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1. 发明申请

US20090064892A1 Electroless nickel plating liquid 失效
标题翻译：化学镀镍液
公开(公告)号：US20090064892A1
公开(公告)日：2009-03-12
申请号：US11920021
申请日：2006-09-26
申请人： Eiji Hino , Masashi Kumagai
发明人： Eiji Hino , Masashi Kumagai
IPC分类号： C23C18/34
CPC分类号： C23C18/34 , H05K3/244
摘要： An object is to provide an electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed of multiple IC chips.An electroless nickel plating liquid comprising a water-soluble nickel salt, a reducing agent, a complexing agent, and a pH buffer, whereinlead ion is contained at 0.01-1 ppm, cobalt ion is contained at 0.01-1 ppm, and a sulfur compound is contained at 0.01-1 ppm.
摘要翻译：本发明的目的是提供一种化学镀镍液，其能够通过在由多个IC芯片组成的硅晶片上具有均匀膜厚度的化学镀镍形成用于金属凸块或焊料凸块的下阻挡金属。一种包含水溶性镍盐，还原剂，络合剂和pH缓冲剂的无电镀镍液，其中铅离子含量为0.01-1ppm，钴离子含量为0.01-1ppm，硫化合物的含量为0.01-1ppm。

2. 发明申请

US20070095249A1 Electroless gold plating liquid 有权
标题翻译：化学镀金液
公开(公告)号：US20070095249A1
公开(公告)日：2007-05-03
申请号：US10549537
申请日：2005-03-29
申请人： Eiji Hino , Masashi Kumagai
发明人： Eiji Hino , Masashi Kumagai
IPC分类号： C23C18/40
CPC分类号： C23C18/44
摘要： The object is to provide an electroless plating liquid which has an adequate deposition speed for practical use without containing any thallium or other heavy metal ions, and which has excellent stability of the plating liquid. An electroless gold plating liquid comprising a non-cyanide gold salt as a gold salt, an alkali metal salt or an ammonium salt of sulfurous acid and thiosulfuric acid as a metal complexing agent, a hydroxyalkylsulfonic acid or a salt thereof represented by the following general formula as a reducing agent, and an amine compound. (wherein R represents hydrogen, a carboxyl group, or any of a phenyl group, a tolyl group, a naphthyl group, a saturated or unsaturated alkyl group, an acetyl group, an acetonyl group, a pyridyl group and a furyl group which may have a substitutional group, X represents any of hydrogen, Na, K, and NH4, and n is an integer between 0 and 4.)
摘要翻译：本发明的目的是提供一种化学镀液，其具有足够的沉积速度用于实际应用，而不含任何铊或其它重金属离子，并且具有优异的电镀液稳定性。一种无电镀金液体，其包含作为金盐的非氰化金金盐，亚硫酸的非氰化金盐，作为金属配合剂的硫代硫酸的碱金属盐或铵盐，由以下通式表示的羟烷基磺酸或其盐作为还原剂和胺化合物。（其中R表示氢，羧基或苯基，甲苯基，萘基，饱和或不饱和的烷基，乙酰基，丙酰基，吡啶基和呋喃基中的任何一种，其可以具有取代基，X表示氢，Na，K和NH 4中的任一个，n是0至4之间的整数。）

3. 发明授权

US08182594B2 Electroless nickel plating liquid 失效
标题翻译：化学镀镍液
公开(公告)号：US08182594B2
公开(公告)日：2012-05-22
申请号：US11920021
申请日：2006-09-26
申请人： Eiji Hino , Masashi Kumagai
发明人： Eiji Hino , Masashi Kumagai
IPC分类号： C23C18/48
CPC分类号： C23C18/34 , H05K3/244
摘要： An electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed of multiple IC chips contains a water-soluble nickel salt, a reducing agent, a complexing agent, and a pH buffer, wherein_lead ion is contained at 0.01-1 ppm, cobalt ion is contained at 0.01-1 ppm, and a sulfur compound is contained at 0.01-1 ppm.
摘要翻译：能够通过在由多个IC芯片构成的硅片上具有均匀的膜厚度的化学镀镍形成用于金属凸块或焊料凸块的下阻金属的化学镀镍液含有水溶性镍盐，还原剂，络合剂，和pH缓冲剂，其中含有0.01-1ppm的离子，钴离子含量为0.01-1ppm，含硫化合物为0.01-1ppm。

