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1. 发明申请

US20070131654A1 Methods and apparatus for processing a substrate 有权
标题翻译：用于处理衬底的方法和设备
公开(公告)号：US20070131654A1
公开(公告)日：2007-06-14
申请号：US11299295
申请日：2005-12-09
申请人： Erik Wasinger , Gary Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Shin , Donald Olgado
发明人： Erik Wasinger , Gary Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Shin , Donald Olgado
IPC分类号： C03C15/00 , H01L21/306
CPC分类号： C03C19/00 , B24B1/04 , B24B9/065 , B24B21/004 , H01L21/02021
摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.
摘要翻译：适于抛光衬底边缘的装置和方法包括抛光膜，适于张紧和加载抛光膜的框架，使得膜的至少一部分被支撑在平面中，以及基板旋转驱动器，其适于旋转衬底抵靠抛光膜的平面，使得抛光膜适于对衬底施加力，轮廓到衬底的边缘，边缘至少包括外边缘和第一斜面，并且抛光外边缘和第一斜面作为基底旋转。提供了许多其他方面。

2. 发明申请

US20070238393A1 METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE 审中-公开
标题翻译：用于抛光衬底边缘的方法和装置
公开(公告)号：US20070238393A1
公开(公告)日：2007-10-11
申请号：US11693695
申请日：2007-03-29
申请人： Ho Shin , Gary Ettinger , Donald Olgado , Erik Wasinger , Sen-Hou Ko , Charles Dodds , Yufei Chen , Wei-Yung Hsu
发明人： Ho Shin , Gary Ettinger , Donald Olgado , Erik Wasinger , Sen-Hou Ko , Charles Dodds , Yufei Chen , Wei-Yung Hsu
IPC分类号： B24B51/00 , B24B49/00 , B24B7/30
CPC分类号： B24B9/065 , B24B21/002 , B24B41/067 , B24B49/16 , B24B57/02
摘要： Methods of and systems for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of one of energy and torque exerted in rotating the substrate against the polishing film. The invention may further include determining an amount of material removed from the edge of the substrate based on the detected energy or torque exerted in rotating the substrate against the polishing film; ascertaining a difference between the determined amount of material removed and a preset polish level; and determining an amount of energy or torque to be exerted in rotating the substrate adapted to attain the preset polish level based on the difference between the determined amount of material removed and the preset polish level. Numerous other aspects are provided.
摘要翻译：提供了抛光衬底边缘的方法和系统。本发明包括将衬底旋转抵靠抛光膜，以便从衬底的边缘去除材料; 并且检测在将衬底旋转抛光膜时施加的能量和扭矩中的一个的量。本发明还可以包括基于在将衬底旋转抛光膜时所检测到的能量或扭矩确定从衬底边缘去除的材料量; 确定确定的去除材料量与预设抛光水平之间的差异; 以及基于所确定的所移除的材料量与所述预设的抛光水平之间的差来确定在旋转所述基板时施加的能量或扭矩的量，所述能量或扭矩适于实现预设的抛光水平。提供了许多其他方面。

3. 发明授权

US07993485B2 Methods and apparatus for processing a substrate 有权
标题翻译：用于处理衬底的方法和设备
公开(公告)号：US07993485B2
公开(公告)日：2011-08-09
申请号：US11299295
申请日：2005-12-09
申请人： Erik C. Wasinger , Gary C. Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Seon Shin , Donald Olgado
发明人： Erik C. Wasinger , Gary C. Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Seon Shin , Donald Olgado
IPC分类号： C03C15/00 , H01I21/306
CPC分类号： C03C19/00 , B24B1/04 , B24B9/065 , B24B21/004 , H01L21/02021
摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.
摘要翻译：适于抛光衬底边缘的装置和方法包括抛光膜，适于张紧和加载抛光膜的框架，使得膜的至少一部分被支撑在平面中，以及基板旋转驱动器，其适于旋转衬底抵靠抛光膜的平面，使得抛光膜适于对衬底施加力，轮廓到衬底的边缘，边缘至少包括外边缘和第一斜面，并且抛光外边缘和第一斜面作为基底旋转。提供了许多其他方面。

