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31. 发明授权

US08449751B2 Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same 有权
标题翻译：含有特定骨架的胺化合物和有机硫化合物作为添加剂的铜电解液和使用其的电解铜箔
公开(公告)号：US08449751B2
公开(公告)日：2013-05-28
申请号：US11906663
申请日：2007-10-03
申请人： Masashi Kumagai , Mikio Hanafusa
发明人： Masashi Kumagai , Mikio Hanafusa
IPC分类号： C25D1/04 , C25D7/06
CPC分类号： C25D7/0614 , C25D1/04 , C25D3/38 , H05K1/09 , Y10T428/12903 , Y10T428/12993 , Y10T428/26
摘要： The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In particular, the invention has an object of obtaining an electrolytic copper foil that can be finely patterned and have an excellent elongation and tensile strength at normal and high temperatures. This object is attained by using a copper electrolytic solution containing, as additives, an organosulfur compound, and an amine compound having a specific skeleton obtained by additively reacting an amine compound and a compound having one or more epoxy groups in a molecule thereof to an addition reaction.
摘要翻译：本发明的目的是获得使用阴极鼓制造的电解铜箔制成的薄型电解铜箔，使得粗糙表面侧（与光泽表面的相反侧）的表面粗糙度低。特别地，本发明的目的是获得可以精细图案化并且在正常和高温下具有优异的伸长率和拉伸强度的电解铜箔。该目的通过使用含有有机硫化合物和具有特定骨架的胺化合物的铜电解溶液来实现，所述特定骨架通过使胺化合物和其分子中具有一个或多个环氧基的化合物相加至加成反应。

32. 发明授权

US07651783B2 Surface treated copper film 有权
标题翻译：表面处理铜膜
公开(公告)号：US07651783B2
公开(公告)日：2010-01-26
申请号：US10486274
申请日：2002-07-17
申请人： Katsuyuki Tsuchida , Masashi Kumagai , Fumiaki Akase
发明人： Katsuyuki Tsuchida , Masashi Kumagai , Fumiaki Akase
IPC分类号： H05K1/03 , H05K3/38 , H05K3/46 , B32B15/08
CPC分类号： C23C28/00 , C23C30/00 , H05K3/384 , H05K3/389 , Y10T428/12438 , Y10T428/12569 , Y10T428/12611 , Y10T428/12792 , Y10T428/12882 , Y10T428/12903 , Y10T428/1291 , Y10T428/12993 , Y10T428/31663
摘要： A surface treated copper foil with improved adhesion to the insulating resin of a copper-clad laminate for higher frequency applications contains a copper foil provided with a heat-resistant layer and an olefin-based silane coupling agent layer sequentially on at least one side thereof. An anticorrosive treatment may be performed after the heat resistance treatment. The copper foil is preferably an electrolytic copper foil, and these layers can be provided on the S side and/or the M side thereof. The copper foil has an adequate adhesive strength, even without the roughening treatment that has been performed in the past. A film of zinc, zinc-tin, zinc-nickel, zinc-cobalt, copper-zinc, copper-nickel-cobalt, or nickel-cobalt can be used favorably as the heat-resistant layer, and a film that has undergone a zinc-chromate or a chromate treatment can be used favorably as the anticorrosive layer.
摘要翻译：与用于更高频率应用的覆铜层压板的绝缘树脂具有改善的粘合性的表面处理铜箔包含在其至少一侧上依次具有耐热层和烯烃基硅烷偶联剂层的铜箔。耐热处理后可以进行防锈处理。铜箔优选为电解铜箔，这些层可以设置在S侧和/或M侧。铜箔具有足够的粘合强度，即使没有在过去进行的粗糙化处理。可以有利地使用锌，锌 - 锡，锌 - 镍，锌 - 钴，铜 - 锌，铜 - 镍 - 钴或镍 - 钴的薄膜作为耐热层，并且已经经历了锌铬酸盐或铬酸盐处理可以有利地用作防腐层。

