专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06915941B2 Method for local application of solder to preselected areas on a printed circuit board 有权
标题翻译：将焊料局部应用于印刷电路板上的预选区域的方法
公开(公告)号：US06915941B2
公开(公告)日：2005-07-12
申请号：US10231141
申请日：2002-08-30
申请人： Akira Takaguchi , Masaki Wata , Chikara Numata
发明人： Akira Takaguchi , Masaki Wata , Chikara Numata
IPC分类号： B23K1/00 , B23K1/08 , B23K3/06 , H05K3/34 , B23K31/02 , B23K35/12
CPC分类号： H05K3/3468 , B23K3/0607 , H05K3/3447 , H05K3/3489 , H05K2203/0763
摘要： A method for locally applying solder to a set of preselected conductor areas on a printed circuit board without causing thermal damage to adjacent sensitive surface mounted devices and connectors. Before solder is applied, molten solder within a solder reservoir is pumped upwardly through a set of solder wave nozzles so as to clean and preheat the nozzles. The preselected conductor areas on the board are then aligned with the nozzles. At this time, the board is maintained at a height slightly above the nozzles to the extent that the molten solder is prevented from escaping from between the board and the nozzles. A relatively low wave of solder is produced through the nozzles to cause the low wave of solder to contact and preheat the preselected conductor areas on the board. A relatively high wave of solder is then produced through the nozzles to locally solder the preselected conductor areas on the printed circuit board.
摘要翻译：一种用于将焊料局部施加到印刷电路板上的一组预选导体区域而不对相邻的敏感表面安装的装置和连接器造成热损伤的方法。在施加焊料之前，焊料储存器内的熔融焊料向上泵送通过一组焊波波形喷嘴，以清洁和预热喷嘴。然后将板上的预选导体区域与喷嘴对准。此时，板被保持在略高于喷嘴的高度，使得防止熔融焊料从板和喷嘴之间逸出的程度。通过喷嘴产生相对低的焊料波，以使低波焊料接触并预热板上的预选导体区域。然后通过喷嘴产生相对高的焊料波，以局部焊接印刷电路板上的预选导体区域。

2. 发明授权

US06799709B2 Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board 有权
标题翻译：将焊料局部应用于印刷电路板上的预选导体区域的方法和装置
公开(公告)号：US06799709B2
公开(公告)日：2004-10-05
申请号：US10321581
申请日：2002-12-18
申请人： Akira Takaguchi , Masaki Wata , Chikara Numata
发明人： Akira Takaguchi , Masaki Wata , Chikara Numata
IPC分类号： B23K3700
CPC分类号： H05K3/3468 , B23K1/085 , B23K1/203 , B23K3/0653 , B23K3/082 , B23K3/087 , H05K3/3489 , H05K2203/111
摘要： An apparatus for locally applying solder to a plurality of sets of preselected conductive areas on each printed circuit board to which component leads are joined. The apparatus includes a flux station with flux nozzles, a preheater station, and a wave solder station with solder nozzles, arranged in line to receive and process printed circuit boards. The flux nozzles and the solder nozzles are arranged in a pattern identical to that of the preselected conductive areas on each of the board. A conveyor system is arranged to simultaneously transporting the boards from one station to another. The conveyor system includes a frame, an arm carriage reciprocably moved along the frame, a plurality of pairs of pivot arms pivotably connected to the arm carriage and movable between an inoperative position where the pivot arms are disengaged from the boards and an operative position where the pivot arms are engaged with the boards, a pair of first rails connected to the frame and located above the flux station and the preheater station, and a pair of second rails connected to the frame and located above the wave solder station.
摘要翻译：一种用于将焊料局部施加到组件引线所连接的每个印刷电路板上的多组预选导电区域的设备。该设备包括具有磁通喷嘴的焊剂站，预热站和具有焊接喷嘴的波峰焊接站，排列成线以接收和处理印刷电路板。焊剂喷嘴和焊接喷嘴以与每个板上的预选导电区域相同的模式布置。输送机系统被布置成将板从一个站同时运输到另一个站。输送机系统包括框架，沿着框架往复运动的臂托架，多对枢转臂，可枢转地连接到臂托架上，并且可在枢转臂与板分离的非操作位置和可操作位置之间移动，枢转臂与板接合，连接到框架并位于焊剂站和预热器站上的一对第一轨道，以及连接到框架并位于波峰焊站上方的一对第二轨道。