4. 发明申请

US20090036033A1 METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE 审中-公开
标题翻译：用于处理基板的方法和装置
公开(公告)号：US20090036033A1
公开(公告)日：2009-02-05
申请号：US12245765
申请日：2008-10-05
申请人： Erik C. Wasinger , Gary C. Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Seon Shin , Donald Olgado
发明人： Erik C. Wasinger , Gary C. Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Seon Shin , Donald Olgado
IPC分类号： B24B1/04 , B24B9/00
CPC分类号： C03C19/00 , B24B1/04 , B24B9/065 , B24B21/004 , H01L21/02021
摘要： A method of cleaning an edge of a substrate is provided. The method comprises tensioning a first polishing film in a frame; contacting the first polishing film against an edge of a substrate; conforming the first polishing film to the edge of the substrate, the edge including an outer edge and at least one bevel; and rotating the substrate while the first polishing film remains in contact with the substrate. Numerous other aspects are provided.
摘要翻译：提供了清洁基板的边缘的方法。该方法包括在框架中张紧第一抛光膜; 使所述第一抛光膜与衬底的边缘接触; 使所述第一抛光膜与所述基板的边缘一致，所述边缘包括外边缘和至少一个斜面; 并且在第一研磨膜与基板保持接触的同时旋转基板。提供了许多其他方面。

5. 发明申请

US20090017731A1 METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE 审中-公开
标题翻译：用于处理基板的方法和装置
公开(公告)号：US20090017731A1
公开(公告)日：2009-01-15
申请号：US12239730
申请日：2008-09-26
申请人： Gary C. Ettinger , Erik C. Wasinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Seon Shin , Donald Olgado
发明人： Gary C. Ettinger , Erik C. Wasinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Seon Shin , Donald Olgado
IPC分类号： B24B1/00
CPC分类号： B24B9/065 , B24B21/002 , B24B41/002 , H01L21/02021
摘要： Methods and apparatus for cleaning an edge of a substrate are provided. The invention includes a polishing film having a polishing side and a second side; an inflatable pad disposed adjacent the second side of the polishing film; a frame adapted to support the polishing film and the inflatable pad; and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film, wherein the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate with the polishing film contacting the edge of the substrate. Numerous other aspects are provided.
摘要翻译：提供了用于清洁基板边缘的方法和设备。本发明包括具有抛光侧和第二面的抛光膜; 邻近抛光膜的第二侧设置的可充气垫; 适于支撑抛光膜和可充气垫的框架; 以及衬底旋转驱动器，其适于将衬底旋转抵靠所述抛光膜的抛光侧，其中所述抛光膜设置在所述衬底的边缘和所述可充气垫之间，使得所述可充气衬垫和抛光膜轮廓到所述衬底的边缘抛光膜与基板的边缘接触。提供了许多其他方面。

6. 发明申请

US20060243304A1 Methods and apparatus for cleaning an edge of a substrate 审中-公开
标题翻译：用于清洁衬底边缘的方法和设备
公开(公告)号：US20060243304A1
公开(公告)日：2006-11-02
申请号：US11411012
申请日：2006-04-24
申请人： Wei-Yung Hsu , Donald Olgado , Ho Shin , Liang-Yuh Chen
发明人： Wei-Yung Hsu , Donald Olgado , Ho Shin , Liang-Yuh Chen
IPC分类号： B08B7/00 , B08B5/04
CPC分类号： H01L21/67046 , B08B1/04 , H01L21/67028
摘要： In one aspect, a method for cleaning an edge of a substrate is provided. The method includes the steps of (a) supporting a substrate on a rotatable substrate support; (b) contacting an edge of the substrate with one or more rollers; (c) rotating the substrate support so as to rotate the substrate; and (d) rotating the one or more rollers so as to clean the edge of the substrate Numerous other aspects are provided.
摘要翻译：一方面，提供一种清洗基板的边缘的方法。该方法包括以下步骤：（a）将基板支撑在可旋转的基板支撑件上; （b）使所述基板的边缘与一个或多个辊接触; （c）旋转衬底支撑件以旋转衬底; 和（d）旋转所述一个或多个辊以便清洁所述基底的边缘。提供许多其它方面。

