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31. 发明专利

JPH04123465A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04123465A
公开(公告)日：1992-04-23
申请号：JP24242190
申请日：1990-09-14
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： TAKAHASHI HIDEKAZU
IPC分类号： H01L27/02 , H01L29/84 , H05K7/12
摘要： PURPOSE:To mechanically finely regulate a circuit switching, a resistance value, a capacity value out of a package by providing a switching terminal capable of operating outside the package in contact with a semiconductor chip. CONSTITUTION:A lower end contactor of a rotary terminal 1 having a knob at its upper end is brought into contact with wirings 2 on a semiconductor chip 4, its columnar part is buried rotatably in a resin package 7, a knob of an upper end protrudes out of the package, and rotated here. A wiring pattern made of a central circular wiring terminal 9a and a ringlike resistor 9b surrounding the terminal 9a is formed of part of wirings on the chip 4, and a resistance value is finely regulated by rotating the rotary terminal. A pattern made of a central circular wiring terminal 10a and a plurality of terminals 10b extending radially to surround the terminal 10a is formed, and circuit wirings in the chip for connecting the plurality of terminals can be switched by operating the rotary terminal.

32. 发明专利

JPH046056A METHOD FOR PACKING ELECTRONIC PART WITH TAPE 失效
公开(公告)号：JPH046056A
公开(公告)日：1992-01-10
申请号：JP9645990
申请日：1990-04-13
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： TAKAHASHI HIDEKAZU
IPC分类号： B65D73/02 , H05K13/02
摘要： PURPOSE:To be free from use of adhesive agent by providing a mold cut facing a tape member, mounting an electronic part on an upper face of the tape, inserting its outer lead into a lower face of the cut and supporting the electronic part on the tape member only with elasticity and tension of the tape itself. CONSTITUTION:With a gull-wing type outer lead (outer lead) 5, a plurality of leads are partially bent from an opposite side of a main body and the tips extend horizontally. A horizontal part of the tip of this type of outer lead is mounted on a wiring of a wiring substrate in plane contact with the wiring. A pair of mold cuts 5 are provided oppositely on a tape (paper tape) 3 to be used for packing. With a cut piece 6 stood by the lead, the lead is secured by lateral tension P of the tape itself and elasticity Q of the cut piece 6 to recover so that a package 1 can be supported and fixed on the tape 3 without adhesive agent.

33. 发明专利

JPH03173167A SURFACE-MOUNT PACKAGE SEMICONDUCTOR DEVICE AND MOUNTING THEREOF 失效
公开(公告)号：JPH03173167A
公开(公告)日：1991-07-26
申请号：JP31064389
申请日：1989-12-01
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： TAKAHASHI HIDEKAZU
IPC分类号： H05K3/34 , H01L23/50 , H05K1/18
摘要： PURPOSE:To enhance a mounting density by piling up packages on the same wiring board in a multistage and multiple manner by a method wherein a plurality of leads are formed in such a way that they are bent along the surface and the rear surface of a package main body. CONSTITUTION:In a surface-mount package semiconductor device, leads 6 in parts are bent along the surface of a package. In the surface-mount package semiconductor device, the leads 6 in the parts are bent along the surface of the package main body and leads 7 in other parts are bent along the rear surface. When a semiconductor device is mounted on a wiring board, a semiconductor device is mounted so as to be piled up on it in a small-sized semiconductor device 8; the leads of the upper semiconductor device are brought into contact with leads bent on the surface of the lower semiconductor device and are connected by a solder; the devices are mounted.

34. 发明专利

JPS62206846A JIG FOR WAFER 失效
公开(公告)号：JPS62206846A
公开(公告)日：1987-09-11
申请号：JP4839986
申请日：1986-03-07
申请人： HITACHI MICROCUMPUTER ENG , HITACHI LTD
发明人： TAKAHASHI HIDEKAZU , SUDO YOSHIAKI , HASHIMOTO TOMOHIKO
IPC分类号： H01L21/677 , H01L21/67 , H01L21/68
摘要： PURPOSE:To hold a wafer stably by holding the wafer by supporting three points in the wafer. CONSTITUTION:A jig has three sliding arms 1, 1', 1'', and supports a large- diameter wafer at three points. The sliding arms 1, 1' push the wafer against the sliding arm 1'' by the elastic force of a spring section 3, and support the wafer by three points. The quality of material of a rubber group or a light metal is used as the quality of material of the sliding arms. Accordingly, the wafer can be carried positively by supporting three points in the wafer.