4. 发明授权

US07300501B2 Electroless gold plating liquid 有权
标题翻译：化学镀金液
公开(公告)号：US07300501B2
公开(公告)日：2007-11-27
申请号：US10549537
申请日：2005-03-29
申请人： Eiji Hino , Masashi Kumagai
发明人： Eiji Hino , Masashi Kumagai
IPC分类号： C23C18/44
CPC分类号： C23C18/44
摘要： The object is to provide an electroless gold plating liquid which has an adequate deposition speed for practical use without containing any thallium or other heavy metal ions, excellent stability of the plating liquid and contains a non-cyanide gold salt as a gold salt, an alkali metal salt or an ammonium salt of sulfurous acid and thiosulfuric acid as a metal complexing agent, a hydroxyalkylsulfonic acid or a salt thereof represented by the following general formula as a reducing agent, and an amine compound, wherein R represents hydrogen, a carboxyl group, or any of a phenyl group, a tolyl group, a naphthyl group, a saturated or unsaturated alkyl group, an acetyl group, an acetonyl group, a pyridyl group and a furyl group which may have a substitutional group, X represents any of hydrogen, Na, K, and NH4, and n is an integer between 0 and 4.
摘要翻译：本发明的目的是提供一种化学镀金液体，其具有足够的沉积速度用于实际使用而不含任何铊或其它重金属离子，电镀液的稳定性优异，并含有非氰化物金盐作为金盐，碱金属盐或亚硫酸铵和硫代硫酸作为金属络合剂，由以下通式表示的羟烷基磺酸或其盐作为还原剂，以及胺化合物，其中R表示氢，羧基，或可以具有取代基的苯基，甲苯基，萘基，饱和或不饱和的烷基，乙酰基，丙酰基，吡啶基和呋喃基中的任何一个，X表示氢， Na，K和NH 4，n为0〜4的整数。

5. 发明申请

US20130004500A1 ANTIBODY AGAINST SEROTYPE A LIPOPOLYSACCHARIDE OF PSEUDOMONAS AERUGINOSA 审中-公开
标题翻译：抗血清素抗坏血酸的抗体
公开(公告)号：US20130004500A1
公开(公告)日：2013-01-03
申请号：US13579847
申请日：2011-02-18
申请人： Jiro Tanaka , Peter Sejer Andersen , Takafumi Okutomi , Tsuneyoshi Inaba , Keiko Otsuka , Hirotomo Akabane , Yukari Hoshina , Hiroshi Nagaso , Masashi Kumagai
发明人： Jiro Tanaka , Peter Sejer Andersen , Takafumi Okutomi , Tsuneyoshi Inaba , Keiko Otsuka , Hirotomo Akabane , Yukari Hoshina , Hiroshi Nagaso , Masashi Kumagai
IPC分类号： A61K39/40 , A61P31/04 , C07K16/12 , C12N15/13 , C12N5/16
CPC分类号： C07K16/1214 , A61K2039/505 , C07K16/44 , C07K2317/21 , C07K2317/24 , C07K2317/732 , C07K2317/734 , G01N2333/21
摘要： Provided is a novel antibody having an excellent antibacterial activity against P. aeruginosa. By using plasmablasts obtained from cystic fibrosis patients with chronic P. aeruginosa pulmonary infection as starting materials, antibodies which bind to LPS of a P. aeruginosa strain of serotype A and which have excellent antibacterial activities in vitro and in vivo were successfully obtained.
摘要翻译：提供对铜绿假单胞菌具有优异抗菌活性的新型抗体。通过使用从慢性铜绿假单胞菌肺感染的囊性纤维化患者获得的浆细胞作为起始材料，成功获得了与血清型A的铜绿假单胞菌菌株的LPS结合并且具有优异的体外和体内抗菌活性的抗体。

