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31. 发明授权

US07949187B2 Character string recognition method and device 有权
标题翻译：字符串识别方法和装置
公开(公告)号：US07949187B2
公开(公告)日：2011-05-24
申请号：US11693139
申请日：2007-03-29
申请人： Hiroshi Nakamura
发明人： Hiroshi Nakamura
IPC分类号： G06K9/34 , G06K9/38 , G06K9/18 , G06K9/00 , G06K15/02 , H04N1/40
CPC分类号： G06K9/3283 , G06K2209/01
摘要： A character string recognition method for recognizing a character string may include a first step in which a first projection data of image data are calculated in a direction of the character string and a second step in which a position of the character string is detected on the basis of the first projection data. In the first step, the image data are divided into a plurality of segments in the direction of the character string and projection in the segment is calculated. The method may further include a third step in which a second projection data in the segment are calculated on the basis of the position of the character string and a fourth step in which a position where the second projection data exceeds a threshold value is detected as a boundary position of a character, and the threshold value may be changed according to pixel number between both ends of the character string.
摘要翻译：用于识别字符串的字符串识别方法可以包括：第一步骤，其中在字符串的方向上计算图像数据的第一投影数据;以及第二步骤，其中基于字符串的位置检测字符串的第一投影数据。在第一步骤中，将图像数据沿字符串的方向划分成多个段，并计算段中的投影。该方法还可以包括第三步骤，其中基于字符串的位置来计算段中的第二投影数据，并且第四步骤，其中第二投影数据超过阈值的位置被检测为字符的边界位置和阈值可以根据字符串的两端之间的像素数进行改变。

32. 发明申请

US20110096606A1 SEMICONDUCTOR INTEGRATED CIRCUIT ADAPTED TO OUTPUT PASS/FAIL RESULTS OF INTERNAL OPERATIONS 有权
公开(公告)号：US20110096606A1
公开(公告)日：2011-04-28
申请号：US12981063
申请日：2010-12-29
申请人： Hiroshi Nakamura , Kenichi Imamiya , Toshio Yamamura , Koji Hosono , Koichi Kawai
发明人： Hiroshi Nakamura , Kenichi Imamiya , Toshio Yamamura , Koji Hosono , Koichi Kawai
IPC分类号： G11C16/06
CPC分类号： G11C16/3459 , G06F3/0659 , G06F12/0246 , G11C7/065 , G11C7/1006 , G11C7/1051 , G11C7/106 , G11C7/1063 , G11C16/06 , G11C16/08 , G11C16/10 , G11C16/26 , G11C2207/104 , G11C2216/14
摘要： In a semiconductor integrated circuit, an internal circuit is capable of executing a first operation and a second operation concurrently, and an output circuit outputs to the outside of the semiconductor integrated circuit information indicating whether or not the first operation is being executed and information indicating whether or not the second operation is executable.

33. 发明授权

US07893477B2 Nonvolatile semiconductor memory 有权
公开(公告)号：US07893477B2
公开(公告)日：2011-02-22
申请号：US11829320
申请日：2007-07-27
申请人： Hiroshi Watanabe , Hiroshi Nakamura , Kazuhiro Shimizu , Seiichi Aritome , Toshitake Yaegashi , Yuji Takeuchi , Kenichi Imamiya , Ken Takeuchi , Hideko Oodaira
发明人： Hiroshi Watanabe , Hiroshi Nakamura , Kazuhiro Shimizu , Seiichi Aritome , Toshitake Yaegashi , Yuji Takeuchi , Kenichi Imamiya , Ken Takeuchi , Hideko Oodaira
IPC分类号： H01L27/108 , H01L29/73
CPC分类号： H01L27/11521 , G11C16/0483 , G11C16/10 , H01L27/105 , H01L27/115 , H01L27/11524 , H01L27/11526 , H01L27/11529
摘要： A select gate transistor has a select gate electrode composed of a first-level conductive layer and a second-level conductive layer. The first-level conductive layer has contact areas. The second-level conductive layer has its portions removed that are located above the contact areas. Two adjacent select gate electrodes that are adjacent to each other in the column direction are arranged such that the contact areas of one select gate electrode are not opposed to the contact areas of the other select gate electrode. One select gate electrode has its first- and second-level conductive layers removed in their portions that are opposed to the contact areas of the other select gate electrode.