7. 发明授权

US07749048B2 Polishing pad conditioning process 失效
标题翻译：抛光垫调理过程
公开(公告)号：US07749048B2
公开(公告)日：2010-07-06
申请号：US11744552
申请日：2007-05-04
申请人： James C. Wang , Hung K. Nguyen , Sen-Hou Ko , Wei-Yung Hsu
发明人： James C. Wang , Hung K. Nguyen , Sen-Hou Ko , Wei-Yung Hsu
IPC分类号： B24B53/00 , B24B51/00
CPC分类号： B24B53/017 , B24B37/042
摘要： A method of operating a polishing apparatus in which a substrate is held with a carrier head supported by a movable support of the polishing apparatus, the substrate is brought into contact with a polishing surface at a polishing station of the polishing apparatus and the substrate is polished, the substrate is removed from the polishing surface, the support moves to transfer the carrier head to a different station of the polishing apparatus, and the polishing surface is conditioned. The conditioning overlaps with at least one of removing the substrate or moving the support.
摘要翻译：一种操作抛光装置的方法，其中基板被保持有由抛光装置的可移动支撑件支撑的载体头，所述基板在抛光装置的抛光站处与抛光表面接触，并且所述基板被抛光将基板从抛光表面移除，支撑件移动以将载体头转移到抛光装置的不同工位，并调整抛光表面。调理与去除衬底或移动支撑体中的至少一个重叠。

8. 发明授权

US07175505B1 Method for adjusting substrate processing times in a substrate polishing system 有权
标题翻译：在基板研磨系统中调整基板处理时间的方法
公开(公告)号：US07175505B1
公开(公告)日：2007-02-13
申请号：US11328959
申请日：2006-01-09
申请人： Sen-Hou Ko , Harry Q. Lee , Wei-Yung Hsu
发明人： Sen-Hou Ko , Harry Q. Lee , Wei-Yung Hsu
IPC分类号： B24B49/00
CPC分类号： B24B37/04 , B24B27/0023 , B24B49/00
摘要： Aspects of the present invention include a method and an apparatus that may be utilized to adjust processing times in a substrate processing system. In one embodiment of the present invention, a pre-processing thickness measurement of a substrate while the substrate is in one of the polishing stations is taken. Then the substrate is processed in the polishing system for a predetermined processing time. A post-processing thickness measurement is taken while the substrate is in one of the polishing stations. A removal rate is calculated based on the pre-processing and the post-processing measurements and the predetermined processing time. A processing time is adjusted for one or more of the polishing stations based on the removal rate for use in subsequent processing of a production substrate.
摘要翻译：本发明的方面包括可用于调整基板处理系统中的处理时间的方法和装置。在本发明的一个实施例中，采用基板在其中一个抛光台中的基板的预处理厚度测量。然后在抛光系统中处理基板达预定的处理时间。在基板位于一个抛光站中时，进行后处理厚度测量。基于预处理和后处理测量以及预定处理时间计算去除率。基于用于生产基板的后续处理的去除速率来调整一个或多个抛光站的处理时间。

