会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 31. 发明授权
    • Polishing solution retainer
    • 抛光液固定器
    • US07232363B2
    • 2007-06-19
    • US10942600
    • 2004-09-16
    • Hanzhong ZhangFeng LiuStan TsaiRashid MavlievDonald OlgadoLiang-Yuh Chen
    • Hanzhong ZhangFeng LiuStan TsaiRashid MavlievDonald OlgadoLiang-Yuh Chen
    • B24B57/02B24B7/22
    • B24B37/04B24B57/02
    • A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing solution to the polishing pad substantially within the polishing area during the polishing operation. A polishing solution retaining mechanism is attached to one of the base or the carrier head assembly. The retaining mechanism engages a top surface of the polishing pad and retains the polishing solution substantially within the polishing area during the polishing operation. Some implementations may reduce polishing solution consumption and allow for increased angular velocity.
    • 对基板研磨装置和方法进行说明。 基座包括至少一个可移动的压板以接合抛光垫。 在抛光操作期间,至少一个承载头组件基本上在抛光区域内将衬底压靠在抛光垫上。 抛光溶液分配器在抛光操作期间基本上在抛光区域内将抛光溶液施加到抛光垫。 抛光溶液保持机构附接到基座或承载头组件中的一个。 保持机构接合抛光垫的顶表面,并且在抛光操作期间将抛光液基本保持在抛光区域内。 一些实施方案可以减少抛光溶液消耗并允许增加的角速度。
    • 33. 发明申请
    • Perforation and grooving for polishing articles
    • 用于抛光物品的穿孔和开槽
    • US20070066200A9
    • 2007-03-22
    • US11418557
    • 2006-05-05
    • Shijian LiLiang-Yuh ChenAlain Duboust
    • Shijian LiLiang-Yuh ChenAlain Duboust
    • H01L21/306B24D11/00
    • B24B37/24B23H5/08B24B57/02
    • Methods, articles of manufacture, and apparatus are provided for depositing and planarizing one or more layers of material on a substrate, or combinations thereof, are disclosed. In one embodiment, an article of manufacture is provided for polishing a substrate, comprising a polishing article having a polishing surface, a plurality of perforations formed in at least a portion of the polishing article for flow of material therethrough, and a plurality of grooves disposed in the polishing surface. The article of manufacture may be used in a method for processing a substrate, comprising positioning the substrate in an electrolyte solution containing a polishing article, optionally depositing a material on the substrate by an electrochemical deposition method, and polishing the substrate with the polishing article.
    • 提供了方法,制品和装置,用于沉积和平坦化衬底上的一层或多层材料,或其组合。 在一个实施例中,提供了用于抛光衬底的制品,其包括具有抛光表面的抛光制品,在抛光制品的至少一部分中形成的用于材料流动的多个穿孔,以及多个槽, 在抛光面上。 制造物品可以用于处理基材的方法,包括将基底定位在含有抛光制品的电解质溶液中,任选地通过电化学沉积方法将材料沉积在基底上,并用抛光制品抛光基底。