34. 发明授权

US07854821B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US07854821B2
公开(公告)日：2010-12-21
申请号：US11445385
申请日：2006-06-02
申请人： Hiroshi Nakamura , Seiichi Kaise
发明人： Hiroshi Nakamura , Seiichi Kaise
IPC分类号： H01L21/00
CPC分类号： H01L21/67109 , H01J37/32082 , H01J2237/2001 , H01L21/67253 , H01L21/67276 , H01L21/67742 , Y10T279/23
摘要： A substrate processing apparatus includes a heat transfer gas supply mechanism to supply a heat transfer gas through a supply passage into a portion between a worktable and a substrate to improve thermal conductivity between therebetween. Under the control of a control section, the pressure inside the supply passage is measured to obtain a pressure measurement value while the substrate is placed on the worktable. Then, a preparatory flow rate of the heat transfer gas to be supplied through the supply passage into the portion between the worktable and substrate is determined, in accordance with the pressure difference between the pressure measurement value and a pressure reference value, prior to a main process to be performed on the substrate. Then, the heat transfer gas is supplied through the supply passage into the portion between the worktable and substrate at the preparatory flow rate, prior to the main process.
摘要翻译：基板处理装置包括：传热气体供给机构，用于将传热气体通过供给通道供应到工作台和基板之间的部分，以提高它们之间的导热性。在控制部分的控制下，测量供给通道内的压力，以便在将基板放置在工作台上时获得压力测量值。然后，根据压力测量值和压力基准值之间的压力差，在主体之间确定通过供给通道供给到工作台和基板之间的部分的传热气体的预备流量在基板上进行的处理。然后，在主工序之前，传热气体以预备流量通过供给通道供给到工作台和基板之间的部分。

35. 发明申请

US20100309724A1 SEMICONDUCTOR MEMORY DEVICE USING ONLY SINGLE-CHANNEL TRANSISTOR TO APPLY VOLTAGE TO SELECTED WORD LINE 有权
标题翻译：仅使用单通道晶体管将电压施加到选定字线的半导体存储器件
公开(公告)号：US20100309724A1
公开(公告)日：2010-12-09
申请号：US12856962
申请日：2010-08-16
申请人： Hiroshi Nakamura , Kenichi Imamiya
发明人： Hiroshi Nakamura , Kenichi Imamiya
IPC分类号： G11C16/04
CPC分类号： G11C8/10 , G11C16/0483 , G11C16/08 , G11C16/3459 , H01L27/115
摘要： A semiconductor memory device has a memory cell array, a first transistor of a first conductivity type, a second transistor of a second conductivity type and a third transistor of the first conductivity type. A source or drain of the first transistor is connected to each of word lines. A drain of the second transistor is connected to a gate of the first transistor. A source of the third transistor is connected to the gate of the first transistor. The gates of the second transistor and the third transistor are not connected, a source of the second transistor is not connected to a drain of the third transistor, and the gate of the second transistor and the drain of the third transistor have different voltage levels corresponding to opposite logic levels each other.
摘要翻译：半导体存储器件具有存储单元阵列，第一导电类型的第一晶体管，第二导电类型的第二晶体管和第一导电类型的第三晶体管。第一晶体管的源极或漏极连接到每条字线。第二晶体管的漏极连接到第一晶体管的栅极。第三晶体管的源极连接到第一晶体管的栅极。第二晶体管和第三晶体管的栅极不连接，第二晶体管的源极不连接到第三晶体管的漏极，并且第二晶体管的栅极和第三晶体管的漏极具有不同的电压电平彼此相反的逻辑水平。

