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31. 发明授权

US08547429B2 Apparatus and method for monitoring semiconductor device manufacturing process 有权
标题翻译：用于监测半导体器件制造工艺的装置和方法
公开(公告)号：US08547429B2
公开(公告)日：2013-10-01
申请号：US12379645
申请日：2009-02-26
申请人： Toshifumi Honda , Yuuji Takagi
发明人： Toshifumi Honda , Yuuji Takagi
IPC分类号： H04N5/253 , G06K9/00
CPC分类号： G06T7/0006 , G06T2207/10061 , G06T2207/30148 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A hotspot searching apparatus manufactures a small number of chips or regions on a semiconductor wafer under respectively different manufacturing process conditions, compares SEM images of their external appearances to output a point having large differences as a narrow process window, that is, a process monitoring point that should be managed in mass production, the narrow process window having a narrow manufacturing process condition (exposure condition) in the manufacturing of the semiconductor wafer, and sets the point as a measurement point by a CD-SEM apparatus, such that it extracts and determines plural circuit pattern parts having a narrow manufacturing process margin as the process monitoring point in a short time and a process monitoring point monitoring performs shape inspection or shape length measurement in detail at high resolution.
摘要翻译：热点搜索装置分别在不同的制造工艺条件下制造半导体晶片上的少量芯片或区域，比较其外观的SEM图像以输出具有较大差异的点作为窄工艺窗口，即处理监视点应在大规模生产中进行管理，在半导体晶片的制造中具有窄制造工艺条件（曝光条件）的窄工艺窗口，并且通过CD-SEM装置将点设定为测量点，使得其提取和在短时间内确定具有窄制造工艺余量的多个电路图形部分作为处理监视点，并且处理监视点监视以高分辨率详细地进行形状检查或形状长度测量。

32. 发明授权

US08509516B2 Circuit pattern examining apparatus and circuit pattern examining method 有权
标题翻译：电路图案检查装置及电路图案检查方法
公开(公告)号：US08509516B2
公开(公告)日：2013-08-13
申请号：US13056046
申请日：2009-07-13
申请人： Takashi Hiroi , Takeyuki Yoshida , Naoki Hosoya , Toshifumi Honda
发明人： Takashi Hiroi , Takeyuki Yoshida , Naoki Hosoya , Toshifumi Honda
IPC分类号： G06K9/00
CPC分类号： G01N21/9501 , G01N21/95607 , G06T7/001 , G06T2207/10061 , G06T2207/30148 , H01L22/12
摘要： Provided is an examination technique to detect defects with high sensitivity at an outer-most repetitive portion of a memory mat of a semiconductor device and even in a peripheral circuit having no repetitiveness.A circuit pattern inspection apparatus comprises an image detection unit for acquiring an image of a circuit pattern composed of multiple die having a repetitive pattern, a defect judgment unit which composes, in respect of an acquired detected image, reference images by switching addition objectives depending on regions of repetitive pattern and the other regions and compares a composed reference image with the detected image to detect a defect, and a display unit for displaying the image of the detected defect.
摘要翻译：提供了一种检测技术，用于在半导体器件的存储器垫的最外侧重复部分以及甚至在不具有重复性的外围电路中检测高灵敏度的缺陷。电路图案检查装置包括：图像检测单元，用于获取由具有重复图案的多个模具组成的电路图案的图像;缺陷判断单元，其针对所获取的检测图像构成参考图像，其根据重复图案的区域和其他区域，并且将组合的参考图像与检测到的图像进行比较以检测缺陷;以及显示单元，用于显示检测到的缺陷的图像。

