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1. 发明专利

JP2005156154A Refrigerator 有权
标题翻译：冰箱
公开(公告)号：JP2005156154A
公开(公告)日：2005-06-16
申请号：JP2005022385
申请日：2005-01-31
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： YAMASHITA TAICHIRO , OTA GICHU , NAKAMURA HIROKAZU , TERAUCHI MASATAKA , TAKAHASHI HIDEKAZU
IPC分类号： F25D23/02
摘要： PROBLEM TO BE SOLVED: To provide a refrigerator capable of reducing a trouble caused by impact when closing a door, without imparting unnatural feeling to a user about the opening and closing of the door, and capable of opening and closing the door freely by the user as same as in a conventional refrigerator, without changing operation feeling compared with the door of the conventional refrigerator. SOLUTION: This refrigerator of the present invention provided with the rotary door 2 for opening and closing a front face of a refrigerator body 1 has a member 10 moved in accompaniment to rotation of the rotary door 2 and for pulling the rotary door 2 in, a rotary member 10 having a rotation fulcrum in a refrigerator body 1 side, stopped on a moving locus of the member 10 when opening the rotary door 2, and standing by in a stopped position, and a spring member 10 for energizing the member 10 to a direction pulling further the rotary door 2 in, in a position of a side more closed than the stopped position of the rotary door 2. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够在关闭门时减少由冲击引起的故障的冰箱，而不会向用户提供关于门的打开和关闭的不自然的感觉，并且能够自由地打开和关闭门使用者与现有的冰箱相同，与现有的冰箱相比，不改变操作感觉。解决方案：本发明的具有用于打开和关闭冰箱主体1的前表面的旋转门2的本发明的冰箱具有随着旋转门2的旋转而移动并用于拉动旋转门2的构件10 在打开旋转门2的状态下，具有在冰箱主体1侧的旋转支点的旋转部件10停止在构件10的移动轨迹上，并处于停止位置;弹簧部件10，用于使构件 10转向在旋转门2的更靠近旋转门2的停止位置的一侧的位置上进一步拉动旋转门2的方向。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2002333258A REFRIGERATOR 失效
公开(公告)号：JP2002333258A
公开(公告)日：2002-11-22
申请号：JP2001138235
申请日：2001-05-09
申请人： HITACHI LTD
发明人： MURAKAMI HIROSHI , TAKAHASHI HIDEKAZU , KUBOTA TAKESHI , IWATA HIROSHI
IPC分类号： F25D19/00 , F25D23/00
摘要： PROBLEM TO BE SOLVED: To secure the operation performance of a refrigerator by enhancing the performance of a condenser in a machine room thereby contriving the power saving, and suppressing the drop of the performance of the condenser in a machine room even if the suction side of the condenser in the machine room is clogged. SOLUTION: A cross fin type of heat exchanger, where many plate-shaped fins 18b are juxtaposed on a refrigerant pipe 18a made in zigzag, is used as a condenser 18 in the machine room, and a blower 17 in the machine room is constituted of a propeller-type blower which is projected toward the side of the condenser 18 in a machine room from a mouth ring 41, and the periphery of a passage leading to the blower 17 in the machine room from the condenser 18 in the machine room is shut off to make a half-sealed space which opens at the section of the blower 17 in the machine room and the section of the blower 17 in the machine room, and it is arranged so that the face having wire area of the condenser 18 in the machine room may face the half-sealed space.

