and is then subjected to a selective exposure and developing to form a hole pattern, followed by the entire surface exposure and then by a bake treatment, a bake treatment temperature (Tf′), at which the size of the hole is reduced by 10%, as compared to the size of the hole before the bake treatment, is at least 18° C. lower than the Tf.
    • 正型抗蚀剂组合物包括在酸的作用下在碱性显影液中显示出增加的溶解性的基体组分(A)和暴露时产生酸的酸产生剂组分(B),正性抗蚀剂组合物的特征在于, 使用正性抗蚀剂组合物在基板上形成抗蚀剂膜,然后进行选择性曝光和显影以形成孔图案,然后进行烘烤处理,烘烤处理温度(Tf),其中孔的尺寸 与烘烤处理前的孔的尺寸相比减少10%至少100℃。 并且在使用正型抗蚀剂组合物的基板上形成抗蚀剂膜的情况下,然后进行选择性曝光和显影以形成孔图案,然后进行整个表面曝光,然后通过烘烤处理, 与烘烤处理前的孔的尺寸相比,孔的尺寸减小10%的烘烤处理温度(Tf')比Tf低至少18℃。
    • 48. 发明申请
    • METHOD OF FORMING RESIST PATTERN
    • 形成电阻图案的方法
    • US20100062379A1
    • 2010-03-11
    • US12441704
    • 2007-09-18
    • Jun Iwashita
    • Jun Iwashita
    • G03F7/20
    • G03F7/0035G03F7/0048G03F7/70466Y10S430/114Y10S430/128
    • Disclosed is a method of forming a resist pattern, including: applying a positive resist composition on a support 1 to form a first resist film 2; selectively exposing the first resist film 2 through a first mask pattern, and developing it to form a first resist pattern 3; applying a negative resist composition including an organic solvent (S″) containing an alcohol-based organic solvent on the support 1 that the first resist pattern 3 is formed, thereby forming a second resist film 6; and selectively exposing the second resist film 6 through a second mask pattern, and developing it to form a resist pattern denser than the first resist pattern 3.
    • 公开了一种形成抗蚀剂图案的方法,包括:将正性抗蚀剂组合物涂覆在载体1上以形成第一抗蚀剂膜2; 通过第一掩模图案选择性地暴露第一抗蚀剂膜2,并使其显影以形成第一抗蚀剂图案3; 将包含含有醇类有机溶剂的有机溶剂(S“)的负性抗蚀剂组合物涂布在形成第一抗蚀剂图案3的支撑体1上,从而形成第二抗蚀剂膜6; 并且通过第二掩模图案选择性地暴露第二抗蚀剂膜6,并使其显影以形成比第一抗蚀剂图案3更致密的抗蚀剂图案。
    • 49. 发明申请
    • Positive resist composition and method of forming resist pattern
    • 正型抗蚀剂组合物和形成抗蚀剂图案的方法
    • US20100055606A1
    • 2010-03-04
    • US12461862
    • 2009-08-26
    • Takeyoshi MimuraJun Iwashita
    • Takeyoshi MimuraJun Iwashita
    • G03F7/20G03F7/004
    • G03F7/0397
    • The present invention provides a positive resist composition capable of forming a resist pattern with high resolution, and a method of forming a resist pattern.This composition is a positive resist composition including a resin component (A) which exhibits increased solubility in an alkali developing solution under action of acid, and an acid-generator component (B) which generates acid upon irradiation, the resin component (A) containing a polymer including: a core portion represented by general formula (1) [Chemical Formula 1] PX—Y)a   (1) wherein P represents an a-valent organic group; a represents an integer of 2 to 20; Y represents an arylene group or an alkylene group of 1 to 12 carbon atoms; and X represents a specific linking group which can be cleaved under action of acid, and arm portions that are bonded to the core portion and are also composed of a polymer chain obtained by an anionic polymerization method.
    • 本发明提供能够以高分辨率形成抗蚀剂图案的正性抗蚀剂组合物和形成抗蚀剂图案的方法。 该组合物是包含在酸性作用下在碱性显影液中显示出增加的溶解性的树脂组分(A)和在照射时产生酸的酸产生剂组分(B)的正性抗蚀剂组合物,所述树脂组分(A)含有 包含由通式(1)表示的核心部分的聚合物[化学式1] P-X-Y)a(1)其中P表示a价的有机基团; a表示2〜20的整数, Y表示碳原子数1〜12的亚芳基或亚烷基。 X表示可以在酸作用下切断的特定连接基团,以及与芯部分结合的臂部分,也由通过阴离子聚合法得到的聚合物链构成。