9. 发明申请

US20080293331A1 METHODS AND APPARATUS FOR LOW COST AND HIGH PERFORMANCE POLISHING TAPE FOR SUBSTRATE BEVEL AND EDGE POLISHING IN SEMINCONDUCTOR MANUFACTURING 审中-公开
标题翻译：低成本和高性能抛光胶带的方法和装置，用于在晶体管制造中进行基板水平和边缘抛光
公开(公告)号：US20080293331A1
公开(公告)日：2008-11-27
申请号：US12124153
申请日：2008-05-21
申请人： Yufei Chen , Zhenhua Zhang , Sen-Hou Ko , Wei-Yung Hsu , Makoto Matsuo
发明人： Yufei Chen , Zhenhua Zhang , Sen-Hou Ko , Wei-Yung Hsu , Makoto Matsuo
IPC分类号： B24B9/06 , C08J5/14
CPC分类号： B24B9/065 , B24B21/002
摘要： Apparatus and methods are provided relating to polishing a substrate using a polishing device, such as a polishing tape. The polishing device may be formed to include a base, a resin layer adhering to the base, and a plurality of embossed abrasive particles and/or abrasive beads affixed to the base by the resin layer. The plurality of abrasive particles and/or beads may be embossed in the resin layer. The plurality of abrasive beads may include a plurality of abrasive particles suspended in binder material. The plurality of abrasive particles and/or beads and the resin layer combine to form an abrasive side of the polishing device adapted to contact the substrate. Polishing of the substrate preferably includes polishing an edge of the substrate while the substrate is rotated by a holding device such that no apparatus other than the polishing tape contacts the edge while the substrate is rotating.
摘要翻译：提供的装置和方法涉及使用诸如抛光带的抛光装置来抛光衬底。抛光装置可以形成为包括基底，粘附到基底的树脂层和由树脂层固定到基底的多个压花磨料颗粒和/或研磨珠。多个研磨颗粒和/或珠可以在树脂层中压花。多个研磨珠可以包括悬挂在粘合剂材料中的多个磨料颗粒。多个研磨颗粒和/或珠粒和树脂层组合形成适于接触基底的抛光装置的研磨侧。衬底的抛光优选包括在通过保持装置旋转衬底的同时抛光衬底的边缘，使得除了研磨带之外的其它装置在衬底旋转时不接触边缘。

10. 发明申请

US20090036042A1 METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE 审中-公开
标题翻译：用于抛光衬底边缘的方法和装置
公开(公告)号：US20090036042A1
公开(公告)日：2009-02-05
申请号：US12239725
申请日：2008-09-26
申请人： Ho Seon Shin , Gary C. Ettinger , Donald J. K. Olgado , Erik C. Wasinger , Sen-Hou Ko , Charles I. Dodds , Yufei Chen , Wei-Yung Hsu
发明人： Ho Seon Shin , Gary C. Ettinger , Donald J. K. Olgado , Erik C. Wasinger , Sen-Hou Ko , Charles I. Dodds , Yufei Chen , Wei-Yung Hsu
IPC分类号： B24B5/00
CPC分类号： B24B9/065 , B24B21/002 , B24B41/067 , B24B49/16 , B24B57/02
摘要： Methods, systems and apparatus are provided for polishing an edge of a substrate. The invention includes an apparatus adapted to apply a preset pressure to a polishing film in contact with an edge of a substrate. The apparatus includes an actuator adapted to apply a preset pressure to the polishing film; and a controller coupled to the actuator and adapted to receive a signal indicative of a condition of the edge of the substrate, and to adjust a pressure applied by the actuator to the polishing film so as to maintain the preset pressure based on the received signal. Numerous other aspects are provided.
摘要翻译：提供了用于抛光衬底边缘的方法，系统和装置。本发明包括适于将预设压力施加到与衬底的边缘接触的抛光膜的装置。该装置包括致动器，其适于对抛光膜施加预设压力; 以及控制器，其耦合到所述致动器并且适于接收指示所述基板的边缘的状态的信号，并且调整由所述致动器施加到所述抛光膜的压力，以便基于所接收的信号来保持所述预设压力。提供了许多其他方面。

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