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    • 31. 发明授权
    • Contact ring architecture
    • 联系环架构
    • US06683476B2
    • 2004-01-27
    • US10140967
    • 2002-05-08
    • Anwar AliTauman T. LauMax M. Yeung
    • Anwar AliTauman T. LauMax M. Yeung
    • H01L2500
    • H01L23/5286H01L2924/0002H01L2924/00
    • An integrated circuit with a VDDio bus line disposed on a first layer of the integrated circuit. The VDDio bus line is disposed along a length, and has a first width transverse to the length. A VSSio bus line is dispose on a second layer of the integrated circuit. The VSSio bus line is disposed along the length and has a second width transverse to the length. The second width of the VSSio bus line substantially overlaps the first width of the VDDio bus line. An input output cell is disposed on a third layer of the integrated circuit. The first layer, the second layer, and the third layer are all different layers of the integrated circuit. The input output cell has a first transistor electrically connected to the VDDio bus line, and a second transistor electrically connected to the VSSio bus line. The first transistor and the second transistor are disposed along the length within the input output cell.
    • 具有布置在集成电路的第一层上的VDDio总线的集成电路。 VDDio总线沿着长度设置,并且具有横向于该长度的第一宽度。 VSSio总线布置在集成电路的第二层上。 VSSio总线沿着该长度设置并且具有横向于该长度的第二宽度。 VSSio总线的第二宽度基本上与VDDio总线的第一宽度重叠。 输入输出单元设置在集成电路的第三层上。 第一层,第二层和第三层都是集成电路的不同层。 输入输出单元具有电连接到VDDio总线的第一晶体管和与VSSio总线电连接的第二晶体管。 第一晶体管和第二晶体管沿着输入输出单元内的长度设置。
    • 34. 发明授权
    • Signal processing semiconductor integrated circuit device
    • 信号处理半导体集成电路器件
    • US06501330B2
    • 2002-12-31
    • US10087820
    • 2002-03-05
    • Nobuhiro KasaYoshiyasu TashiroKazuaki Hori
    • Nobuhiro KasaYoshiyasu TashiroKazuaki Hori
    • H01L2500
    • H01L21/76264H01L27/0623H01L2924/0002H01L2924/00
    • A semiconductor integrated circuit comprising a first circuit block including an oscillation circuit considered to be a noise generator and a second circuit block including circuits considered to be easily affected by a noise generated by the oscillation circuit, being most likely led to a malfunction are created on a single semiconductor substrate with the first and second circuit blocks separated from each other. To put it more concretely, the first and second circuit blocks are respectively created in a first island area and a second island area on the surface of the semiconductor substrate. The first and second island areas are each enclosed by an insulating isolation band. A low-resistance semiconductor area is created in a base area excluding locations occupied by active elements in the first and second island areas and is connected to a stable voltage terminal.
    • 一种半导体集成电路,包括包括被认为是噪声发生器的振荡电路的第一电路块和包括被认为容易受到由振荡电路产生的噪声影响的电路的第二电路块,最可能导致故障 具有彼此分离的第一和第二电路块的单个半导体衬底。 更具体地说,第一和第二电路块分别在半导体衬底的表面上的第一岛区和第二岛区中产生。 第一和第二岛区均由绝缘隔离带包围。 在基区域中产生低电阻半导体区域,不包括在第一岛区域和第二岛区域中的有源元件占据的位置,并且连接到稳定的电压端子。
    • 35. 发明授权
    • Interconnect circuitry for implementing logic functions in a field programmable gate array and method of operation
    • 用于实现现场可编程门阵列中的逻辑功能的互连电路和操作方法
    • US06483344B2
    • 2002-11-19
    • US09773320
    • 2001-01-31
    • Vidyabhusan Gupta
    • Vidyabhusan Gupta
    • H01L2500
    • H03K19/17736G06F15/7867H03K19/1778
    • There is disclosed a field programmable gate array that performs in the interconnect matrix selected Boolean logic functions, such as OR gates and NOR gates, normally performed in the configurable logic blocks of the FPGA. The field programmable gate array comprises: 1) a plurality of configurable logic blocks (CLBs); 2) a plurality of interconnects; 3) a plurality of interconnect switches for coupling ones of the plurality of interconnects to each other and to inputs and outputs of the plurality of configurable logic blocks; and 4) an interconnect switch controller for controlling the plurality of interconnect switches. The interconnect switch controller in a first switch configuration causes a first interconnect to be coupled to an output of a first CLB, causes a second interconnect to be coupled to an output of a second CLB, causes the first and second interconnects to be coupled to a third interconnect, and causes the third interconnect to be coupled to a pull-up device coupled to a power supply source of the field programmable gate array. The first, second and third interconnects and the pull-up device thereby form a two-input OR gate.
    • 公开了一种现场可编程门阵列,其在互连矩阵中执行通常在FPGA的可配置逻辑块中执行的所选择的布尔逻辑功能,例如OR门和NOR门。 现场可编程门阵列包括:1)多个可配置逻辑块(CLB); 2)多个互连; 3)多个互连开关,用于将所述多个互连中的一个互连到所述多个可配置逻辑块的输入和输出; 以及4)用于控制所述多个互连开关的互连开关控制器。 在第一开关配置中的互连开关控制器使得第一互连件耦合到第一CLB的输出端,使第二互连件耦合到第二CLB的输出,使第一和第二互连件耦合到 第三互连,并且使第三互连耦合到耦合到现场可编程门阵列的电源的上拉器件。 因此,第一,第二和第三互连和上拉器件形成双输入或门。
    • 37. 发明授权
    • Programmable I/O cells with multiple drivers
    • 具有多个驱动程序的可编程I / O单元
    • US06417692B2
    • 2002-07-09
    • US09777393
    • 2001-02-05
    • Eric M. Shiflet
    • Eric M. Shiflet
    • H01L2500
    • H03K19/17744H03K19/17788
    • A programmable input/output cell (I/O cell) for use with integrated circuits, and in particular programmable logic devices, is presented comprising input receiver circuitry, output driver circuitry and programmable elements. The input receiver and output driver circuitry each include multiple receivers/drivers that provide an interface between the signaling level of the integrated circuit and at least two other signaling standards. The programmable elements may be programmed to select a different signaling standard for each I/O cell to operate at, if desired. For instance, adjacent I/O cells may be connected to two different bus structures that utilize different signaling levels. The invention enables one I/O cell to translate between the PLD signaling level and the first bus signaling level, while the second I/O cell translates between the integrated circuit signaling level and the second bus signaling level.
    • 提供了用于集成电路,特别是可编程逻辑器件的可编程输入/输出单元(I / O单元),包括输入接收器电路,输出驱动器电路和可编程元件。 输入接收器和输出驱动器电路各自包括多个接收器/驱动器,其提供集成电路的信号电平与至少两个其它信令标准之间的接口。 如果需要,可编程元件可以被编程为为每个I / O单元选择不同的信号标准来操作。 例如,相邻的I / O单元可以连接到利用不同信令级别的两个不同的总线结构。 本发明使得一个I / O小区能够在PLD信令级别和第一总线信令级别之间转换,而第二I / O单元在集成电路信令级别和第二总线信令级别之间转换。