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31. 发明授权

US06386420B2 Apparatus for continuously rolling steel billets 有权
标题翻译：钢坯连续轧制设备
公开(公告)号：US06386420B2
公开(公告)日：2002-05-14
申请号：US09848036
申请日：2001-05-03
申请人： Giichi Matsuo , Susumu Okawa , Koji Okushima
发明人： Giichi Matsuo , Susumu Okawa , Koji Okushima
IPC分类号： B23K3700
CPC分类号： B21B37/005 , B21B1/18 , B21B15/0085 , B21B39/006 , B21B2273/20 , B21B2275/04 , B21B2275/06 , B23K11/04
摘要： A plurality of materials are rolled in an upstream stand. While the transfer speed of a succeeding material and the front end position thereof are detected, the transfer speed and the rear end position of a preceding material are detected by a measuring roll. The transfer speed of the succeeding material is controlled by adjusting at least the drive speed of the pinch rolls so that the front end of the succeeding material contacts the rear end of the preceding material at a specified position in a travelling welder. The rear end of the preceding material is joined with the front end of the succeeding material by flash-butt welding using the travelling welder to form a continuous material while letting the travelling welder move at a speed synchronous with the transfer speed of the continuous material. The welded portion on the continuous material is ground and/or cut to remove burrs therefrom. After removing the burrs, the continuous material is continuously rolled by a down-stream stand.
摘要翻译：多个材料在上游支架中滚动。在检测到后续材料的传送速度和其前端位置的同时，通过测量辊检测前一材料的传送速度和后端位置。通过至少调整夹送辊的驱动速度来控制后续材料的传送速度，使得后续材料的前端在行进焊机的指定位置处接触前一材料的后端。前述材料的后端通过使用移动焊接机的对接焊接而与后续材料的前端连接以形成连续材料，同时让行进焊接机以与连续材料的传送速度同步的速度移动。将连续材料上的焊接部分研磨和/或切割以除去毛边。在除去毛刺之后，连续材料通过下游支架连续滚动。

32. 发明授权

US06321969B1 Efficient energy transfer capillary 有权
标题翻译：高效能量转移毛细管
公开(公告)号：US06321969B1
公开(公告)日：2001-11-27
申请号：US09561304
申请日：2000-04-28
申请人： Amir Miller
发明人： Amir Miller
IPC分类号： B23K3700
CPC分类号： H01L24/85 , B23K20/005 , B23K20/106 , H01L24/45 , H01L24/78 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/78302 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01067 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/48 , H01L2924/00 , H01L2924/00015
摘要： A bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a first diameter; a second cylindrical section coupled to an end of the first cylindrical section, the second cylindrical section having a second diameter less than the first diameter; and a tapered section coupled to an end of the second cylindrical section.
摘要翻译：用于将细线结合到基板的接合工具。接合工具包括具有第一直径的第一圆柱形部分; 第二圆柱形部分，其联接到所述第一圆柱形部分的端部，所述第二圆柱形部分具有小于所述第一直径的第二直径; 以及联接到所述第二圆柱形部分的端部的锥形部分。

33. 发明授权

US06305593B1 Lead penetrating clamping system 失效
公开(公告)号：US06305593B1
公开(公告)日：2001-10-23
申请号：US09419851
申请日：1999-10-19
申请人： Michael B. Ball
发明人： Michael B. Ball
IPC分类号： B23K3700
CPC分类号： H01L24/85 , B23K20/004 , B23K2101/40 , H01L21/4825 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05553 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/78301 , H01L2224/78703 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , Y10S269/903 , H01L2924/00014 , H01L2924/00
摘要： An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The apparatus and method contemplates the replacement of the penetrating fixed clamp with another, or second, penetrating independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

34. 发明授权

US06273318B1 Welding gun cylinder with control valve 有权
标题翻译：焊枪筒带控制阀
公开(公告)号：US06273318B1
公开(公告)日：2001-08-14
申请号：US09589689
申请日：2000-06-08
申请人： Donald E. McGeachy
发明人： Donald E. McGeachy
IPC分类号： B23K3700
CPC分类号： B23K11/31 , Y10T137/86686 , Y10T137/86895
摘要： A weld gun cylinder and piston assembly includes a common center end wall interposed between two cylinders. The common center end wall functions as a manifold with bores extending therethrough. The manifold houses two spool valves. The spool valves control the passage of pneumatic pressure through passages of the manifold to and from the cylinders to extend and retract two piston rods for controlling jaws and a weld tip on a robotic arm.
摘要翻译：焊枪气缸和活塞组件包括插入在两个气缸之间的公共中心端壁。公共中心端壁用作具有穿过其中的孔的歧管。歧管装有两个滑阀。滑阀控制通过歧管通过气缸的通道的气动压力，以延伸和缩回两个活塞杆，用于控制机械臂上的钳口和焊接尖端。

