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1. 发明申请

US20080170424A1 SEMICONDUCTOR MEMORY DEVICE CAPABLE OF REALIZING A CHIP WITH HIGH OPERATION RELIABILITY AND HIGH YIELD 有权
标题翻译：具有高操作可靠性和高效率的芯片实现的半导体存储器件
公开(公告)号：US20080170424A1
公开(公告)日：2008-07-17
申请号：US12052882
申请日：2008-03-21
申请人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
发明人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
IPC分类号： G11C16/04 , G11C11/34 , G11C5/06
CPC分类号： G11C5/063 , G11C16/0483 , G11C16/08 , G11C2029/0403 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524
摘要： A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.
摘要翻译：提供了能够防止由于降低存储单元阵列的端部区域中的蚀刻精度而导致的缺陷的半导体存储器件。第一块由具有存储单元的第一存储单元单元构成，第二块由具有多个存储单元的第二存储单元单元构成，并且存储单元阵列通过将第一块布置在两端部并且将第二块布置在其另一部分上。存储单元阵列的端侧上的第一存储单元单元的结构与第二存储单元单元的结构不同。用于将存储单元阵列的选择栅极线连接到行解码器中的相应晶体管的布线由布线层形成，布线层形成在用于将存储单元阵列的控制栅极线连接到行解码器中的晶体管的布线之上。

2. 发明授权

US08259494B2 Semiconductor memory device capable of realizing a chip with high operation reliability and high yield 有权
公开(公告)号：US08259494B2
公开(公告)日：2012-09-04
申请号：US12855507
申请日：2010-08-12
申请人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
发明人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
IPC分类号： G11C11/34
CPC分类号： G11C5/063 , G11C16/0483 , G11C16/08 , G11C2029/0403 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524
摘要： A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.

3. 发明申请

US20060120130A1 Semiconductor memory device capable of realizing a chip with high operation reliability and high yield 有权
标题翻译：半导体存储器件能够实现具有高操作可靠性和高产量的芯片
公开(公告)号：US20060120130A1
公开(公告)日：2006-06-08
申请号：US11330352
申请日：2006-01-12
申请人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
发明人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
IPC分类号： G11C5/06
CPC分类号： G11C5/063 , G11C16/0483 , G11C16/08 , G11C2029/0403 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524
摘要： A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.
摘要翻译：提供了能够防止由于降低存储单元阵列的端部区域中的蚀刻精度而导致的缺陷的半导体存储器件。第一块由具有存储单元的第一存储单元单元构成，第二块由具有多个存储单元的第二存储单元单元构成，并且存储单元阵列通过将第一块布置在两端部并且将第二块布置在其另一部分上。存储单元阵列的端侧上的第一存储单元单元的结构与第二存储单元单元的结构不同。用于将存储单元阵列的选择栅极线连接到行解码器中的相应晶体管的布线由布线层形成，布线层形成在用于将存储单元阵列的控制栅极线连接到行解码器中的晶体管的布线之上。

4. 发明申请

US20100309722A1 SEMICONDUCTOR MEMORY DEVICE CAPABLE OF REALIZING A CHIP WITH HIGH OPERATION RELIABILITY AND HIGH YIELD 有权
标题翻译：具有高操作可靠性和高效率的芯片实现的半导体存储器件
公开(公告)号：US20100309722A1
公开(公告)日：2010-12-09
申请号：US12855481
申请日：2010-08-12
申请人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
发明人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
IPC分类号： G11C16/02
CPC分类号： G11C5/063 , G11C16/0483 , G11C16/08 , G11C2029/0403 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524
摘要： A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.
摘要翻译：提供了能够防止由于降低存储单元阵列的端部区域中的蚀刻精度而引起的缺陷的半导体存储器件。第一块由具有存储单元的第一存储单元单元构成，第二块由具有多个存储单元的第二存储单元单元构成，并且存储单元阵列通过将第一块布置在两端部并且将第二块布置在其另一部分上。存储单元阵列的端侧上的第一存储单元单元的结构与第二存储单元单元的结构不同。用于将存储单元阵列的选择栅极线连接到行解码器中的相应晶体管的布线由布线层形成，布线层形成在用于将存储单元阵列的控制栅极线连接到行解码器中的晶体管的布线之上。

5. 发明授权

US07359228B2 Semiconductor memory device capable of realizing a chip with high operation reliability and high yield 有权
标题翻译：半导体存储器件能够实现具有高操作可靠性和高产量的芯片
公开(公告)号：US07359228B2
公开(公告)日：2008-04-15
申请号：US11612144
申请日：2006-12-18
申请人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
发明人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
IPC分类号： G11C6/06
CPC分类号： G11C5/063 , G11C16/0483 , G11C16/08 , G11C2029/0403 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524
摘要： A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.
摘要翻译：提供了能够防止由于降低存储单元阵列的端部区域中的蚀刻精度而导致的缺陷的半导体存储器件。第一块由具有存储单元的第一存储单元单元构成，第二块由具有多个存储单元的第二存储单元单元构成，并且存储单元阵列通过将第一块布置在两端部并且将第二块布置在其另一部分上。存储单元阵列的端侧上的第一存储单元单元的结构与第二存储单元单元的结构不同。用于将存储单元阵列的选择栅极线连接到行解码器中的相应晶体管的布线由布线层形成，布线层形成在用于将存储单元阵列的控制栅极线连接到行解码器中的晶体管的布线之上。

