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1. 发明授权

US06799709B2 Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board 有权
标题翻译：将焊料局部应用于印刷电路板上的预选导体区域的方法和装置
公开(公告)号：US06799709B2
公开(公告)日：2004-10-05
申请号：US10321581
申请日：2002-12-18
申请人： Akira Takaguchi , Masaki Wata , Chikara Numata
发明人： Akira Takaguchi , Masaki Wata , Chikara Numata
IPC分类号： B23K3700
CPC分类号： H05K3/3468 , B23K1/085 , B23K1/203 , B23K3/0653 , B23K3/082 , B23K3/087 , H05K3/3489 , H05K2203/111
摘要： An apparatus for locally applying solder to a plurality of sets of preselected conductive areas on each printed circuit board to which component leads are joined. The apparatus includes a flux station with flux nozzles, a preheater station, and a wave solder station with solder nozzles, arranged in line to receive and process printed circuit boards. The flux nozzles and the solder nozzles are arranged in a pattern identical to that of the preselected conductive areas on each of the board. A conveyor system is arranged to simultaneously transporting the boards from one station to another. The conveyor system includes a frame, an arm carriage reciprocably moved along the frame, a plurality of pairs of pivot arms pivotably connected to the arm carriage and movable between an inoperative position where the pivot arms are disengaged from the boards and an operative position where the pivot arms are engaged with the boards, a pair of first rails connected to the frame and located above the flux station and the preheater station, and a pair of second rails connected to the frame and located above the wave solder station.
摘要翻译：一种用于将焊料局部施加到组件引线所连接的每个印刷电路板上的多组预选导电区域的设备。该设备包括具有磁通喷嘴的焊剂站，预热站和具有焊接喷嘴的波峰焊接站，排列成线以接收和处理印刷电路板。焊剂喷嘴和焊接喷嘴以与每个板上的预选导电区域相同的模式布置。输送机系统被布置成将板从一个站同时运输到另一个站。输送机系统包括框架，沿着框架往复运动的臂托架，多对枢转臂，可枢转地连接到臂托架上，并且可在枢转臂与板分离的非操作位置和可操作位置之间移动，枢转臂与板接合，连接到框架并位于焊剂站和预热器站上的一对第一轨道，以及连接到框架并位于波峰焊站上方的一对第二轨道。

2. 发明授权

US06915941B2 Method for local application of solder to preselected areas on a printed circuit board 有权
标题翻译：将焊料局部应用于印刷电路板上的预选区域的方法
公开(公告)号：US06915941B2
公开(公告)日：2005-07-12
申请号：US10231141
申请日：2002-08-30
申请人： Akira Takaguchi , Masaki Wata , Chikara Numata
发明人： Akira Takaguchi , Masaki Wata , Chikara Numata
IPC分类号： B23K1/00 , B23K1/08 , B23K3/06 , H05K3/34 , B23K31/02 , B23K35/12
CPC分类号： H05K3/3468 , B23K3/0607 , H05K3/3447 , H05K3/3489 , H05K2203/0763
摘要： A method for locally applying solder to a set of preselected conductor areas on a printed circuit board without causing thermal damage to adjacent sensitive surface mounted devices and connectors. Before solder is applied, molten solder within a solder reservoir is pumped upwardly through a set of solder wave nozzles so as to clean and preheat the nozzles. The preselected conductor areas on the board are then aligned with the nozzles. At this time, the board is maintained at a height slightly above the nozzles to the extent that the molten solder is prevented from escaping from between the board and the nozzles. A relatively low wave of solder is produced through the nozzles to cause the low wave of solder to contact and preheat the preselected conductor areas on the board. A relatively high wave of solder is then produced through the nozzles to locally solder the preselected conductor areas on the printed circuit board.
摘要翻译：一种用于将焊料局部施加到印刷电路板上的一组预选导体区域而不对相邻的敏感表面安装的装置和连接器造成热损伤的方法。在施加焊料之前，焊料储存器内的熔融焊料向上泵送通过一组焊波波形喷嘴，以清洁和预热喷嘴。然后将板上的预选导体区域与喷嘴对准。此时，板被保持在略高于喷嘴的高度，使得防止熔融焊料从板和喷嘴之间逸出的程度。通过喷嘴产生相对低的焊料波，以使低波焊料接触并预热板上的预选导体区域。然后通过喷嘴产生相对高的焊料波，以局部焊接印刷电路板上的预选导体区域。

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