33. 发明申请

US20090092789A1 Two-Layer Flexible Substrate 有权
标题翻译：双层柔性基材
公开(公告)号：US20090092789A1
公开(公告)日：2009-04-09
申请号：US11992209
申请日：2006-08-22
申请人： Katsuyuki Tsuchida , Hironori Kobayashi , Ryu Murakami , Masashi Kumagai
发明人： Katsuyuki Tsuchida , Hironori Kobayashi , Ryu Murakami , Masashi Kumagai
IPC分类号： D06N7/04
CPC分类号： H05K1/09 , B32B15/08 , B32B15/20 , B32B27/281 , B32B2307/206 , H05K1/0346 , H05K1/0393 , H05K3/108 , H05K3/28 , H05K3/382 , H05K3/388 , H05K2201/0355 , H05K2201/098 , H05K2203/0723 , Y10T428/24355
摘要： The invention provides a two-layer flexible substrate free of surface defects and having excellent etching characteristics and adherence to resist.The two-layer flexible substrate has a copper layer provided on one or both faces of an insulator film without using an adhesive, wherein the surface roughness (Ra) of the copper layer is 0.10 to 0.25 μm, and wherein the average crystal grain size [of copper] is no greater than 0.8 μm at 1 μm from the insulator film in the cross section of the copper layer. Preferably, the insulator film is a polyimide film.
摘要翻译：本发明提供一种没有表面缺陷且具有优异的蚀刻特性和抗粘附性的双层柔性基材。双层柔性基板在不使用粘合剂的情况下，在绝缘膜的一面或两面上具有铜层，其中铜层的表面粗糙度（Ra）为0.10〜0.25μm，平均结晶粒径[ 的铜]在铜层的截面中距离绝缘膜1个1um时不大于0.8μm。优选地，绝缘膜是聚酰亚胺膜。

34. 发明授权

US07045461B2 Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these 有权
标题翻译：金属电镀法，预处理剂，半导体晶片及使用这些的半导体器件
公开(公告)号：US07045461B2
公开(公告)日：2006-05-16
申请号：US10767697
申请日：2004-01-29
申请人： Toru Imori , Masashi Kumagai , Junnosuke Sekiguchi
发明人： Toru Imori , Masashi Kumagai , Junnosuke Sekiguchi
IPC分类号： H01L21/44
CPC分类号： C23C18/30 , C23C18/1879
摘要： Resin cloths, powders, specular bodies and other objects resistant to conventional plating can be plated with metals by a simple method.According to the metal plating method of the present invention, electroless plating is performed after the surface of a object to be plated is treated with a pretreatment agent obtained by reacting or mixing in advance a noble metal compound (catalyst) with a silane-coupling agent having functional groups capable of capturing metals. According to this method, metal plating can be securely applied to powders, resin cloths, semiconductor wafers, and other specular bodies. Moreover, the problem of the insufficient coverage of the seed layer on the inside walls of vias and trenches during the formation of fine wiring can be addressed by applying this method to semiconductor wafers. The silane-coupling agent may be a compound containing azole groups, preferably an imidazole.
摘要翻译：树脂布，粉末，镜面物体和其他耐常规镀层的物体可用简单的方法镀金属。根据本发明的金属镀覆方法，在将待镀镀物体的表面用预先将贵金属化合物（催化剂）与硅烷偶联剂进行反应或混合而获得的预处理剂进行处理之后进行化学镀具有能够捕获金属的官能团。根据该方法，可以将金属电镀牢固地施加到粉末，树脂布，半导体晶片和其它镜面体上。此外，通过将该方法应用于半导体晶片，可以解决在形成精细布线期间通孔和沟槽的内壁上种子层覆盖不足的问题。硅烷偶联剂可以是含有唑类，优选咪唑的化合物。

35. 发明申请

US20060011488A1 Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same 审中-公开
标题翻译：含有具有特定骨架和有机硫化合物的季胺化合物聚合物的铜电解溶液作为添加剂，以及使用其制造的电解铜箔
公开(公告)号：US20060011488A1
公开(公告)日：2006-01-19
申请号：US10486861
申请日：2003-09-17
申请人： Masashi Kumagai , Mikio Hanafusa
发明人： Masashi Kumagai , Mikio Hanafusa
IPC分类号： C25D3/38
CPC分类号： C25D3/38 , Y10T428/12993
摘要： There is obtained a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly an electrolytic copper foil which allows fine patterning, and is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. The present invention provides a copper electrolytic solution, containing as additives an organo-sulfur compound and a quaternary amine compound polymer obtained by homopolymerizing a compound in which nitrogen of an acrylic type compound having a dialkylamino group is quaternized, or copolymerizing the compound with another compound having an unsaturated bond, and an electrolytic copper foil manufactured using this electrolytic solution.
摘要翻译：在使用阴极鼓的电解铜箔的制造中，在粗糙表面侧（与光泽表面相反的一侧）获得具有小的表面粗糙度的薄型电解铜箔，更具体地说，是电解铜箔，其允许精细图案化，并且在常温和高温下在伸长率和拉伸强度方面优异。本发明提供一种铜电解液，其含有有机硫化合物和通过使具有二烷基氨基的丙烯酸类化合物的氮季铵化的化合物均聚而得到的季铵化合物聚合物，或将该化合物与其它化合物共聚具有不饱和键，以及使用该电解液制造的电解铜箔。