36. 发明申请

US20100309723A1 SEMICONDUCTOR MEMORY DEVICE CAPABLE OF REALIZING A CHIP WITH HIGH OPERATION RELIABILITY AND HIGH YIELD 有权
公开(公告)号：US20100309723A1
公开(公告)日：2010-12-09
申请号：US12855507
申请日：2010-08-12
申请人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
发明人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
IPC分类号： G11C16/04
CPC分类号： G11C5/063 , G11C16/0483 , G11C16/08 , G11C2029/0403 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524
摘要： A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.

37. 发明授权

US07787277B2 Semiconductor memory device capable of realizing a chip with high operation reliability and high yield 有权
标题翻译：半导体存储器件能够实现具有高操作可靠性和高产量的芯片
公开(公告)号：US07787277B2
公开(公告)日：2010-08-31
申请号：US12052882
申请日：2008-03-21
申请人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
发明人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
IPC分类号： G11C11/34
CPC分类号： G11C5/063 , G11C16/0483 , G11C16/08 , G11C2029/0403 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524
摘要： A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.
摘要翻译：提供了能够防止由于降低存储单元阵列的端部区域中的蚀刻精度而导致的缺陷的半导体存储器件。第一块由具有存储单元的第一存储单元单元构成，第二块由具有多个存储单元的第二存储单元单元构成，并且存储单元阵列通过将第一块布置在两端部并且将第二块布置在其另一部分上。存储单元阵列的端侧上的第一存储单元单元的结构与第二存储单元单元的结构不同。用于将存储单元阵列的选择栅极线连接到行解码器中的相应晶体管的布线由布线层形成，布线层形成在用于将存储单元阵列的控制栅极线连接到行解码器中的晶体管的布线之上。

38. 发明授权

US07783237B2 Developing blade 失效
标题翻译：开发刀片
公开(公告)号：US07783237B2
公开(公告)日：2010-08-24
申请号：US12281150
申请日：2007-05-18
申请人： Shinji Souma , Hiroshi Nakamura
发明人： Shinji Souma , Hiroshi Nakamura
IPC分类号： G03G15/08
CPC分类号： G03G15/0812 , C08G77/04 , C08K3/04 , C08K3/041 , C08K3/045 , C08L23/04 , C08L83/04 , G03G2215/0634 , Y02P20/123 , C08L2666/06 , C08L2666/04
摘要： The blade member of the invention is composed mainly of silicone rubber and contains as an additive component at least one selected from the group consisting of ultra-high molecular-weight-polyethylene, carbon nanotube, and fullerene. It is thus possible to decrease the coefficient of friction of silicone rubber in a practical range and without detrimental to its flexibility or other physical properties to let the developing blade slip off more, thereby diminishing the amount of abrasion of the rubber and improving on the robustness of the developing blade without detrimental to image quality. Decreasing the coefficient of friction to let the developing blade slip off more has additional advantages: a decrease in the force of contact of the developing blade with a developing roll, which contributes more to energy savings resulting from the size reductions of a driving motor, and making the developer equipment compact.
摘要翻译：本发明的叶片构件主要由硅橡胶构成，作为添加成分，含有选自超高分子量聚乙烯，碳纳米管和富勒烯中的至少一种。因此，可以在实用的范围内降低硅橡胶的摩擦系数，并且不会对其柔性或其他物理性质产生不利影响，从而使显影刮板脱落更多，从而减少橡胶的磨损量并提高其坚固性的显影刀片，而不损害图像质量。降低摩擦系数以使显影刮板滑落更多具有另外的优点：显影刮板与显影辊的接触力降低，这对于由于驱动电机的尺寸减小而导致的能量节省更多;以及使开发设备紧凑。