35. 发明专利

JPS62195142A WAFER CARRIER 失效
公开(公告)号：JPS62195142A
公开(公告)日：1987-08-27
申请号：JP3517886
申请日：1986-02-21
申请人： HITACHI MICROCUMPUTER ENG , HITACHI LTD
发明人： TAKAHASHI HIDEKAZU , SUDO YOSHIAKI , HASHIMOTO TOMOHIKO
IPC分类号： H01L21/673 , H01L21/67 , H01L21/68
摘要： PURPOSE:To carry large-aperture wafers using a carrier suitable to these by providing a hole in part of the large-aperture wafers. CONSTITUTION:Large-aperture wafers 1 can be transferred collectively every lot using a supporting body (carrier) by providing an opening part 2 in part of the wafers 1. The supporting body consists of a knob 6, pedestal parts 3 and a barlike supporting body 5. Moreover, a housing body 4 is provided with grooves 8 for housing stably a plurality of the wafers and long notch parts 7 for housing the barlike supporting body. Thereby, the transfer and housing of the large-aperture wafers can be carried out safely and speedily while the reliability is secured.

36. 发明专利

JPS6035515A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6035515A
公开(公告)日：1985-02-23
申请号：JP14382083
申请日：1983-08-08
申请人： HITACHI MICROCUMPUTER ENG , HITACHI LTD
发明人： TAKAHASHI HIDEKAZU , KATOU TOKIO
IPC分类号： H01L21/027 , H01L21/30
摘要： PURPOSE:To improve the dampproof property of the semiconductor device having a multilayer interconnection structure by a method wherein the guide to be used for positioning of the second layer wiring and the through hole of the second layer insulating film and the second wiring are formed simultaneously. CONSTITUTION:A semiconductor element region 2 is formed on the surface of a semiconductor substrate 1, and the first layer wiring 3 is formed extending to an SiO2 film 10. The first layer insulating film 4 of SiO2 or PSG is formed, and a concavity 12 is provided at the position of a guide together with a through hole 11 by performing an etching. Aluminum is vapor-deposited, the second layer wiring 5 is formed by patterning and, at the same time, a guide 7 is formed on the concavity 12. The second layer insulating film 6 of SiO2 or PSG is formed, and a hole 18 with which the guide 7 will be exposed is provided. When moisture 9 is infiltrated through the hole 18, the guide 7 is positioned on the oxide film 10, and the second layer wiring 5 is located on a different levelled interlayer insulating film 4, and this prevents the infiltration of the moisture 9, thereby enabling to improve the dampproof property of the semiconductor device for the wiring.

37. 发明专利

JP2003269880A HEAT EXCHANGER 审中-公开
公开(公告)号：JP2003269880A
公开(公告)日：2003-09-25
申请号：JP2002075386
申请日：2002-03-19
申请人： HITACHI LTD
发明人： TAKAHASHI HIDEKAZU , ISHIOKA TERUKAZU , KUBOTA TAKESHI , AMIMOTO TOSHIYUKI
IPC分类号： F28F1/32 , F25B39/00
摘要： PROBLEM TO BE SOLVED: To provide a heat exchanger with the minimum number of joints and a high degree of design freedom while maintaining conventional heat exchanging performance combining the advantages of reliability in airtightness and refrigerant leakage resistance, heat transfer performance and the high degree of design freedom. SOLUTION: In the cross fin type heat exchanger, only one refrigerant pipe is brought into contact with one independent fin. It is structured to joint the fin to one refrigerant pipe which is originally linear, and to perform planar or three-dimensional bending work the optional number of times to have an optional length. A bent part is composed of a combination of the same minimum bend radius and an optional micro linear part. COPYRIGHT: (C)2003,JPO