33. 发明申请

US20130141715A1 FAULT INSPECTION DEVICE AND FAULT INSPECTION METHOD 有权
标题翻译：故障检测设备和故障检测方法
公开(公告)号：US20130141715A1
公开(公告)日：2013-06-06
申请号：US13703414
申请日：2011-05-20
申请人： Yuta Urano , Shigenobu Maruyama , Toshiyuki Nakao , Toshifumi Honda , Yukihiro Shibata
发明人： Yuta Urano , Shigenobu Maruyama , Toshiyuki Nakao , Toshifumi Honda , Yukihiro Shibata
IPC分类号： G01N21/88
CPC分类号： G01N21/94 , G01N21/47 , G01N21/8806 , G01N21/9501 , G01N21/956 , G01N2021/4711 , G01N2021/8867 , G01N2021/8874 , G01N2201/0806 , G01N2201/10
摘要： Proposed is a defect inspection method whereby: illuminating light having a substantially uniform illumination intensity distribution in one direction of a sample surface irradiated on the sample surface; multiple scattered light components, which are output in multiple independent directions, are detected among the scattered light from the sample surface and multiple corresponding scattered light detection signals are obtained; at least one of the multiple scattered light detection signals is processed and the presence of defects is determined; at least one of the multiple scattered light detection signals that correspond to each of the points determined by the processing as a defect is processed and the dimensions of the defect are determined; and the position and dimensions of the defect on the sample surface, at each of the points determined as a defect, are displayed.
摘要翻译：提出了一种缺陷检查方法，其中：照射在样品表面上的样品表面的一个方向具有基本上均匀的照明强度分布的光; 在来自样品表面的散射光中检测多个独立方向输出的多个散射光分量，并获得多个相应的散射光检测信号; 处理多个散射光检测信号中的至少一个并确定缺陷的存在; 处理与通过处理确定的每个点对应的多个散射光检测信号中的至少一个作为缺陷，并确定缺陷的尺寸; 并且显示在被确定为缺陷的每个点处的样品表面上的缺陷的位置和尺寸。

34. 发明申请

US20130114078A1 DEFECT INSPECTION METHOD AND DEVICE THEREFOR 有权
标题翻译：缺陷检查方法及其设备
公开(公告)号：US20130114078A1
公开(公告)日：2013-05-09
申请号：US13701030
申请日：2011-05-25
申请人： Toshifumi Honda , Yuta Urano , Yukihiro Shibata , Toshiyuki Nakao
发明人： Toshifumi Honda , Yuta Urano , Yukihiro Shibata , Toshiyuki Nakao
IPC分类号： G01N21/88
CPC分类号： G01N21/8806 , G01N21/9501 , G01N2021/8874
摘要： Disclosed is a defect inspection method which makes it possible to scan the entire surface of a sample and detect minute defects without causing thermal damage to the sample. A defect inspection method in which a pulse laser emitted from a light source is subjected to pulse division and irradiated on the surface of a sample which moves in one direction while the divided-pulse pulse laser is rotated, reflection light from the sample irradiated by the divided-pulse pulse laser is detected, the signal of the detected reflection light is processed to detect defects on the sample, and information regarding a detected defect is output to a display screen, wherein the barycentric position of the light intensity of the divided-pulse pulse laser is monitored and adjusted.
摘要翻译：公开了一种缺陷检查方法，其可以扫描样品的整个表面并检测微小缺陷而不会对样品造成热损伤。对从光源射出的脉冲激光进行脉冲分割并照射在分割脉冲激光器旋转时在一个方向上移动的样品的表面的缺陷检查方法中，检测出分割脉冲脉冲激光，检测出反射光的信号，以检测样本上的缺陷，将与检测到的缺陷有关的信息输出到显示画面，其中分割脉冲的光强度的重心位置脉冲激光被监测和调整。

35. 发明申请

US20130070078A1 METHOD AND DEVICE FOR TESTING DEFECT USING SEM 有权
标题翻译：使用SEM测试缺陷的方法和装置
公开(公告)号：US20130070078A1
公开(公告)日：2013-03-21
申请号：US13520210
申请日：2010-12-22
申请人： Yuji Takagi , Minoru Harada , Ryo Nakagaki , Naoki Hosoya , Toshifumi Honda , Takehiro Hirai
发明人： Yuji Takagi , Minoru Harada , Ryo Nakagaki , Naoki Hosoya , Toshifumi Honda , Takehiro Hirai
IPC分类号： H04N7/18
CPC分类号： G06T7/001 , G06T2207/10061 , G06T2207/20081 , G06T2207/30148 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large.
摘要翻译：在使用复查SEM执行电路图案的编程点检查时，即使在要检查的电路图案的变化大的情况下，也可以抑制误报的产生而进行稳定的检查。通过使用评价SEM将预定电路图案顺序成像获得的SEM图像存储在存储单元中。从存储的SEM图像中选择满足设定条件的图像，并平均以创建平均图像（GP图像）。通过使用该GP图像通过GP比较进行模式检查，即使当电路图案的变化大时也可以在抑制伪报告的产生的同时执行检查。