6. 发明申请

US20070103958A1 SEMICONDUCTOR MEMORY DEVICE CAPABLE OF REALIZING A CHIP WITH HIGH OPERATION RELIABILITY AND HIGH YIELD 有权
标题翻译：具有高操作可靠性和高效率的芯片实现的半导体存储器件
公开(公告)号：US20070103958A1
公开(公告)日：2007-05-10
申请号：US11612144
申请日：2006-12-18
申请人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
发明人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
IPC分类号： G11C5/06
CPC分类号： G11C5/063 , G11C16/0483 , G11C16/08 , G11C2029/0403 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524
摘要： A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.
摘要翻译：提供了能够防止由于降低存储单元阵列的端部区域中的蚀刻精度而导致的缺陷的半导体存储器件。第一块由具有存储单元的第一存储单元单元构成，第二块由具有多个存储单元的第二存储单元单元构成，并且存储单元阵列通过将第一块布置在两端部并且将第二块布置在其另一部分上。存储单元阵列的端侧上的第一存储单元单元的结构与第二存储单元单元的结构不同。用于将存储单元阵列的选择栅极线连接到行解码器中的相应晶体管的布线由布线层形成，布线层形成在用于将存储单元阵列的控制栅极线连接到行解码器中的晶体管的布线之上。

7. 发明授权

US07151685B2 Semiconductor memory device capable of realizing a chip with high operation reliability and high yield 有权
公开(公告)号：US07151685B2
公开(公告)日：2006-12-19
申请号：US11330352
申请日：2006-01-12
申请人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
发明人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
IPC分类号： G11C5/06 , G11C7/00
CPC分类号： G11C5/063 , G11C16/0483 , G11C16/08 , G11C2029/0403 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524
摘要： A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.

8. 发明授权

US07002845B2 Semiconductor memory device capable of realizing a chip with high operation reliability and high yield 有权
公开(公告)号：US07002845B2
公开(公告)日：2006-02-21
申请号：US10957722
申请日：2004-10-05
申请人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
发明人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
IPC分类号： G11C16/04
CPC分类号： G11C5/063 , G11C16/0483 , G11C16/08 , G11C2029/0403 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524
摘要： A semiconductor memory device capable of preventing occurrence of a defect caused by a lowering in the etching precision in an end area of the memory cell array and realizing an inexpensive chip having high operation reliability and high manufacturing yield is provided. A first block is constructed by first memory cell units each having a plurality of memory cells connected, a second block is constructed by second memory cell units each having a plurality of memory cells connected, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder. By use of the semiconductor memory device, occurrence of a defect caused by a lowering in the etching precision in an end area of the memory cell array can be prevented, and the manufacturing yield can be made high and the operation reliability can be made high without substantially increasing the chip size.

9. 发明申请

US20050063209A1 Semiconductor memory device capable of realizing a chip with high operation reliability and high yield 有权
标题翻译：半导体存储器件能够实现具有高操作可靠性和高产量的芯片
公开(公告)号：US20050063209A1
公开(公告)日：2005-03-24
申请号：US10957722
申请日：2004-10-05
申请人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
发明人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
IPC分类号： G11C16/04 , H01L21/8247 , H01L27/10 , H01L27/105 , H01L27/115 , H01L29/788 , H01L29/792 , G11C8/00 , G11C5/06
CPC分类号： G11C5/063 , G11C16/0483 , G11C16/08 , G11C2029/0403 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524
摘要： A semiconductor memory device capable of preventing occurrence of a defect caused by a lowering in the etching precision in an end area of the memory cell array and realizing an inexpensive chip having high operation reliability and high manufacturing yield is provided. A first block is constructed by first memory cell units each having a plurality of memory cells connected, a second block is constructed by second memory cell units each having a plurality of memory cells connected, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder. By use of the semiconductor memory device, occurrence of a defect caused by a lowering in the etching precision in an end area of the memory cell array can be prevented, and the manufacturing yield can be made high and the operation reliability can be made high without substantially increasing the chip size.
摘要翻译：提供一种半导体存储器件，其能够防止由于存储单元阵列的端部区域中的蚀刻精度降低而导致的缺陷的发生，并且实现了具有高操作可靠性和高制造成品率的便宜的芯片。第一块由具有连接的多个存储单元的第一存储单元单元构成，第二块由具有连接的多个存储单元的第二存储单元单元构成，并且存储单元阵列通过将第一块在其两端部分，并且将第二块布置在其另一部分上。存储单元阵列的端侧上的第一存储单元单元的结构与第二存储单元单元的结构不同。用于将存储单元阵列的选择栅极线连接到行解码器中的相应晶体管的布线由布线层形成，布线层形成在用于将存储单元阵列的控制栅极线连接到行解码器中的晶体管的布线之上。通过使用半导体存储器件，可以防止由存储单元阵列的端部区域中的蚀刻精度降低引起的缺陷的发生，并且可以使制造成品率高，并且可以使操作可靠性高而无需高大大增加芯片尺寸。

10. 发明申请

US20100309723A1 SEMICONDUCTOR MEMORY DEVICE CAPABLE OF REALIZING A CHIP WITH HIGH OPERATION RELIABILITY AND HIGH YIELD 有权
公开(公告)号：US20100309723A1
公开(公告)日：2010-12-09
申请号：US12855507
申请日：2010-08-12
申请人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
发明人： Hiroshi Nakamura , Ken Takeuchi , Hideko Oodaira , Kenichi Imamiya , Kazuhito Narita , Kazuhiro Shimizu , Seiichi Aritome
IPC分类号： G11C16/04
CPC分类号： G11C5/063 , G11C16/0483 , G11C16/08 , G11C2029/0403 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524
摘要： A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.

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