36. 发明授权

US06835241B2 Surface treatment for copper foil 有权
标题翻译：铜箔表面处理
公开(公告)号：US06835241B2
公开(公告)日：2004-12-28
申请号：US10362953
申请日：2003-05-01
申请人： Katsuyuki Tsuchida , Masashi Kumagai , Fumiaki Akase
发明人： Katsuyuki Tsuchida , Masashi Kumagai , Fumiaki Akase
IPC分类号： C09D18310
CPC分类号： H05K3/389 , C09D4/00 , C23C22/52 , C23C22/68 , C23C2222/20 , H05K2201/0355 , Y10T428/31663 , C08G77/04
摘要： The present invention provides a surface treatment agent that endows a copper foil with excellent adhesion to insulating resins. The surface treatment agent of the present invention has as its active components an organosilicic compound expressed by a following General Formula (1) and/or an organosilicic compound expressed by a General Formula (2) and an olefin-based silane coupling agent. The surface treatment agent of the present invention provides particularly excellent adhesion between an insulating resin and a low-profile copper foil used for a high-frequency-adaptable substrate. In Formulas (1) and (2), R1 is a hydroxyl group or a C1 to C5 alkyl group, and R2 is a C1 to C10 alkylene group that may contain oxygen.
摘要翻译：本发明提供一种赋予铜离子对绝缘性树脂具有优异粘合性的表面处理剂。本发明的表面处理剂作为其活性成分，由以下通式（1）表示的有机硅化合物和/或有机硅由通式（2）表示的化合物和烯烃系硅烷偶联剂。本发明的表面处理剂在绝缘树脂和用于高频适应性基材的低剖面铜箔之间提供特别优异的粘附性。在式（1）和（2）中，R 1是羟基基团或C1〜C5烷基，R 2为可含有氧的C1〜C10亚烷基。

37. 发明授权

US06710181B2 Imidazole/organic monocarboxylic acid salt derivative reaction product, method for producing the same, and surface treatment agent, resin additive and resin composition using the same 有权
标题翻译：咪唑/有机单羧酸盐衍生物反应产物，其制备方法和表面处理剂，树脂添加剂和使用其的树脂组合物
公开(公告)号：US06710181B2
公开(公告)日：2004-03-23
申请号：US09936073
申请日：2001-09-05
申请人： Masashi Kumagai , Katsuyuki Tsuchida
发明人： Masashi Kumagai , Katsuyuki Tsuchida
IPC分类号： C07F702
CPC分类号： C08K5/5465 , C07F7/1804 , C08G73/0616 , C08K5/5442 , C23C2222/20
摘要： The present invention provides a novel imidazole/organic monocarboxylic acid salt derivative reaction product capable of improving the adhesion between a resin and a metal such as copper, steel or aluminum, or an inorganic material such as glass fiber, silica, aluminum oxide or aluminum hydroxide, a method for producing this imidazole/organic monocarboxylic acid salt derivative reaction product, and a surface treatment agent, resin additive and resin composition that use this imidazole/organic monocarboxylic acid salt derivative reaction product. The above imidazole/organic monocarboxylic acid salt derivative reaction product is obtained by reacting an imidazole compound represented by undermentioned general formula (1) with a silane compound having a glycidoxy group represented by undermentioned general formula (2) at 80 to 200° C., and then reacting the product thus obtained with an organic monocarboxylic acid at 50 to 200° C.
摘要翻译：本发明提供了能够提高树脂与铜，钢或铝等金属或玻璃纤维，二氧化硅，氧化铝或氢氧化铝等无机材料的粘合性的新颖的咪唑/有机单羧酸盐衍生物反应产物，该咪唑/有机单羧酸盐衍生物反应产物的制备方法，以及使用该咪唑/有机一元羧酸盐衍生物反应产物的表面处理剂，树脂添加剂和树脂组合物。上述咪唑/有机单羧酸盐衍生物反应通过使由下述通式（1）表示的咪唑化合物与具有由上述通式（2）表示的缩水甘油氧基的硅烷化合物在80〜200℃下反应，然后使得到的产物与有机物一元羧酸在50〜200℃

