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    • 36. 发明授权
    • Method for making spectrally efficient photodiode structures for CMOS color imagers
    • CMOS彩色成像器制作光谱效率高的光电二极管结构的方法
    • US06707080B2
    • 2004-03-16
    • US10320296
    • 2002-12-16
    • Ching-Chun WangDun-Nian YaungChien-Hsien TsengShou-Gwo Wuu
    • Ching-Chun WangDun-Nian YaungChien-Hsien TsengShou-Gwo Wuu
    • H01L31062
    • H01L27/14645
    • A method for making an array of photodiodes with more uniform optical spectral response for the red, green, and blue pixel cells on a CMOS color imager is achieved. After forming a field oxide on a substrate to electrically isolate device areas for CMOS circuits, an array of deep N doped wells is formed for photodiodes for the long wavelength red pixel cells. An array of P doped well regions is formed adjacent to and interlaced with the N doped wells. Shallow diffused N+ regions are formed within the P doped wells for the shorter wavelength green and blue color pixels cells. The shallow diffused photodiodes improve the quantum efficiency (QE), and provide a color imager with improved color fidelity. An insulating layer and appropriate dye materials are deposited and patterned over the photodiodes to provide the array of color pixel cells. The N and P doped wells are also used for the supporting FET CMOS circuits to provide a cost-effective manufacturing process.
    • 实现了对CMOS彩色成像器上的红色,绿色和蓝色像素单元制造具有更均匀的光谱响应的光电二极管阵列的方法。 在衬底上形成场氧化物以电隔离CMOS电路的器件区域后,形成用于长波长红色像素单元的光电二极管的深N掺杂阱的阵列。 与N个掺杂的阱相邻并且与其交错形成P掺杂阱区的阵列。 在较短波长的绿色和蓝色像素单元的P掺杂阱内形成浅扩散的N +区。 浅扩散光电二极管提高了量子效率(QE),并提供了具有改进的色彩保真度的彩色成像仪。 在光电二极管上沉积并图案化绝缘层和适当的染料材料以提供彩色像素单元阵列。 N和P掺杂阱也用于支持FET CMOS电路以提供成本有效的制造工艺。
    • 38. 发明授权
    • Method for making spectrally efficient photodiode structures for CMOS color imagers
    • CMOS彩色成像器制作光谱效率高的光电二极管结构的方法
    • US06518085B1
    • 2003-02-11
    • US09635584
    • 2000-08-09
    • Ching-Chun WangDun-Nian YaungChien-Hsien TsengShou-Gwo Wuu
    • Ching-Chun WangDun-Nian YaungChien-Hsien TsengShou-Gwo Wuu
    • H01L2100
    • H01L27/14645
    • A method for making an array of photodiodes with more uniform optical spectral response for the red, green, and blue pixel cells on a CMOS color imager is achieved. After forming a field oxide on a substrate to electrically isolate device areas for CMOS circuits, an array of deep N doped wells is formed for photodiodes for the long wavelength red pixel cells. An array of P doped well regions is formed adjacent to and interlaced with the N doped wells. Shallow diffused N+ regions are formed within the P doped wells for the shorter wavelength green and blue color pixels cells. The shallow diffused photodiodes improve the quantum efficiency (QE), and provide a color imager with improved color fidelity. An insulating layer and appropriate dye materials are deposited and patterned over the photodiodes to provide the array of color pixel cells. The N and P doped wells are also used for the supporting FET CMOS circuits to provide a cost-effective manufacturing process.
    • 实现了对CMOS彩色成像器上的红色,绿色和蓝色像素单元制造具有更均匀的光谱响应的光电二极管阵列的方法。 在衬底上形成场氧化物以电隔离CMOS电路的器件区域后,形成用于长波长红色像素单元的光电二极管的深N掺杂阱的阵列。 与N个掺杂的阱相邻并且与其交错形成P掺杂阱区的阵列。 在较短波长的绿色和蓝色像素单元的P掺杂阱内形成浅扩散的N +区。 浅扩散光电二极管提高了量子效率(QE),并提供了具有改进的色彩保真度的彩色成像仪。 在光电二极管上沉积并图案化绝缘层和适当的染料材料以提供彩色像素单元阵列。 N和P掺杂阱也用于支持FET CMOS电路以提供成本有效的制造工艺。
    • 39. 发明授权
    • Photodiode with tightly-controlled junction profile for CMOS image sensor with STI process
    • 光电二极管具有紧密控制的结型剖面,用于具有STI工艺的CMOS图像传感器
    • US06372603B1
    • 2002-04-16
    • US09612186
    • 2000-07-07
    • Dun-Nian YaungShou-Gwo WuuChien-Hsien Tseng
    • Dun-Nian YaungShou-Gwo WuuChien-Hsien Tseng
    • H01L2176
    • H01L27/14689H01L21/76237H01L21/823878H01L27/14609
    • A method for forming a high performance photodiode with tightly-controlled junction profile for CMOS image sensor with STI process. The following steps are performed: providing a substrate; forming a hard mask layer for defining a pattern on the substrate; etching the substrate on the surface of the substrate not covered by the hard mask layer to form a shallow trench; growing an oxide lining in the shallow trench by a thermal oxidation process; performing a first thermal annealing; defining an n-well region in the shallow trench; implanting the n-well region; performing a second thermal annealing; forming a silicon oxide layer on the substrate to fill in the shallow trench; removing a portion of the silicon oxide layer on the substrate such that the portion in the shallow trench remains; removing the hard mask layer; and forming a transistor on the substrate, wherein the transistor comprises a gate structure, a source region, and a drain region.