3. 发明授权

US08544713B2 Apparatus and method of coating flux 有权
标题翻译：包衣剂的设备和方法
公开(公告)号：US08544713B2
公开(公告)日：2013-10-01
申请号：US12646777
申请日：2009-12-23
申请人： Issaku Sato , Akira Takaguchi
发明人： Issaku Sato , Akira Takaguchi
IPC分类号： B23K1/20
CPC分类号： B23K3/082 , B23K1/0016 , B23K1/203 , B23K3/087 , B23K2101/42 , H05K3/3447 , H05K3/3489 , H05K2203/0763 , H05K2203/1361
摘要： An apparatus coats flux on a projection of a part mounted on a printed circuit board. The projection passes through the printed circuit board and projects from the printed circuit board. The apparatus contains a printed-circuit-board-holding member that holds the printed circuit board, a nozzle having an opening through which the projection comes in the nozzle and comes off the nozzle, a nozzle-moving member that moves the nozzle to a predetermined position, and a flux-supplying member that supplies the flux to the nozzle. The flux is coated on at least the projection by dipping the projection in the flux contained in the nozzle through the opening.
摘要翻译：一种装置在安装在印刷电路板上的部件的突起上涂覆通量。投影通过印刷电路板并从印刷电路板突出。该装置包括保持印刷电路板的印刷电路板保持部件，具有突起从喷嘴离开喷嘴的开口的喷嘴，将喷嘴移动到预定的喷嘴移动部件，位置，以及向焊嘴供给焊剂的焊剂供给部件。通过将突起浸入通过开口的喷嘴中所含的焊剂中，将焊剂至少涂覆在突起上。

4. 发明授权

US08302835B2 Point flow soldering apparatus 有权
标题翻译：点流焊机
公开(公告)号：US08302835B2
公开(公告)日：2012-11-06
申请号：US13142419
申请日：2009-12-28
申请人： Issaku Sato , Akira Takaguchi
发明人： Issaku Sato , Akira Takaguchi
IPC分类号： B23K1/08
CPC分类号： H05K3/3468 , B23K1/0016 , B23K1/085 , B23K3/0653 , H05K3/3447 , H05K2203/0763
摘要： To prevent clogging in a jet nozzle without using any inert gas and to allow reliability to be improved by filling a through hole of a printed circuit board with the molten solder.By flowing the molten solder 4 in the solder bath 2 from inside of the inner cylinder 15 to a nozzle cap 19, the inside of the nozzle cap 19 is filled with the molten solder 4, and the molten solder 4 filling the inside of the nozzle cap 19 is flown downward from between an inner cylinder 15 and an outer cylinder 16 without substantially flowing it to outside from an insert hole 19a. This enables the molten solder 4 to be prevented from oxidizing because the molten solder 4 is not exposed to the outside air. For this reason, it is possible to prevent clogging in the jet nozzle 3 without filling a part of nozzle outlet with any inert gas as in the conventional soldering apparatus. Further, since the soldering is performed with a lead 31 of electronic component 30 being inserted into the insert hole 19a, it is possible to fill the through hole of the printed circuit board P with the molten solder 4, so that the reliability can be improved.
摘要翻译：为了防止喷嘴中的堵塞而不使用任何惰性气体，并且通过用熔融焊料填充印刷电路板的通孔来允许提高可靠性。通过将焊锡槽2中的熔融焊料4从内筒15的内部流入喷嘴盖19，喷嘴帽19的内部填充有熔融焊料4，并且填充喷嘴内部的熔融焊料4 帽19从内筒15和外筒16之间向下流动而基本上不从插入孔19a流到外部。这使得熔融焊料4不会被氧化，因为熔融焊料4不暴露于外部空气。因此，与现有的焊接装置同样，能够防止喷嘴3内的堵塞而不填充一部分惰性气体的喷嘴出口。此外，由于电子部件30的引线31插入到插入孔19a中进行焊接，所以可以用熔融焊料4填充印刷电路板P的通孔，从而可以提高可靠性。