38. 发明授权

US08182594B2 Electroless nickel plating liquid 失效
标题翻译：化学镀镍液
公开(公告)号：US08182594B2
公开(公告)日：2012-05-22
申请号：US11920021
申请日：2006-09-26
申请人： Eiji Hino , Masashi Kumagai
发明人： Eiji Hino , Masashi Kumagai
IPC分类号： C23C18/48
CPC分类号： C23C18/34 , H05K3/244
摘要： An electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed of multiple IC chips contains a water-soluble nickel salt, a reducing agent, a complexing agent, and a pH buffer, wherein_lead ion is contained at 0.01-1 ppm, cobalt ion is contained at 0.01-1 ppm, and a sulfur compound is contained at 0.01-1 ppm.
摘要翻译：能够通过在由多个IC芯片构成的硅片上具有均匀的膜厚度的化学镀镍形成用于金属凸块或焊料凸块的下阻金属的化学镀镍液含有水溶性镍盐，还原剂，络合剂，和pH缓冲剂，其中含有0.01-1ppm的离子，钴离子含量为0.01-1ppm，含硫化合物为0.01-1ppm。

39. 发明申请

US20110110022A1 PORTABLE TERMINAL DEVICE WITH WATERPROOF STRUCTURE 审中-公开
标题翻译：带防水结构的便携式终端设备
公开(公告)号：US20110110022A1
公开(公告)日：2011-05-12
申请号：US12999870
申请日：2009-02-02
申请人： Masashi Kumagai , Shingo Kume
发明人： Masashi Kumagai , Shingo Kume
IPC分类号： H05K5/02
CPC分类号： H04M1/18 , G06F1/1616 , G06F1/1656 , G06F1/1681 , H04M1/0216
摘要： A portable terminal apparatus for implementing a sure waterproof function with small components and a small number of components is provided.The portable terminal apparatus with a waterproof structure includes a first casing 1 having an opening 14, a cable 5 for electrically connecting an electronic circuit of the inside of the first casing 1 to another electronic circuit through the opening 14, and a waterproof packing 7 which has an insertion hole 7b formed to penetrate so as to allow the cable 5 to be inserted and which is inserted into the opening 14. The waterproof packing 7 has a cylindrical shape and includes a first waterproof press-fitting rib 7c on an outside and a second waterproof press-fitting rib 7d on an inside, and the first waterproof press-fitting rib 7c and the second waterproof press-fitting rib 7d are disposed in positions mutually displaced in a length direction.
摘要翻译：提供了一种用于实现具有小部件和少量部件的可靠防水功能的便携式终端设备。具有防水结构的便携式终端设备包括具有开口14的第一壳体1，用于通过开口14将第一壳体1的内部的电子电路电连接到另一电子电路的电缆5和防水密封件7，具有形成为穿透的插入孔7b，以允许电缆5插入并插入到开口14中。防水衬垫7具有圆柱形形状，并且在外部包括第一防水压配合肋7c，第二防水压配合肋7d在内侧，第一防水压配合肋7c和第二防水压配合肋7d配置在沿长度方向相互位移的位置。

40. 发明授权

US07771835B2 Copper electrolytic solution containing quaternary amine compound with specific skeleton and oragno-sulfur compound as additives, and electrolytic copper foil manufactured using the same 有权
标题翻译：含有特殊骨架和硫化合物作为添加剂的季胺化合物的铜电解液和使用其的电解铜箔
公开(公告)号：US07771835B2
公开(公告)日：2010-08-10
申请号：US11586906
申请日：2006-10-26
申请人： Masashi Kumagai , Mikio Hanafusa
发明人： Masashi Kumagai , Mikio Hanafusa
IPC分类号： B32B15/04 , B32B15/08 , C22C9/00
CPC分类号： C25D3/38 , H05K1/09 , Y10T428/31678 , Y10T428/31681
摘要： It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly to obtain an electrolytic copper foil which allows fine patterning, and which is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. Furthermore, it is an object of the present invention to obtain a copper electrolytic solution for this purpose. This copper electrolytic solution contains as additives an organo-sulfur compound and a quaternary amine compound with a specific skeleton.
摘要翻译：本发明的目的是在使用阴极鼓的电解铜箔的制造中获得在粗糙表面侧（与光泽表面相反的一侧）具有较小表面粗糙度的薄型电解铜箔更具体地说是获得能够精细图案化的电解铜箔，并且在常温和高温下在伸长率和拉伸强度方面优异。此外，本发明的目的是获得用于该目的的铜电解液。该铜电解液含有有机硫化合物和具有特定骨架的季胺化合物作为添加剂。

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