36. 发明申请

US20120133928A1 DEFECT INSPECTION DEVICE AND INSPECTION METHOD 有权
标题翻译：缺陷检查装置和检查方法
公开(公告)号：US20120133928A1
公开(公告)日：2012-05-31
申请号：US13378418
申请日：2010-06-09
申请人： Yuta Urano , Shigenobu Maruyama , Toshiyuki Nakao , Toshifumi Honda
发明人： Yuta Urano , Shigenobu Maruyama , Toshiyuki Nakao , Toshifumi Honda
IPC分类号： G01N21/47 , G01N21/55
CPC分类号： G01N21/9501 , G01N2021/8861 , G01N2021/8874
摘要： A defect inspection method wherein illumination light having a substantially uniform illumination intensity distribution in a certain direction on the surface of a specimen is radiated onto the surface of the specimen; wherein multiple components of those scattered light beams from the surface of the specimen which are emitted mutually different directions are detected, thereby obtaining corresponding multiple scattered light beam detection signals; wherein the multiple scattered light beam detection signals is subjected to processing, thereby determining the presence of defects; wherein the corresponding multiple scattered light detecting signals is processed with respect to all of the spots determined to be defective by the processing, thereby determining the sizes of defects; and wherein the defect locations on the specimen and the defect sizes are displayed with respect to all of the spots determined to be defective by the processing.
摘要翻译：一种缺陷检查方法，其中将在试样表面上沿某一方向具有基本均匀的照明强度分布的照明光辐射到样品的表面上; 其中检测出来自样本表面的这些散射光束相互不同方向发射的多个分量，从而获得相应的多个散射光束检测信号; 其中对所述多个散射光束检测信号进行处理，由此确定缺陷的存在; 其中相应的多个散射光检测信号相对于通过处理确定为有缺陷的所有点进行处理，从而确定缺陷的尺寸; 并且其中相对于通过处理确定为有缺陷的所有点显示样本上的缺陷位置和缺陷尺寸。

37. 发明授权

US08150141B2 Defect classifier using classification recipe based on connection between rule-based and example-based classifiers 有权
标题翻译：基于基于规则和基于实例的分类器之间的连接的分类配方的缺陷分类器
公开(公告)号：US08150141B2
公开(公告)日：2012-04-03
申请号：US13183488
申请日：2011-07-15
申请人： Ryo Nakagaki , Masaki Kurihara , Toshifumi Honda
发明人： Ryo Nakagaki , Masaki Kurihara , Toshifumi Honda
IPC分类号： G06K9/00
CPC分类号： G06T7/0006 , G06K9/6256 , G06T7/0004 , G06T7/001 , G06T2207/10056 , G06T2207/10061 , G06T2207/30148
摘要： In apparatuses for automatically acquiring and also for automatically classifying images of defects present on a sample such as a semiconductor wafer, a classifying system is provided which are capable of readily accepting even such a case that a large number of classification classes are produced based upon a request issued by a user, and also even such a case that a basis of the classification class is changed in a high frequency. When the user defines the classification classes, a device for designating attributes owned by the respective classification classes is provided. The classifying system automatically changes a connecting mode between an internally-provided rule-based classifier and an example-based classifier, so that such a classifying system which is fitted to the classification basis of the user is automatically constructed.
摘要翻译：在用于自动获取并且还自动分类诸如半导体晶片的样本上存在的缺陷的图像的设备中，提供了能够容易地接受甚至基于以下情况产生大量分类等级的情况的分类系统由用户发出的请求，甚至是分类等级的基础被高频地改变的情况。当用户定义分类类时，提供用于指定由各个分级类所拥有的属性的设备。分类系统自动地在内部提供的基于规则的分类器和基于示例的分类器之间改变连接模式，从而自动构建适合用户分类基础的这样的分类系统。

38. 发明授权

US08090190B2 Method and apparatus for reviewing defects 有权
标题翻译：检查缺陷的方法和装置
公开(公告)号：US08090190B2
公开(公告)日：2012-01-03
申请号：US12695090
申请日：2010-01-27
申请人： Ryo Nakagaki , Toshifumi Honda
发明人： Ryo Nakagaki , Toshifumi Honda
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30148
摘要： An apparatus for reviewing defects including an image processing section (defect classification device section) with a function of estimating a non-defective state (reference image) of a portion in which the defect exists by use of a defect image, and a function of judging criticality or non-flat state of the defect by use of the estimation result. It becomes possible to establish both of a high-throughput image collecting sequence in which any reference image is not acquired and high-precision defect classification, and then to realize both of a high performance classifying function and a high-throughput image collecting function in a defect reviewing apparatus which automatically collects and classifies images of defects existing on a sample of a semiconductor wafer or the like.
摘要翻译：一种用于检查缺陷的装置，包括具有通过使用缺陷图像来估计存在缺陷的部分的非缺陷状态（参考图像）的功能的图像处理部分（缺陷分类装置部分），以及判断通过使用估计结果，缺陷的关键性或非平坦状态。可以建立不获取任何参考图像的高通量图像采集序列和高精度缺陷分类，然后实现高性能分类功能和高吞吐量图像采集功能缺陷检查装置，其自动地收集和分类存在于半导体晶片等的样本上的缺陷的图像。