3. 发明专利

JP2000304484A HEAT EXCHANGER, ITS MANUFACTURE, AND REFRIGERATOR EQUIPPED THEREWITH 失效
公开(公告)号：JP2000304484A
公开(公告)日：2000-11-02
申请号：JP10832399
申请日：1999-04-15
申请人： HITACHI LTD
发明人： SHIZUTANI MITSUTAKA , SHIBAYAMA MASAYUKI , SHIBATA KOICHI , TAKAHASHI HIDEKAZU
IPC分类号： B21D53/08 , F25D17/08 , F28F1/32
摘要： PROBLEM TO BE SOLVED: To provide a heat exchanger for air conditioning, particularly for a refrigerator, in which cost to effect is sharply improved. SOLUTION: A refrigerant tube 3 is adapted such that a plurality of straight tube portions are coupled in succession in a meandering fashion with bent tube portions 3a, and a plurality of independent and flat plate fin shaped fins 2 are fixed to the straight tube portions, and further the number of lines of the straight tube portions is more increased than the number of stages, resulting in an extended flat configuration in a ventilation direction of an air stream 4. On opposite ends of the fins 2 in a stage direction B, a plurality of cantilevered protruded pieces 5 are provided by cuts extending perpendicularly to the foregoing ends, which pieces 5 have bent angles thereof different in succession. Hereby, front edge effect is ensured for the air stream 4 with the vertical cut portions 5, and heat exchange performance is sharply improved. Similar vertical cut protrusions 6 are provided also at the center of the respective fins 2, also the front edge effect is ensured, and further heat exchange performance is improved.

4. 发明专利

JPH1140301A SOCKET FOR MOUNTING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH1140301A
公开(公告)日：1999-02-12
申请号：JP19627797
申请日：1997-07-23
申请人： HITACHI LTD , HITACHI MICROCOMPUTER SYST
发明人： TAKAHASHI HIDEKAZU
IPC分类号： G01R31/26 , H01L23/32 , H01R33/76 , H01R33/94
摘要： PROBLEM TO BE SOLVED: To provide a socket capable of opening its top surface in a socket mounting condition with a simple structure by connecting and fixing the lead of a semiconductor device with a cover split into a plurality of pieces biased and pressed against the connections of a contact pin electrically-conducting with substrate wiring on a base. SOLUTION: The base 13 of a socket with a shape appropriate to a semiconductor device to be mounted is disposed on a substrate, the lower end of a contact pin buried in it is electrically-connected to substrate wiring, and the upper end is exposed to its upper surface as a connection part 16a. A cover 14 split into four pieces is disposed along the respective edges of the base 13. The cover 14 is formed into such a shape as to cover the lead of the semiconductor device, pivoted turnably to the base 13 through a shaft 18 biased in a closed condition through a spring 19, and formed to be capable of interlocking adjacent to each other with a link rod 20 provided. The cover 14 is rotated so as to be in an open condition, the lead of the semiconductor device carried-in is placed on the connection part 16a, and the cover 14 is pressed and fixed in a closed condition.

5. 发明专利

JPH0940070A PACKING TAPE BODY 失效
公开(公告)号：JPH0940070A
公开(公告)日：1997-02-10
申请号：JP20788495
申请日：1995-07-21
申请人： HITACHI LTD , HITACHI MICROCOMPUTER SYST
发明人： TAKAHASHI HIDEKAZU
IPC分类号： B65D73/02 , B65B15/04 , B65D85/86
摘要： PROBLEM TO BE SOLVED: To provide a packing tape body which is easy to pack and unpack and can be recycled. SOLUTION: A packing tape body 10 is provided with carrier tape 11 in which QFP.IC storage cavities 14 are arranged longitudinally, and lids 12 for covering the openings of the cavities 14. On female hinges 19 formed at the right and left sides of the opening of each cavity 14, male hinges 23 formed at the outside ends of the right and left rids 12 are supported so as to be freely turnable, and the right and left lids 12 are integrated with the carrier tape 11 so as to open/close the opening of the corresponding cavity freely. The male hinge 23 of each lid 12 is provided with a stopper 25 which engages with the stopper 26 of the corresponding female hinge 19 when the opening of the corresponding cavity is closed. Thus, when the lids 12, which are free to be opened/ closed, is opened, a QFP.IC 1 is freely taken out of the cavity 14 and inserted into it, therefore this facilitates packing and unpacking. Because damage and the like are not caused to the carrier tape 11 and lids 12 after unpacking, the packing tape body 10 can be recycled.

