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1. 发明授权

US06957760B2 Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux 失效
标题翻译：用于使用工具将焊球附接到BGA封装的装置，以将焊球拾取并浸入助焊剂中
公开(公告)号：US06957760B2
公开(公告)日：2005-10-25
申请号：US10358849
申请日：2003-02-04
申请人： Chad A. Cobbley , Michael B. Ball , Marjorie L. Waddel
发明人： Chad A. Cobbley , Michael B. Ball , Marjorie L. Waddel
IPC分类号： B23K3/06 , H05K3/34 , B23K5/00
CPC分类号： H05K3/3478 , B23K3/0623 , B23K2101/40 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2924/00014 , H05K3/3489 , H05K2203/041 , H05K2203/082 , Y10T29/49146 , H01L2224/05599
摘要： A method of attaching solder balls to a BGA package using a ball pickup tool is disclosed. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.
摘要翻译：公开了一种使用球形拾取工具将焊球附接到BGA封装的方法。在第一衬底上形成一组焊球，用于与另一衬底上的导电部位相互连接。球形拾取工具从流化球储存器中抽真空吸取球，并利用气泡将其上承载的焊球释放到衬底的导电部位以与其结合。在另一个实施例中，衬底的接合焊盘涂覆有焊剂或粘合剂，并且下降到流化的球储存器中以直接附着焊球。

2. 发明授权

US06861345B2 Method of disposing conductive bumps onto a semiconductor device 失效
标题翻译：将导电凸块设置在半导体器件上的方法
公开(公告)号：US06861345B2
公开(公告)日：2005-03-01
申请号：US09736795
申请日：2000-12-14
申请人： Michael B. Ball , Chad A. Cobbley
发明人： Michael B. Ball , Chad A. Cobbley
IPC分类号： H01L21/60 , H05K3/00 , H05K3/28 , H05K3/34 , H01L21/44
CPC分类号： H01L24/12 , H01L24/11 , H01L2224/05572 , H01L2224/05573 , H01L2224/056 , H01L2224/1147 , H01L2224/11472 , H01L2224/13023 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01042 , H01L2924/01051 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H05K3/0041 , H05K3/28 , H05K3/3452 , H05K3/3457 , H05K2201/0125 , H05K2201/0191 , H01L2924/00 , H01L2924/00014
摘要： A method of forming conductive structures on the contact pads of a substrate,such as a semiconductor die or a printed circuit board. A solder mask is secured to an active surface of the substrate. Apertures through the solder mask are aligned with contact pads on the substrate. The apertures may be preformed or formed after a layer of the material of which the solder mask is comprised has been disposed on the substrate. Conductive material is disposed in and shaped by the apertures of the solder mask to form conductive structures in communication with the contact pads exposed to the apertures. Sides of the conductive structures are exposed through the solder mask, either by removing the solder mask from the substrate or by reducing the thickness of the solder mask. The present invention also includes semiconductor devices formed during different stages of the method of the present invention.
摘要翻译：在诸如半导体管芯或印刷电路板的衬底的接触焊盘上形成导电结构的方法。焊接掩模固定到基板的有效表面。通过焊接掩模的孔径与衬底上的接触焊盘对准。可以在其包含焊料掩模的材料层已经布置在基底上之后预先形成或形成孔。导电材料设置在焊接掩模的孔中并由其形成，以形成与暴露于孔的接触焊盘相连通的导电结构。通过焊接掩模暴露出导电结构的侧面，通过从衬底去除焊接掩模或通过减小焊接掩模的厚度。本发明还包括在本发明方法的不同阶段形成的半导体器件。

3. 发明授权

US06641381B2 Wafer dicing blade consisting of multiple layers 失效
公开(公告)号：US06641381B2
公开(公告)日：2003-11-04
申请号：US10266772
申请日：2002-10-09
申请人： Michael B. Ball
发明人： Michael B. Ball
IPC分类号： B28D104
CPC分类号： B24D5/14 , B23D61/026 , B23D65/00 , B24D5/12 , B28D5/022
摘要： The present invention provides a multi-layered diamond dicing blade. More particularly, the blade is a multi-layered dicing blade comprising an inner layer with a first set of diamond particles and an outer layer overlying the inner layer. The inner layer extends to the outermost periphery of the dicing blade. The outer layer comprises a second set of diamond particles having a size smaller than the first set of diamond particles.