39. 发明申请

US20110242524A1 FLAT SURFACE INSPECTION APPARATUS 审中-公开
标题翻译：平面检查装置
公开(公告)号：US20110242524A1
公开(公告)日：2011-10-06
申请号：US13007433
申请日：2011-01-14
申请人： YUKI SHIMIZU , Junguo Xu , Shigeo Nakamura , Toshiyuki Nakao , Toshihiko Nakata , Toshifumi Honda
发明人： YUKI SHIMIZU , Junguo Xu , Shigeo Nakamura , Toshiyuki Nakao , Toshihiko Nakata , Toshifumi Honda
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/47
摘要： An object is to provide a flat surface inspection apparatus that can prevent sliders from being damaged and detect micro defects. A flat surface inspection apparatus includes: a measured subject; a stage that supports the measured subject; a spindle that rotates the stage; a first part having light sources applying light beam onto the measured subject, a scattered-light-detecting section, a signal processing section that converts the scattered light into information about a first defect, and a first memory section that stores therein the information about the first defect; and a second part having sliders mounted with a contact sensor that detects a second defect smaller than the first defect, a loading/unloading mechanism that flies the slider over the measured subject, a slider control section that controls the loading/unloading mechanism based on the information about the first defects and second defects.
摘要翻译：本发明的目的是提供一种能够防止滑块损坏并检测微缺陷的平面检查装置。平面检查装置包括：测量对象; 支持被测科目的阶段; 旋转舞台的主轴; 具有将光束施加到测量对象上的第一部分，散射光检测部分，将散射光转换成关于第一缺陷的信息的信号处理部分，以及存储关于第一缺陷的信息的第一存储部分第一缺陷; 以及第二部分，其具有安装有接触传感器的滑块，所述接触传感器检测到比所述第一缺陷小的第二缺陷;在所述测量对象上飞行所述滑块的装载/卸载机构;滑块控制部，其基于所述滑块控制部关于第一个缺陷和第二个缺陷的信息。

40. 发明授权

US07991217B2 Defect classifier using classification recipe based on connection between rule-based and example-based classifiers 有权
标题翻译：基于基于规则和基于实例的分类器之间的连接的分类配方的缺陷分类器
公开(公告)号：US07991217B2
公开(公告)日：2011-08-02
申请号：US11704350
申请日：2007-02-09
申请人： Ryo Nakagaki , Masaki Kurihara , Toshifumi Honda
发明人： Ryo Nakagaki , Masaki Kurihara , Toshifumi Honda
IPC分类号： G06K9/00
CPC分类号： G06T7/0006 , G06K9/6256 , G06T7/0004 , G06T7/001 , G06T2207/10056 , G06T2207/10061 , G06T2207/30148
摘要： In apparatuses for automatically acquiring and also for automatically classifying images of defects present on a sample such as a semiconductor wafer, a classifying system is provided which are capable of readily accepting even such a case that a large number of classification classes are produced based upon a request issued by a user, and also even such a case that a basis of the classification class is changed in a high frequency. When the user defines the classification classes, a device for designating attributes owned by the respective classification classes is provided. The classifying system automatically changes a connecting mode between an internally-provided rule-based classifier and an example-based classifier, so that such a classifying system which is fitted to the classification basis of the user is automatically constructed.
摘要翻译：在用于自动获取并且还自动分类诸如半导体晶片的样本上存在的缺陷的图像的设备中，提供了能够容易地接受甚至基于以下情况产生大量分类等级的情况的分类系统由用户发出的请求，甚至是分类等级的基础被高频地改变的情况。当用户定义分类类时，提供用于指定由各个分级类所拥有的属性的设备。分类系统自动地在内部提供的基于规则的分类器和基于示例的分类器之间改变连接模式，从而自动构建适合用户分类基础的这样的分类系统。

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