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    • 34. 发明授权
    • Technique for confining secondary electrons in plasma-based ion implantation
    • 在等离子体离子注入中限制二次电子的技术
    • US07667208B2
    • 2010-02-23
    • US11550140
    • 2006-10-17
    • Rajesh Dorai
    • Rajesh Dorai
    • H01J37/244H01J37/252
    • H01J37/3266H01J37/32412H01J2237/0045
    • A technique for confining secondary electrons on a wafer is disclosed. In one particular exemplary embodiment, the technique may be realized as an apparatus and method for confining secondary electrons in plasma-based ion implantation. The apparatus and method may comprise a magnetic field portion of a magnetic field configuration placed under a target wafer for generating a magnetic field above the target wafer for confining secondary electrons on the target wafer. The apparatus and method may also comprise a magnetic field above the target wafer that is substantially parallel to an upper surface of the target wafer. The apparatus and method may additionally comprise a magnetic field portion comprising at least one of a plurality of coils, one or more current-carrying wires, and a plurality of magnets.
    • 公开了一种限制二次电子在晶片上的技术。 在一个特定的示例性实施例中,该技术可以被实现为用于限制基于等离子体的离子注入中的二次电子的装置和方法。 该装置和方法可以包括放置在目标晶片之下的磁场结构的磁场部分,用于在目标晶片上产生用于限制目标晶片上的二次电子的磁场。 该装置和方法还可以包括基本上平行于目标晶片的上表面的目标晶片上方的磁场。 该装置和方法可以另外包括磁场部分,其包括多个线圈,一个或多个载流导线和多个磁体中的至少一个。
    • 38. 发明授权
    • Ion implantation with charge neutralization
    • 离子注入与电荷中和
    • US06271529B1
    • 2001-08-07
    • US09083707
    • 1998-05-22
    • Marvin FarleyVadim G. DudnikovMehran Nasser-Ghodsi
    • Marvin FarleyVadim G. DudnikovMehran Nasser-Ghodsi
    • H01S100
    • H01J37/026H01J37/063H01J37/3171H01J2237/0041H01J2237/0042H01J2237/0044H01J2237/0045H05H1/54H05H3/02
    • An ion implanter is provided for implanting ions in a workpiece. The ion implanter includes an apparatus for generating an ion beam and directing it toward a surface of a work piece and a plasma generator for generating plasma to neutralize the ion beam and the work piece surface. The plasma generator has a plasma generator chamber defined by walls, a relatively narrow outlet aperture for plasma produced in the chamber to leave the chamber to neutralize the beam and work piece surface, cathodes, and anodes spaced from the cathodes and from the walls of the chamber. The plasma generator also has magnets arranged within the plasma generator chamber, adjacent the chamber walls to generate a magnetic field to deflect primary electrons emitted from the cathode from directly reaching the anode. The plasma generator also features a conductive shield, positioned within the chamber between the anode and the magnets, the shield having an electric potential selected to deflect electrons, the magnetic field and the conductive shield effective during operation to cause electrons from the cathode to trace extended paths to ionize gas within the chamber to generate plasma before reaching the anode. A drift tube defined by walls through which the ion beam passes before reaching the workpiece is opened into by the aperture opens into the tube. A series of parallel, linear magnets are positioned perpendicular to the general path of the ion beam. The adjacent poles of adjacent magnets are of opposite polarity.
    • 提供离子注入机用于将离子注入到工件中。 离子注入机包括用于产生离子束并将其引导到工件的表面的装置和用于产生等离子体以中和离子束和工件表面的等离子体发生器的装置。 等离子体发生器具有由壁限定的等离子体发生器室,用于在室中产生的等离子体的相对较窄的出口孔,以离开室以中和来自阴极和阴极以及与阴极隔离的工件表面,阴极和阳极 房间。 等离子体发生器还具有布置在等离子体发生器室内的磁体,邻近室壁以产生磁场,以使从阴极发射的一次电子直接到达阳极。 等离子体发生器还具有导电屏蔽,其位于阳极和磁体之间的室内,屏蔽具有选择用于偏转电子的电位,磁场和导电屏蔽在操作期间有效以使来自阴极的电子延伸 在室内电离气体以在到达阳极之前产生等离子体的路径。 由到达工件的离子束通过的由壁限定的漂移管通过孔打开进入管中。 一系列平行的线性磁体垂直于离子束的通用路径定位。 相邻磁体的相邻磁极具有相反的极性。