5. 发明申请

US20110284619A1 POINT FLOW SOLDERING APPARATUS 有权
标题翻译：点流焊机
公开(公告)号：US20110284619A1
公开(公告)日：2011-11-24
申请号：US13142419
申请日：2009-12-28
申请人： Issaku Sato , Akira Takaguchi
发明人： Issaku Sato , Akira Takaguchi
IPC分类号： B23K3/06
CPC分类号： H05K3/3468 , B23K1/0016 , B23K1/085 , B23K3/0653 , H05K3/3447 , H05K2203/0763
摘要： To prevent clogging in a jet nozzle without using any inert gas and to allow reliability to be improved by filling a through hole of a printed circuit board with the molten solder.By flowing the molten solder 4 in the solder bath 2 from inside of the inner cylinder 15 to a nozzle cap 19, the inside of the nozzle cap 19 is filled with the molten solder 4, and the molten solder 4 filling the inside of the nozzle cap 19 is flown downward from between an inner cylinder 15 and an outer cylinder 16 without substantially flowing it to outside from an insert hole 19a. This enables the molten solder 4 to be prevented from oxidizing because the molten solder 4 is not exposed to the outside air. For this reason, it is possible to prevent clogging in the jet nozzle 3 without filling a part of nozzle outlet with any inert gas as in the conventional soldering apparatus. Further, since the soldering is performed with a lead 31 of electronic component 30 being inserted into the insert hole 19a, it is possible to fill the through hole of the printed circuit board P with the molten solder 4, so that the reliability can be improved.
摘要翻译：为了防止喷嘴中的堵塞而不使用任何惰性气体，并且通过用熔融焊料填充印刷电路板的通孔来允许提高可靠性。通过将焊锡槽2中的熔融焊料4从内筒15的内部流入喷嘴盖19，喷嘴帽19的内部填充有熔融焊料4，并且填充喷嘴内部的熔融焊料4 帽19从内筒15和外筒16之间向下流动而基本上不从插入孔19a流到外部。这使得熔融焊料4不会被氧化，因为熔融焊料4不暴露于外部空气。因此，与现有的焊接装置同样，能够防止喷嘴3内的堵塞而不填充一部分惰性气体的喷嘴出口。此外，由于电子部件30的引线31插入到插入孔19a中进行焊接，所以可以用熔融焊料4填充印刷电路板P的通孔，从而可以提高可靠性。

6. 发明授权

US08403199B2 Localized jet soldering device and partial jet soldering method 有权
标题翻译：本地喷射焊接装置和部分喷射焊接方法
公开(公告)号：US08403199B2
公开(公告)日：2013-03-26
申请号：US13257936
申请日：2010-03-24
申请人： Issaku Sato , Akira Takaguchi
发明人： Issaku Sato , Akira Takaguchi
IPC分类号： B23K3/06 , B23K31/02
CPC分类号： B23K3/0653 , B23K1/085 , B23K2101/42 , H05K3/3415 , H05K3/3447 , H05K3/3468 , H05K2203/0746 , H05K2203/0763
摘要： To enable the molten solder to be partially spouted onto a component-mounting member in a stable state without decreasing the revolutions of a pump which is difficult to set a spouted amount of molten solder, even if a nozzle having a small spouting opening is used in a partial-jet-solder bath.As shown in FIG. 3, an automatic partial-jet-soldering apparatus 100 is provided with a solder bath 4 that has a nozzle base portion 44 and contains molten solder 7, a pump 5 that supplies the molten solder 7 contained in the solder bath 4 under a predetermined pressure to the nozzle base portion 44, plural nozzles 8a and the like that have predetermined solder-spouting areas and connect the nozzle base portion 44 to spout the molten solder 7 supplied from the pump 5 under the predetermined pressure so that it rises by its surface tension, and a dummy nozzle 32 that has a solder-spouting area more than that of any of the nozzles 8a and the like and connects the nozzle base portion 44 to spout the molten solder 7 supplied from the pump 5 under the predetermined pressure, wherein the dummy nozzle 32 is positioned on a position which is nearer the pump 5 than the nozzles 8a and the like.
摘要翻译：为了使熔融焊料能够以稳定的状态部分地喷射到部件安装部件上，而不会减少难以设定喷射量的熔融焊料的泵的转数，即使使用具有小喷射口的喷嘴部分喷射焊锡浴。如图所示。如图3所示，自动部分喷射焊接装置100设置有具有喷嘴基部44并且包含熔融焊料7的焊料槽4，将包含在焊料槽4中的熔融焊料7供给到预定压力的泵5 到喷嘴基部44，具有预定的焊料喷射区域的多个喷嘴8a等，并且连接喷嘴基部44以在预定压力下喷出从泵5供应的熔融焊料7，使得其以其表面张力以及具有大于喷嘴8a等的焊料喷射面积的虚拟喷嘴32，并且连接喷嘴基部44以在预定压力下喷出从泵5供给的熔融焊料7，其中，虚拟喷嘴32位于比喷嘴8a等靠近泵5的位置。

