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    • 31. 发明申请
    • Nonvolatile Memory Devices Including a Resistor Region
    • 包括电阻器区域的非易失性存储器件
    • US20080246073A1
    • 2008-10-09
    • US12138712
    • 2008-06-13
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • H01L29/00
    • H01L27/105B82Y10/00H01L21/823462H01L27/0629H01L27/11526H01L27/11546H01L27/11568
    • Methods of forming a memory device include forming a device isolation layer in a semiconductor substrate including a cell array region and a resistor region, the device isolation layer extending into the resistor region and defining an active region in the semiconductor substrate. A first conductive layer is formed on the device isolation layer in the resistor region. The semiconductor substrate is exposed in the cell array region. A cell insulation layer is formed on a portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region. A second conductive layer is formed on the cell insulation layer in the portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region. The second conductive layer is etched to form a cell gate electrode in the cell array region and to concurrently remove the second conductive layer from the resistor region and the first conductive layer is etched in the resistor region to form a resistor.
    • 形成存储器件的方法包括在包括单元阵列区域和电阻器区域的半导体衬底中形成器件隔离层,器件隔离层延伸到电阻器区域中并在半导体衬底中限定有源区域。 在电阻器区域中的器件隔离层上形成第一导电层。 半导体衬底暴露在电池阵列区域中。 电池绝缘层形成在包括电阻器区域中的暴露的电池阵列区域,有源区域和器件隔离层的半导体衬底的一部分上。 在半导体衬底的包括电阻器区域中的暴露的电池阵列区域,有源区域和器件隔离层的部分中的单元绝缘层上形成第二导电层。 蚀刻第二导电层以在电池阵列区域中形成电池栅电极,并且同时从电阻器区域去除第二导电层,并且在电阻器区域中蚀刻第一导电层以形成电阻器。
    • 34. 发明授权
    • Methods of fabricating semiconductor devices with sidewall conductive patterns
    • 制造具有侧壁导电图案的半导体器件的方法
    • US08372711B2
    • 2013-02-12
    • US13110113
    • 2011-05-18
    • Jong-Sun SelJung-Dal ChoiJoon-Hee LeeHwa-Kyung Shin
    • Jong-Sun SelJung-Dal ChoiJoon-Hee LeeHwa-Kyung Shin
    • H01L21/336
    • H01L27/11526H01L21/28273H01L27/105H01L27/11529
    • A gate pattern is disclosed that includes a semiconductor substrate, a lower conductive pattern, an upper conductive pattern, and a sidewall conductive pattern. The lower conductive pattern is on the substrate. The insulating pattern is on the lower conductive pattern. The upper conductive pattern is on the insulating pattern opposite to the lower conductive pattern. The sidewall conductive pattern is on at least a portion of sidewalls of the upper conductive pattern and the lower conductive pattern. The sidewall conductive pattern electrically connects the upper conductive pattern and the lower conductive pattern. An upper edge portion of the lower conductive pattern may be recessed relative to a lower edge portion of the lower conductive pattern to define a ledge thereon. The sidewall conductive pattern may be directly on the ledge and sidewall of the recessed upper edge portion of the lower conductive pattern.
    • 公开了一种栅极图案,其包括半导体衬底,下导电图案,上导电图案和侧壁导电图案。 下导电图案在基板上。 绝缘图案位于下导电图案上。 上导电图案位于与下导电图案相对的绝缘图案上。 侧壁导电图案位于上导电图案和下导电图案的侧壁的至少一部分上。 侧壁导电图形电连接上导电图案和下导电图案。 下导电图案的上边缘部分可以相对于下导电图案的下边缘部分凹进,以在其上限定凸缘。 侧壁导电图案可以直接在下导电图案的凹陷的上边缘部分的凸缘和侧壁上。
    • 35. 发明申请
    • Non-Volatile Memory Devices
    • 非易失性存储器件
    • US20120218816A1
    • 2012-08-30
    • US13463060
    • 2012-05-03
    • Jong-Sun SelJung-Dal ChoiYoung-Woo ParkJin-Taek Park
    • Jong-Sun SelJung-Dal ChoiYoung-Woo ParkJin-Taek Park
    • G11C11/34
    • G11C16/0483G11C16/3427
    • A non-volatile memory device may include a semiconductor substrate including an active region at a surface thereof, a ground select line crossing the active region, and a string select line crossing the active region and spaced apart from the ground select line. A plurality of memory cell word lines may cross the active region between the ground select line and the string select line with about a same first spacing provided between adjacent ones of the plurality of word lines and between a last of the plurality of memory cell word lines and the string select line. A second spacing may be provided between the ground select line and a first of the plurality of memory cell word lines.
    • 非易失性存储器件可以包括半导体衬底,其包括其表面处的有源区,与有源区交叉的接地选择线,以及与有源区交叉并与地选线相隔的串选择线。 多个存储单元字线可以与地线选择线和弦选择线之间的有源区域相交,并且与多个字线中的相邻字线之间以及多个存储单元字线中的最后一个之间提供大致相同的第一间隔 和字符串选择行。 可以在接地选择线和多个存储单元字线中的第一个之间提供第二间隔。
    • 40. 发明申请
    • NAND Flash Memory Device Having Dummy Memory cells and Methods of Operating Same
    • 具有虚拟存储器单元的NAND闪存器件和操作方法相同
    • US20060239077A1
    • 2006-10-26
    • US11279607
    • 2006-04-13
    • Ki-Tae ParkJung-Dal ChoiJong-Sun SelYoo-Cheol Shin
    • Ki-Tae ParkJung-Dal ChoiJong-Sun SelYoo-Cheol Shin
    • G11C16/04G11C11/34
    • G11C16/0483G11C16/107G11C16/12G11C16/3445
    • A NAND flash memory device includes a control circuit configured to apply, during a program operation, a first word line voltage to non-selected ones of a plurality of serially-connected memory cells, a second word line voltage greater than the first word line voltage to a selected one of the plurality of memory cells, and a third word line voltage lower than the first word line voltage to a dummy memory cell connected in series with the plurality of memory cells. In other embodiments, a control circuit is configured to program a dummy memory cell before and/or after each erase operation on a plurality of memory cells connected in series therewith. In still other embodiments, a control circuit is configured to forego erasure of a dummy memory cell while erasing a plurality of memory cells connected in series therewith.
    • NAND闪速存储器件包括控制电路,其被配置为在编程操作期间将第一字线电压施加到多个串联存储器单元中的未选择的电压,第二字线电压大于第一字线电压 到多个存储单元中的一个选择的一个,以及比第一字线电压低的第三字线电压到与多个存储单元串联连接的虚拟存储单元。 在其他实施例中,控制电路被配置为在与每个擦除操作之间的每个擦除操作之前和/或之后对与其串联的多个存储器单元进行编程。 在其他实施例中,控制电路被配置为在擦除与其串联连接的多个存储器单元时,放弃擦除伪存储器单元。