6. 发明授权

US07824534B2 Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith 有权
标题翻译：含有具有特定骨架的添加剂化合物的铜电解液和由其制造的电解铜箔
公开(公告)号：US07824534B2
公开(公告)日：2010-11-02
申请号：US10588686
申请日：2005-12-09
申请人： Katsuyuki Tsuchida , Hironori Kobayashi , Masashi Kumagai
发明人： Katsuyuki Tsuchida , Hironori Kobayashi , Masashi Kumagai
IPC分类号： C25D3/38
CPC分类号： C25D1/04 , C25D3/38
摘要： The object of the present invention is to obtain a low profile electrolytic copper foil with a low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum and, particularly, to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution contains, as an additive, a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.
摘要翻译：本发明的目的是在使用阴极鼓的电解铜箔制造中，在粗糙表面侧（与光面相反的一侧）获得具有低表面粗糙度的薄型电解铜箔，特别是获得电解铜箔具有优异的伸长率和拉伸强度，可以进行精细图案化。另一个目的是获得一种铜电解溶液，其允许在2层柔性基板上均匀镀铜而没有针孔。该铜电解液含有作为添加剂的具有下述通式（1）表示的特定骨架的化合物，其通过加成反应获得，其中将水加入到分子中具有一个或多个环氧基的化合物：其中 A是环氧化合物残基，n是1以上的整数。

7. 发明授权

US07777078B2 Copper electrolytic solution and electrolytic copper foil produced therewith 有权
标题翻译：铜电解液和电解铜箔
公开(公告)号：US07777078B2
公开(公告)日：2010-08-17
申请号：US10531645
申请日：2003-10-10
申请人： Masashi Kumagai , Mikio Hanafusa
发明人： Masashi Kumagai , Mikio Hanafusa
IPC分类号： C07C223/00 , C07C211/00
CPC分类号： C25D3/38 , C25D1/04 , Y10T428/12903
摘要： The present invention provides a copper electrolytic solution used to obtain a low-profile electrolytic copper foil with a low surface roughness on the rough side (the opposite side from the glossy side) in the production of an electrolytic copper foil using a cathode drum and, more particularly, to provide a copper electrolytic solution used to obtain an electrolytic copper foil that has excellent transmission loss characteristics at a high frequency, can be finely patterned, and has excellent elongation and tensile strength, both at ordinary and high temperatures. The copper electrolytic solution of the present invention contains (A) at least one quaternary amine salt selected from the group consisting of (a) quaternary amine salts obtained by a reaction between epichlorohydrin and an amine compound mixture composed of a secondary amine compound and a tertiary amine compound, and (b) polyepichlorohydrin quaternary amine salts, and (B) an organic sulfur compound.
摘要翻译：本发明提供一种铜电解液，用于在使用阴极鼓的电解铜箔的制造中，在粗糙面（与光面相反的一侧）上获得具有低表面粗糙度的低轮廓电解铜箔，更具体地，提供一种铜电解液，其用于获得在高频下具有优异的透射损耗特性的电解铜箔，可以精细地图案化，并且在常温和高温下都具有优异的伸长率和拉伸强度。本发明的铜电解液含有（A）至少一种选自（a）由表氯醇与由仲胺化合物构成的胺化合物混合物与叔胺化合物反应而得到的季铵盐的季胺盐胺化合物和（b）聚表氯醇季胺盐，和（B）有机硫化合物。

8. 发明申请

US20090155279A1 Pseudomonas Aeruginosa Outer Membrane Protein PA5158 审中-公开
标题翻译：铜绿假单胞菌外膜蛋白PA5158
公开(公告)号：US20090155279A1
公开(公告)日：2009-06-18
申请号：US12084205
申请日：2006-10-27
申请人： Jiro Tanaka , Fukuichi Ohsawa , Takafumi Okutomi , Hiroshi Nagaso , Masashi Kumagai , Takahisa Suzuki , Keiko Otsuka
发明人： Jiro Tanaka , Fukuichi Ohsawa , Takafumi Okutomi , Hiroshi Nagaso , Masashi Kumagai , Takahisa Suzuki , Keiko Otsuka
IPC分类号： A61K39/395 , C07K14/00 , A61K39/104 , C07K16/18 , C12N5/06
CPC分类号： C07K16/1214 , A61K39/00 , A61K2039/505 , A61K2039/52 , C07K14/21 , G01N33/56911
摘要： An object of the present invention is to provide a protein or peptide antigen and an antibody against it, for use in the diagnosis, prevention, or treatment of diseases associated with Pseudomonas aeruginosa. According to the present invention, there is provided a protein or peptide derived from Pseudomonas aeruginosa outer membrane protein PA5158 and an antibody against it, for use in the diagnosis, prevention, or treatment of diseases associated with Pseudomonas aeruginosa.
摘要翻译：本发明的目的是提供蛋白质或肽抗原和抗体的抗体，用于诊断，预防或治疗与铜绿假单胞菌相关的疾病。根据本发明，提供了来自绿脓假单胞菌外膜蛋白PA5158的蛋白质或肽，以及针对其的抗体，用于诊断，预防或治疗与铜绿假单胞菌相关的疾病。