4. 发明授权

US06607121B2 Quick change precisor 失效
公开(公告)号：US06607121B2
公开(公告)日：2003-08-19
申请号：US10139430
申请日：2002-05-06
申请人： Rich Fogal , Michael B. Ball , Ronald W. Ellis
发明人： Rich Fogal , Michael B. Ball , Ronald W. Ellis
IPC分类号： B23K3102
CPC分类号： H01L24/78 , B23K20/004 , B23K37/0426 , B23K2101/40 , H01L2224/78 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2224/48 , H01L2224/45099
摘要： A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the precisor plate relative to a lead frame in an automatic wire bonding machine. In a preferred embodiment, the heat block is integral with the precisor plate and includes internal bores and or passageways for receiving a heating element, a thermocouple, and/or a vacuum source.

5. 发明授权

US06539855B2 Method and apparatus for screen printing 失效
标题翻译：丝网印刷方法和装置
公开(公告)号：US06539855B2
公开(公告)日：2003-04-01
申请号：US09863094
申请日：2001-05-22
申请人： Michael B. Ball
发明人： Michael B. Ball
IPC分类号： B05C1704
CPC分类号： H05K3/1233 , H01L21/4867 , H05K2203/0126 , H05K2203/0264 , H05K2203/159
摘要： A screen printing apparatus and method for forming printed wiring on a substrate, such as a wafer. The apparatus includes a reservoir disposed beneath a screen having a plurality of openings forming a pattern thereon. Disposed within the reservoir is a printing paste. The screen is pressed into the printing paste such that convex structures are formed on the upper surface of the screen, and are printable onto the substrate. A wiper is also movably disposed within the reservoir, cooperating with the screen to establish contact between the screen and the substrate.
摘要翻译：一种丝网印刷装置和方法，用于在诸如晶片的基板上形成印刷布线。该设备包括设置在筛网下方的储存器，其具有在其上形成图案的多个开口。储存器内设置有印刷浆料。将屏幕压入印刷浆料中，使得凸起结构形成在屏幕的上表面上，并且可印刷到基板上。擦拭器还可移动地设置在储存器内，与屏幕配合以在屏幕和基板之间建立接触。

6. 发明授权

US06407456B1 Multi-chip device utilizing a flip chip and wire bond assembly 有权
标题翻译：使用倒装芯片和引线接合组件的多芯片器件
公开(公告)号：US06407456B1
公开(公告)日：2002-06-18
申请号：US09510817
申请日：2000-02-23
申请人： Michael B. Ball
发明人： Michael B. Ball
IPC分类号： H01L2348
CPC分类号： H01L25/50 , H01L24/45 , H01L25/0657 , H01L29/0657 , H01L2224/274 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/85205 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2924/01013 , H01L2924/01079 , H01L2924/14 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An apparatus and method for increasing integrated circuit density comprising an upper die and a lower die, the latter preferably a flip-chip, which are connected to a conductor-carrying substrate or a leadframe. The upper die is attached back-to-back to the lower die with a layer of adhesive applied over the back side of the lower die. Bond wires or TAB leads are attached between bond pads on the upper die and corresponding conductive trace or lead ends on the substrate. The upper die may be smaller than the lower die such that a small discrete component such as a resistor, capacitor, or the like can be attached to the adhesive not covered by the upper die. Bond wires can be attached between the upper die and the component, as well as between the component and the substrate. One or more additional die may be stacked on the upper die and electrically connected to the substrate. Furthermore, multiple lower dice can be arranged on the substrate to support upper dice bridged between the lower dice.
摘要翻译：一种用于提高集成电路密度的装置和方法，包括上模和下模，后者优选为倒装芯片，其连接到承载导体的基板或引线框架。上模具背对背地附接到下模具，其中一层粘合剂施加在下模的背面上。键合线或TAB引线连接在上模的接合焊盘和衬底上的相应导电迹线或引线端之间。上模可以小于下模，使得诸如电阻器，电容器等的小分立部件可以附接到未被上模覆盖的粘合剂。键合线可以连接在上模和元件之间，以及元件与基板之间。一个或多个另外的管芯可以堆叠在上模具上并电连接到衬底。此外，可以在基板上布置多个下骰子以支撑桥接在下骰子之间的上骰子。

7. 发明授权

US06403449B1 Method of relieving surface tension on a semiconductor wafer 失效
公开(公告)号：US06403449B1
公开(公告)日：2002-06-11
申请号：US09560827
申请日：2000-04-28
申请人： Michael B. Ball
发明人： Michael B. Ball
IPC分类号： H01L2146
CPC分类号： H01L21/78 , H01L21/3043
摘要： A method used during the manufacture of a semiconductor device comprises providing a semiconductor wafer assembly, the assembly including a plurality of unsegmented semiconductor dice. A coating layer is formed over the semiconductor wafer assembly which causes the wafer to warp, for example through a surface tension exerted on the wafer assembly by the coating layer. To reduce wafer warp a series of grooves is etched or cut into the coating layer. The grooves are believed to relieve surface tension exerted on the wafer by the coating layer. An inventive structure resulting from the method is also described.