39. 发明授权

US07768057B2 NAND-type EEPROM with increased reading speed 有权
标题翻译： NAND型EEPROM具有增加的读取速度
公开(公告)号：US07768057B2
公开(公告)日：2010-08-03
申请号：US11969740
申请日：2008-01-04
申请人： Hiroshi Nakamura , Kenichi Imamiya
发明人： Hiroshi Nakamura , Kenichi Imamiya
IPC分类号： H01L29/94 , H01L23/62
CPC分类号： H01L27/11526 , G11C11/5621 , G11C16/0483 , G11C16/26 , H01L27/115 , H01L27/11529 , H01L2924/0002 , H01L2924/00
摘要： In an EEPROM consisting of a NAND cell in which a plurality of memory cells are connected in series, the control gate voltage Vread of the memory cell in a block selected by the data read operation is made different from the each of the voltages Vsg1, Vsg2 of the select gate of the select transistor in the selected block so as to make it possible to achieve a high speed reading without bringing about the breakdown of the insulating film interposed between the select gate and the channel of the select transistor. The high speed reading can also be made possible in the DINOR cell, the AND cell, NOR cell and the NAND cell having a single memory cell connected thereto, if the control gate voltage of the memory cell is made different from the voltage of the select gate of the select transistor.
摘要翻译：在由多个存储单元串联连接的NAND单元组成的EEPROM中，通过数据读取操作选择的块中的存储单元的控制栅极电压Vread与电压Vsg1，Vsg2 在所选择的块中选择晶体管的选择栅极，从而使得可以实现高速读取，而不会导致插入在选择栅极和选择晶体管的沟道之间的绝缘膜的击穿。如果使存储器单元的控制栅极电压与选择的电压不同，则也可以在DINOR单元，AND单元，NOR单元和与其连接的单个存储单元的NAND单元中实现高速读数。选择晶体管的栅极。

40. 发明授权

US07756599B2 Substrate processing apparatus, program for performing operation and control method thereof, and computer readable storage medium storing the program 有权
标题翻译：衬底处理装置，用于执行其操作和控制方法的程序以及存储程序的计算机可读存储介质
公开(公告)号：US07756599B2
公开(公告)日：2010-07-13
申请号：US11254668
申请日：2005-10-21
申请人： Tomoyuki Kudo , Jun Ozawa , Hiroshi Nakamura , Kazunori Kazama , Tsuyoshi Moriya , Hiroyuki Nakayama , Hiroshi Nagaike
发明人： Tomoyuki Kudo , Jun Ozawa , Hiroshi Nakamura , Kazunori Kazama , Tsuyoshi Moriya , Hiroyuki Nakayama , Hiroshi Nagaike
IPC分类号： G06F19/00 , B65H1/00 , H01L21/306
CPC分类号： H01L21/67201 , H01L21/67017 , H01L21/67253 , H01L21/67748 , Y10S414/135 , Y10S414/139
摘要： A computer readable storage medium storing a program for performing an operation method of a substrate processing apparatus is provided. The operation method includes the steps of introducing a nonreactive gas into the vacuum preparation chamber before the gate valve is opened while the substrate is transferred between the vacuum preparation chamber of the vacuum processing unit and the transfer unit, stopping introducing the nonreactive gas when an inner pressure of the vacuum preparation chamber becomes same as an atmospheric pressure, starting an evacuation process of the corrosive gas in the vacuum preparation chamber and then opening to atmosphere performed by letting the vacuum preparation chamber communicate with an atmosphere, and opening the gate valve after the step of opening to atmosphere.
摘要翻译：提供一种存储用于执行基板处理装置的操作方法的程序的计算机可读存储介质。操作方法包括以下步骤：在基板在真空处理单元的真空处理室和转印单元的真空准备室之间转移时，在闸阀打开之前将非反应性气体引入真空准备室中，当内部真空制备室的压力与大气压力相同，开始真空制备室中的腐蚀性气体的抽空处理，然后通过使真空制备室与大气连通而进入大气，并在真空准备室之后打开闸阀向大气开放的一步。

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