9. 发明申请

US20070042201A1 Copper electrolytic solution containing quaternary amine compound with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same 有权
标题翻译：含有具有特定骨架和有机硫化合物的季胺化合物作为添加剂的铜电解液和使用其的电解铜箔
公开(公告)号：US20070042201A1
公开(公告)日：2007-02-22
申请号：US11586906
申请日：2006-10-26
申请人： Masashi Kumagai , Mikio Hanafusa
发明人： Masashi Kumagai , Mikio Hanafusa
IPC分类号： B32B15/04 , B32B15/08 , C22C9/00
CPC分类号： C25D3/38 , H05K1/09 , Y10T428/31678 , Y10T428/31681
摘要： It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly to obtain an electrolytic copper foil which allows fine patterning, and which is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. Furthermore, it is an object of the present invention to obtain a copper electrolytic solution for this purpose. This copper electrolytic solution contains as additives an organo-sulfur compound and a quaternary amine compound with a specific skeleton.
摘要翻译：本发明的目的是在使用阴极鼓的电解铜箔的制造中获得在粗糙表面侧（与光泽表面相反的一侧）具有较小表面粗糙度的薄型电解铜箔更具体地说是获得能够精细图案化的电解铜箔，并且在常温和高温下在伸长率和拉伸强度方面优异。此外，本发明的目的是获得用于该目的的铜电解液。该铜电解液含有有机硫化合物和具有特定骨架的季胺化合物作为添加剂。

10. 发明申请

US20050173256A1 Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith 有权
标题翻译：含有有机硫化合物的铜电解液和特定骨架的季胺化合物作为添加剂和由其制得的电解铜箔
公开(公告)号：US20050173256A1
公开(公告)日：2005-08-11
申请号：US10480710
申请日：2003-08-20
申请人： Masashi Kumagai , Mikio Hanafusa
发明人： Masashi Kumagai , Mikio Hanafusa
IPC分类号： C25D1/04 , C25D3/38 , H05K1/09
CPC分类号： C25D3/38 , H05K1/09 , Y10T428/31678 , Y10T428/31681
摘要： It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly to obtain an electrolytic copper foil which allows fine patterning, and which is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. Furthermore, it is an object of the present invention to obtain a copper electrolytic solution for this purpose. This copper electrolytic solution contains as additives an organo-sulfur compound and a quaternary amine compound with a specific skeleton expressed by the following general formula (1) which is obtained by an addition reaction between a compound which has one or more epoxy groups per molecule and an amine compound, followed by a quaternization of the nitrogen. (In general formula (1), R1 and R2 each indicate a group selected from the group consisting of a hydroxyalkyl group, an ether group, an aromatic group, an aromatic-substituted alkyl group, an unsaturated hydrocarbon group and an alkyl group, R3 indicates a benzyl group, an allyl group or an alkyl group, A indicates an epoxy compound residue, X1− indicates Cl−, Br or CH3SO4−, and n indicates an integer of 1 or greater.)
摘要翻译：本发明的目的是在使用阴极鼓的电解铜箔的制造中获得在粗糙表面侧（与光泽表面相反的一侧）具有较小表面粗糙度的薄型电解铜箔更具体地说是获得能够精细图案化的电解铜箔，并且在常温和高温下在伸长率和拉伸强度方面优异。此外，本发明的目的是获得用于该目的的铜电解液。该铜电解液含有作为添加剂的有机硫化合物和具有以下通式（1）表示的特定骨架的季胺化合物，其通过每分子具有一个以上环氧基的化合物与胺化合物，然后氮化季铵化。（通式（1）中，R 1和R 2各自表示选自羟基烷基，醚基，芳香族基团，芳族取代的烷基，不饱和烃基和烷基，R 3表示苄基，烯丙基或烷基，A表示环氧化合物残基，X 1， / SUB> 表示Cl - O，Br或CH 3 SO 4 - ，n表示1以上的整数。）

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