    • 一种用于具有STI工艺的CMOS图像传感器的具有紧密控制的结形状的高性能光电二极管的方法。 执行以下步骤:提供衬底; 形成用于在所述基板上限定图案的硬掩模层; 蚀刻未被硬掩模层覆盖的衬底的表面上的衬底,以形成浅沟槽; 通过热氧化过程在浅沟槽中生长氧化物衬里; 执行第一热退火; 在浅沟槽中限定n阱区域; 植入n阱区; 进行第二热退火; 在衬底上形成氧化硅层以填充浅沟槽; 去除衬底上的氧化硅层的一部分,使得浅沟槽中的部分保留; 去除硬掩模层; 以及在所述衬底上形成晶体管,其中所述晶体管包括栅极结构,源极区和漏极区。
    • 40. 发明授权
    • Double spacer technology for making self-aligned contacts (SAC) on
semiconductor integrated circuits
    • 用于在半导体集成电路上制作自对准触点(SAC)的双间隔技术
    • US6165880A
    • 2000-12-26
    • US94869
    • 1998-06-15
    • Dun-Nian YaungShou-Gwo WuuLi-Chih ChaoKuo Ching Huang
    • Dun-Nian YaungShou-Gwo WuuLi-Chih ChaoKuo Ching Huang
    • H01L21/285H01L21/3205H01L21/60H01L21/4763
    • H01L21/76897H01L21/28525H01L21/32053
    • A method was achieved for making improved self-aligned contacts (SAC) to a patterned polysilicon layer, such as gate electrodes for FETs. Lightly doped source/drain areas are implanted. A second insulating layer is deposited and etched back to form first sidewall spacers. A silicon nitride etch-stop layer and a first interpolysilicon oxide (IPO1) layer are deposited. First SAC openings are etched in the IPO1 layer to the etch-stop layer, and concurrently openings are etched for the gate electrodes, eliminating a masking step. The etch-stop layer is etched in the SAC openings to form second sidewall spacers that protect the first sidewall spacers during BOE cleaning of the contacts. A patterned polycide layer is used to make SACs and electrical interconnections. A second IPO layer is deposited to provide insulation, and an interlevel dielectric layer is deposited. Second SAC openings are etched to the etch-stop layer for the next level of metal interconnections, while the contact openings to the gate electrodes are etched to completion. The etch-stop layer is etched in the second SAC openings to form second sidewall spacers to protect the first sidewall spacers during cleaning. Metal plugs are formed from a first metal in the second SAC openings and in the openings to the gate electrodes. A second metal is patterned to complete the structure to the first level of metal interconnections.
    • 实现了对图案化多晶硅层(例如FET的栅电极)进行改进的自对准接触(SAC)的方法。 植入轻掺杂的源极/漏极区域。 沉积第二绝缘层并回蚀刻以形成第一侧壁间隔物。 沉积氮化硅蚀刻停止层和第一多晶硅化硅(IPO1)层。 在IPO1层中蚀刻第一SAC开口到蚀刻停止层,同时蚀刻用于栅电极的开口,从而消除掩模步骤。 在SAC开口中蚀刻蚀刻停止层以形成第二侧壁间隔物,其在接触的BOE清洁期间保护第一侧壁间隔物。 使用图案化的多晶硅化合物层来制造SAC和电互连。 沉积第二个IPO层以提供绝缘,并且沉积层间电介质层。 将第二SAC开口蚀刻到蚀刻停止层以进行下一级金属互连,同时蚀刻到栅电极的接触开口以完成。 在第二SAC开口中蚀刻蚀刻停止层以形成第二侧壁间隔物,以在清洁期间保护第一侧壁间隔物。 金属插塞由第二SAC开口中的第一金属和与栅电极的开口形成。 图案化第二金属以将结构完成到第一级金属互连。