7. 发明申请

US20080093417A1 Wave Soldering Tank 有权
标题翻译：波浪焊罐
公开(公告)号：US20080093417A1
公开(公告)日：2008-04-24
申请号：US10573449
申请日：2004-10-08
申请人： Akira Takaguchi , Issaku Sato , Noboru Hashimoto , Junichi Okamura
发明人： Akira Takaguchi , Issaku Sato , Noboru Hashimoto , Junichi Okamura
IPC分类号： B23K1/08
CPC分类号： B23K3/0653
摘要： A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.
摘要翻译：波峰焊槽包括用于容纳熔融焊料的焊料槽体和设置在焊料槽体内的焊料供给室。设置有轴向流动的多叶片螺杆式泵，以便通过入口将熔融焊料吸入焊料进料室，并通过出口排出熔融焊料。在优选实施例中，泵包括可旋转轮毂和多个螺旋叶片，其在轮毂的圆周方向上以相等的间隔固定到轮毂，当在叶片中看到叶片时，每个叶片与相邻的叶片重叠叶轮的轴向。

8. 发明授权

US09956633B2 Wave soldering tank 有权
公开(公告)号：US09956633B2
公开(公告)日：2018-05-01
申请号：US13527532
申请日：2012-06-19
申请人： Akira Takaguchi , Issaku Sato , Noboru Hashimoto , Junichi Okamura
发明人： Akira Takaguchi , Issaku Sato , Noboru Hashimoto , Junichi Okamura
IPC分类号： B23K1/00 , B23K3/00 , B23K3/06
CPC分类号： B23K3/0653
摘要： A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.

9. 发明申请

US20120255987A1 WAVE SOLDERING TANK 有权
标题翻译： WAVE SOLDERING坦克
公开(公告)号：US20120255987A1
公开(公告)日：2012-10-11
申请号：US13527532
申请日：2012-06-19
申请人： Akira Takaguchi , Issaku Sato , Noboru Hashimoto , Junichi Okamura
发明人： Akira Takaguchi , Issaku Sato , Noboru Hashimoto , Junichi Okamura
IPC分类号： B23K3/06
CPC分类号： B23K3/0653
摘要： A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.
摘要翻译：波峰焊槽包括用于容纳熔融焊料的焊料槽体和设置在焊料槽体内的焊料供给室。设置有轴向流动的多叶片螺杆式泵，以便通过入口将熔融焊料吸入焊料进料室，并通过出口排出熔融焊料。在优选实施例中，泵包括可旋转轮毂和多个螺旋叶片，其在轮毂的圆周方向上以相等的间隔固定到轮毂，当在叶片中看到叶片时，每个叶片与相邻的叶片重叠叶轮的轴向。

10. 发明授权

US08215534B2 Wave soldering tank 有权
标题翻译：波峰焊锡罐
公开(公告)号：US08215534B2
公开(公告)日：2012-07-10
申请号：US10573449
申请日：2004-10-08
申请人： Akira Takaguchi , Issaku Sato , Noboru Hashimoto , Junichi Okamura
发明人： Akira Takaguchi , Issaku Sato , Noboru Hashimoto , Junichi Okamura
IPC分类号： B23K1/00 , B23K31/02
CPC分类号： B23K3/0653
摘要： A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.
摘要翻译：波峰焊槽包括用于容纳熔融焊料的焊料槽体和设置在焊料槽体内的焊料供给室。设置有轴向流动的多叶片螺杆式泵，以便通过入口将熔融焊料吸入焊料进料室，并通过出口排出熔融焊料。在优选实施例中，泵包括可旋转轮毂和多个螺旋叶片，其在轮毂的圆周方向上以相等的间隔固定到轮毂，当在叶片中看到叶片时，每个叶片与相邻的叶片重叠叶轮的轴向。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式