35. 发明授权

US06237832B1 Wave soldering fixture 失效
标题翻译：波峰焊夹具
公开(公告)号：US06237832B1
公开(公告)日：2001-05-29
申请号：US09420179
申请日：1999-10-18
申请人： Henry Chung
发明人： Henry Chung
IPC分类号： B23K3700
CPC分类号： B23K3/087 , B23K2101/42
摘要： An apparatus used in a process for supporting a printed circuit board during a wave soldering operation including a frame with a frame opening in which a surface of the frame supports the board and also serves as a reference surface for vertically positioning the board above the solder pool. The board is secured against the reference surface with spring loaded clamps. Stiffeners preferably being an aluminum extrusion having a Tee or angle cross section is mounted along the outside edge of the reference surface of the frame and has a second reference surface facing in a direction opposite the reference surface of the frame. The second reference surface on the extrusion is accessible for support by a slide rail so that the height of the reference surface of the frame above the surface of the pool is independent of the thickness of the board or frame. A board support bar for minimizing warpage of the board from heat is disclosed as well as a hold down bar that secures components on the board so that they do not float away when contacted by the solder wave.
摘要翻译：一种用于在波峰焊操作期间用于支撑印刷电路板的工艺中使用的装置，包括框架的框架，框架开口框架支撑板，并且还用作用于将板垂直定位在焊池上方的参考表面。使用弹簧加载的夹具将板固定在参考面上。优选地，具有T形或角度横截面的铝挤压件沿着框架的参考表面的外边缘安装，并且具有面向与框架的参考表面相反的方向的第二参考表面。挤出件上的第二参考表面可通过滑轨进行支撑，使得在池的表面上方的框架的参考表面的高度与板或框架的厚度无关。公开了用于将板的翘曲从热量最小化的板支撑杆以及将组件固定在板上的压紧杆，使得当焊料波形接触时它们不会浮起。

36. 发明授权

US06189764B1 Fitting gear 失效
标题翻译：配件
公开(公告)号：US06189764B1
公开(公告)日：2001-02-20
申请号：US09236382
申请日：1999-01-25
申请人： Dale Hannan
发明人： Dale Hannan
IPC分类号： B23K3700
CPC分类号： B23K13/01
摘要： A fitting gear for assisting in the alignment of metal plates so that the edges thereof can be welded together includes an inverted substantially U-shaped electromagnet which, when energized, is adapted to be secured to the upper surface of one of the plates adjacent on edge thereof. A wedge-shaped tapered pin is forced into the U and contacts the upper surface of the other plate to move the edges into substantial alignment with each other.
摘要翻译：用于辅助金属板的对准以使其边缘可以焊接在一起的装配齿轮包括倒置的大致U形的电磁体，当被通电时，该电磁体适于固定到邻近边缘的一个板的上表面其中。楔形锥形销被迫进入U并接触另一个板的上表面，以使边缘彼此基本对齐。

37. 发明授权

US06186388B1 Soldering 有权
标题翻译：焊接
公开(公告)号：US06186388B1
公开(公告)日：2001-02-13
申请号：US09296958
申请日：1999-04-23
申请人： Steven P. Sadler , Patrizio Vinciarelli
发明人： Steven P. Sadler , Patrizio Vinciarelli
IPC分类号： B23K3700
CPC分类号： H05K3/34 , B23K1/0016 , B23K1/203 , B23K2101/42
摘要： The invention features soldering parts (e.g., printed circuit boards) by indexing the parts sequentially and continuously through a series of processing stations. Flux may be applied to precise areas of the parts at a flux station, and the flux station may include a rough part locator that roughly locates a part indexed into the flux station and a precise part locator that precisely locates the part. The flux station may further include a guide rail for supporting the part and a mechanism for raising and lowering the guide rail. The flux station may include a flux sprayer for applying flux to the part, where the flux sprayer includes an air valve, a flux valve, and a controller coupled to activate and deactivate separately the air valve and the flux valve. The controller may activate the air valve before activating the flux valve and deactivate the flux valve before deactivating the air valve.
摘要翻译：本发明的特征在于焊接部件（例如，印刷电路板）通过一系列处理站顺序地和连续地索引零件。助焊剂可以在焊剂站处施加到零件的精确区域，并且焊剂站可以包括粗略部件定位器，其粗略地定位索引到焊剂站的部件和精确定位零件的精确零件定位器。助焊站还可以包括用于支撑部件的导轨和用于升高和降低导轨的机构。助焊剂站可以包括用于将助熔剂施加到部件的助焊剂喷雾器，其中助焊剂喷雾器包括空气阀，磁通阀和耦合以分开地使空气阀和磁通阀致动和去激活的控制器。在激活通量阀之前，控制器可以激活空气阀，并且在停用空气阀之前停用通量阀。