8. 发明授权

US06394119B2 Method for conserving a resource by flow interruption 失效
标题翻译：通过流中断节省资源的方法
公开(公告)号：US06394119B2
公开(公告)日：2002-05-28
申请号：US09873736
申请日：2001-06-04
申请人： Michael B. Ball
发明人： Michael B. Ball
IPC分类号： G05D706
CPC分类号： H01L21/67017 , Y10T137/0318 , Y10T137/7759 , Y10T137/86389
摘要： A method of conserving a facility delivered to a machine during the machine's idle mode is herein described. In one embodiment, the method is directed to a method for conserving coolant water delivery to a semiconductor wafer grinding machine. The system monitors the status of the grinder to determine whether the grinder is active or idle. After the system determines the grinder has entered idle mode, the system reduces the flow of water to the machine. In one embodiment, the flow is simply reduced while, in another embodiment, the flow is terminated. A delay circuit in the system may delay the reduction of the flow rate until some point after entering idle mode. Periodically throughout the idle mode, the system increases the flow of coolant water to the grinder to ensure the temperature of all grinder components remains consistent. The duty cycle of the coolant flow may be adjusted to optimize water conservation and machine readiness.
摘要翻译：这里描述了在机器的空闲模式期间节省输送到机器的设施的方法。在一个实施例中，该方法涉及一种用于节省向半导体晶片研磨机的冷却水输送的方法。系统监控研磨机的状态，以确定研磨机是否处于活动状态或空闲状态。系统确定研磨机进入空闲模式后，系统会减少机器的水量。在一个实施例中，简单地减少流量，而在另一个实施例中，流程终止。系统中的延迟电路可能会延迟流量的降低，直到进入空闲模式后的某一点。在整个怠速模式下，系统会逐渐增加冷却水流向研磨机的流量，以确保所有研磨机组件的温度保持一致。可以调节冷却剂流量的占空比以优化节水和机器准备。

9. 发明授权

US06363968B1 System for conserving a resource by flow interruption 失效
标题翻译：通过流中断节省资源的系统
公开(公告)号：US06363968B1
公开(公告)日：2002-04-02
申请号：US09873661
申请日：2001-06-04
申请人： Michael B. Ball
发明人： Michael B. Ball
IPC分类号： G05D706
CPC分类号： H01L21/67017 , Y10T137/0318 , Y10T137/7759 , Y10T137/86389
摘要： A method of conserving a facility delivered to a machine during the machine's idle mode is herein described. In one embodiment, the method is directed to a method for conserving coolant water delivery to a semiconductor wafer grinding machine. The system monitors the status of the grinder to determine whether the grinder is active or idle. After the system determines the grinder has entered idle mode, the system reduces the flow of water to the machine. In one embodiment, the flow is simply reduced while, in another embodiment, the flow is terminated. A delay circuit in the system may delay the reduction of the flow rate until some point after entering idle mode. Periodically throughout the idle mode, the system increases the flow of coolant water to the grinder to ensure the temperature of all grinder components remains consistent. The duty cycle of the coolant flow may be adjusted to optimize water conservation and machine readiness.
摘要翻译：这里描述了在机器的空闲模式期间节省输送到机器的设施的方法。在一个实施例中，该方法涉及一种用于节省向半导体晶片研磨机的冷却水输送的方法。系统监控研磨机的状态，以确定研磨机是否处于活动状态或空闲状态。系统确定研磨机进入空闲模式后，系统会减少机器的水量。在一个实施例中，简单地减少流量，而在另一个实施例中，流程终止。系统中的延迟电路可能会延迟流量的降低，直到进入空闲模式后的某一点。在整个怠速模式下，系统会逐渐增加冷却水流向研磨机的流量，以确保所有研磨机组件的温度保持一致。可以调节冷却剂流量的占空比以优化节水和机器准备。

10. 发明授权

US06334566B1 Device and method for clamping and wire-bonding the leads of a lead frame one set at a time 失效
公开(公告)号：US06334566B1
公开(公告)日：2002-01-01
申请号：US09702568
申请日：2000-10-31
申请人： Michael B. Ball , Rich Fogal
发明人： Michael B. Ball , Rich Fogal
IPC分类号： B23K3704
CPC分类号： H01L24/85 , B23K3/0623 , B23K20/004 , B23K2101/40 , H01L24/48 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/85201 , H01L2224/85205 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

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