38. 发明专利

JP2002333259A REFRIGERATOR 失效
公开(公告)号：JP2002333259A
公开(公告)日：2002-11-22
申请号：JP2001138234
申请日：2001-05-09
申请人： HITACHI LTD
发明人： TAKAHASHI HIDEKAZU , MURAKAMI HIROSHI , KUBOTA TAKESHI , IWATA HIROSHI
IPC分类号： F25D19/00 , F25B39/04 , F25D11/00 , F25D23/00
摘要： PROBLEM TO BE SOLVED: To achieve the improvement of condensation performance and the energy saving by suppressing the reduction of the quantity of heat radiation even if fluff, etc., adhere to the suction side of a condenser in a machine room, and concentrating condenser functions in the condenser in the machine room. SOLUTION: This refrigerator is equipped with a compressor 16 and a blower 17 in a machine room which compulsively ventilates the condenser 18 in the machine room, and a cross-fin-tubes-in-plural-rows type of heat exchanger is used for the condenser 18 in the machine room, and the plate-shaped fins 18b are independent separately for each row, and space is provided between the rows, and fixers are provided on both sides of the condenser 18 in the machine room, and the fixer 33 on one side is fixed to the side of a bottom plate which forms the machine room, and also the fixer 34 on the other side is fixed to the side of the refrigerator main body 1, and the refrigerant pipe 18a of the condenser 18 in the machine room is arranged to rise within the machine room 22.

39. 发明专利

JPH088366A ELECTRONIC DEVICE MOUNTING STRUCTURE AND MOUNTING BOARD 失效
公开(公告)号：JPH088366A
公开(公告)日：1996-01-12
申请号：JP16299094
申请日：1994-06-21
申请人： HITACHI LTD , HITACHI MICROCOMPUTER SYST
发明人： TAKAHASHI HIDEKAZU
IPC分类号： H01L23/28
摘要： PURPOSE:To avoid projection of a semiconductor device from a mounting board by inserting an electronic device into a containing recess made in a mounting board body 1 and connecting the electronic device electrically and mechanically with a contact formed in the containing recess. CONSTITUTION:A semiconductor integrated circuit is fabricated in a semiconductor device 40 which is mounted on a board 11 to constitute a mounting structure 10. The body 12 of the mounting board 11 is provided with a containing hole 13 and an inner lead 14 is projecting from the inner periphery thereof. Each inner lead 14 is connected electrically with the outside of the containing hole 13 through a multilayer wiring 15 formed in the body 12. Outer terminals 16 for connecting the mounting board 11 with an external electronic device is formed on the surface of the body 12 and connected electrically through the multilayer wiring 15. Consequently, the semiconductor device 40 can be mounted on the mounting board without projecting from the surface of the body 12 and thereby the mounting structure 10 can be made thin.

40. 发明专利

JPH07254672A COOLING UNIT FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH07254672A
公开(公告)日：1995-10-03
申请号：JP7164294
申请日：1994-03-16
申请人： HITACHI LTD , HITACHI MICOM SYST KK
发明人： TAKAHASHI HIDEKAZU
IPC分类号： H01L23/36 , H01L23/467
摘要： PURPOSE:To cool a semiconductor device forcibly and effectively without consuming power by disposing a fan, comprising members deformable depending on the temperature variation, such that the members respond to the heating of semiconductor device. CONSTITUTION:Upon operation of an IC 1 mounted on the surface of a printed wiring board 5, the IC 1 is heated and the temperature thereof rises. The heat 7 is emitted from a package 2 and transmitted through an adhesive layer 14 to the base 12 thence transmitted to a large number of fins (temperature sensitive deformable members) 13 of a fan 10 and dissipated effectively therefrom. When the atmosphere having raised temperature surrounds the group of fins 13 and the temperature thereof reaches a preset level, the fins 13 are deformed into a previously stored shape. Since energy is consumed at the time of deformation, the temperature of the fins 13 lowers. Furthermore, the fins 13 are deformed to swing a fan thus producing a wind 8. Consequently, the atmosphere around the group of fins 13 is exchanged and the fins 13 are cooled.

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