38. 发明授权

US06817510B2 Apparatus for increasing wave height of molten solder in solder bath 失效
标题翻译：用于增加焊料槽中熔融焊料的波高的装置
公开(公告)号：US06817510B2
公开(公告)日：2004-11-16
申请号：US10260391
申请日：2002-10-01
申请人： Po-Hung Wang , Yo-Chang Chen
发明人： Po-Hung Wang , Yo-Chang Chen
IPC分类号： B23K3700
CPC分类号： B23K3/0653
摘要： The present invention discloses an apparatus applied to the wave former of the wave soldering system to increase the wave height of molten solder. The apparatus comprises a block board and a gland, wherein the block board is mounted on the enclosing walls of the wave former to increase the total height of enclosing walls thereof for increasing the wave height, and the gland is disposed on the partial opening of the wave former to press the molten solder for have higher solder wave on other partial opening of the wave former uncovered by the gland.
摘要翻译：本发明公开了一种应用于波峰焊系统的波浪形成器以提高熔融焊料的波高的装置。该装置包括块板和压盖，其中块板安装在波浪形成器的封闭壁上以增加其封闭壁的总高度以增加波高，并且压盖设置在波纹形成器的部分开口上波形成形器按压熔融焊料以在由压盖未覆盖的波浪形成的其它部分打开时具有更高的焊波。

39. 发明授权

US06808102B1 Wire-bonding apparatus with improved XY-table orientation 有权
标题翻译：具有改进的XY工作台取向的接线装置
公开(公告)号：US06808102B1
公开(公告)日：2004-10-26
申请号：US09649084
申请日：2000-08-28
申请人： Wing Cheung Ho , Siu Yan Ho , Hon Shing Law , Siu Wai Chung
发明人： Wing Cheung Ho , Siu Yan Ho , Hon Shing Law , Siu Wai Chung
IPC分类号： B23K3700
CPC分类号： H01L24/85 , B23K20/004 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45144 , H01L2224/48471 , H01L2224/78 , H01L2224/85 , H01L2924/01005 , H01L2924/01006 , H01L2924/01039 , H01L2924/01079 , H01L2924/14 , H01L2924/00014
摘要： Wedge wire bonding apparatus are disclosed with an improved configuration in which the transducer axis lies on a line that bisects the XY axes, and the operator views the bonding process by looking directly along the axis of the transducer. The result is a shorter bonding cycle time as time is saved as the bonding head moves from a first to a second bonding position while at the same time the operator is placed in the best possible position for viewing the bonding operation, which facilitates in particular any necessary alignment and set-up steps.
摘要翻译：公开了楔形线接合装置，其具有改进的构造，其中换能器轴线位于将XY轴平分的线上，并且操作者通过直接沿着换能器的轴线观察接合过程。结果是随着键头从第一粘结位置移动到第二粘合位置而节省了时间，同时操作者被放置在用于观察粘合操作的最佳位置，这有助于特别地任何必要的对齐和设置步骤。

40. 发明授权

US06799709B2 Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board 有权
标题翻译：将焊料局部应用于印刷电路板上的预选导体区域的方法和装置
公开(公告)号：US06799709B2
公开(公告)日：2004-10-05
申请号：US10321581
申请日：2002-12-18
申请人： Akira Takaguchi , Masaki Wata , Chikara Numata
发明人： Akira Takaguchi , Masaki Wata , Chikara Numata
IPC分类号： B23K3700
CPC分类号： H05K3/3468 , B23K1/085 , B23K1/203 , B23K3/0653 , B23K3/082 , B23K3/087 , H05K3/3489 , H05K2203/111
摘要： An apparatus for locally applying solder to a plurality of sets of preselected conductive areas on each printed circuit board to which component leads are joined. The apparatus includes a flux station with flux nozzles, a preheater station, and a wave solder station with solder nozzles, arranged in line to receive and process printed circuit boards. The flux nozzles and the solder nozzles are arranged in a pattern identical to that of the preselected conductive areas on each of the board. A conveyor system is arranged to simultaneously transporting the boards from one station to another. The conveyor system includes a frame, an arm carriage reciprocably moved along the frame, a plurality of pairs of pivot arms pivotably connected to the arm carriage and movable between an inoperative position where the pivot arms are disengaged from the boards and an operative position where the pivot arms are engaged with the boards, a pair of first rails connected to the frame and located above the flux station and the preheater station, and a pair of second rails connected to the frame and located above the wave solder station.
摘要翻译：一种用于将焊料局部施加到组件引线所连接的每个印刷电路板上的多组预选导电区域的设备。该设备包括具有磁通喷嘴的焊剂站，预热站和具有焊接喷嘴的波峰焊接站，排列成线以接收和处理印刷电路板。焊剂喷嘴和焊接喷嘴以与每个板上的预选导电区域相同的模式布置。输送机系统被布置成将板从一个站同时运输到另一个站。输送机系统包括框架，沿着框架往复运动的臂托架，多对枢转臂，可枢转地连接到臂托架上，并且可在枢转臂与板分离的非操作位置和可操作位置之间移动，枢转臂与板接合，连接到框架并位于焊剂站和预热器站上的一对第一轨道，以及连接到框架并位于波峰焊站上方的一对第二轨道。

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