6. 发明专利

JPH08222692A COMPOSITE SEMICONDUCTOR DEVICE, MOUNTED STRUCTURE AND MOUNTING METHOD THEREOF 失效
公开(公告)号：JPH08222692A
公开(公告)日：1996-08-30
申请号：JP4489095
申请日：1995-02-09
申请人： HITACHI LTD , HITACHI MICROCOMPUTER SYST
发明人： TAKAHASHI HIDEKAZU
IPC分类号： H01L25/18 , H01L23/50 , H01L25/10 , H01L25/11 , H05K1/18 , H05K3/34
摘要： PURPOSE: To provide a semiconductor device mounting technology which elevates the packing density and facilitates the mounting, while avoiding increasing the mounting area. CONSTITUTION: A composite semiconductor device 2 is composed of two semiconductor devices SLP.IC 20 and QFP.IC 10 laminated one above the other, each having a single line package having outer leads 22 extruding from one side face of a resin seal 21. The device 2 is mounted on a mounting substrate 30 electrically and mechanically connected thereto to form a mounted structure 1. Since the two semiconductor devices are laminated, the mounting area is small, whereas they are mounted at a high packing density. Since the outer leads of the upper SLP.IC have a single line type structure, the relative position to the lower QFP.IC can be selected freely to facilitate mounting.

7. 发明专利

JPH07297505A PRINTED WIRING BOARD 失效
公开(公告)号：JPH07297505A
公开(公告)日：1995-11-10
申请号：JP8128794
申请日：1994-04-20
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： TAKAHASHI HIDEKAZU
IPC分类号： H05K7/20 , H01L23/473 , H05K1/02
摘要： PURPOSE:To improve packaging density by enabling direct cooling of a printed wiring board itself, by further improving cooling efficiency and by minimizing required board interval. CONSTITUTION:The title device is a liquid cooling system printed wiring board which is provided with a pipe 2 for allowing cooling liquid to pass inside a layer of a multilayer structure of at least two layers. Heat 5 generated from a mounted semiconductor device part and other electronic device parts 3 is transmitted to a printed wiring board 1, absorbed by a buried cooling liquid passing pipe 2 and is let to go to an outside of the printed wiring board 1. Cooling liquid 6 made to pass from one of cooling liquid input/output ports 4, 4 to the other thereof can be properly circulated by connecting the cooling liquid input/output ports 4, 4.

8. 发明专利

JPH06196626A COMPOSITE ELECTRONIC DEVICE 失效
公开(公告)号：JPH06196626A
公开(公告)日：1994-07-15
申请号：JP34372092
申请日：1992-12-24
申请人： HITACHI LTD , HITACHI MICOM SYST KK
发明人： TAKAHASHI HIDEKAZU
IPC分类号： H01L25/10 , H01L25/18
摘要： PURPOSE:To add and change functions by forming a part of coupling holes of embedded leads so that one surface wall of each coupling hole is embedded in a package at the package linking surface of an electronic device to be linked, electrically connecting the holes to the embedded leads by the coupling with coupling projections, and combining a plurality of kinds of semiconductor devices. CONSTITUTION:A male-type semiconductor device 20 has coupling projections 9 on one-side linking surface of a rectangular package 5. Gull-wing-shaped leads 11 comprising conductors are protruding from the remaining three sides. A semiconductor element 21 is fixed to a tab 12 within the package 5 of the male-type semiconductor device. The coupling projections 9 are formed of conductive material and can be inserted into coupling holes 7 of a female-type semiconductor device 10. When the coupling projections 9 of the male-type semiconductor device 20 are coupled into the coupling holes 7 of the female-type semiconductor device 10, the coupling projections 9 electrically come into contact with embedded leads 14 forming the lower surface parts of the coupling holes 7. Therefore, a plurality of the semiconductor devices are selectively combined in conformity with the application, and the composite electronic device as a unitary body can be formed.

9. 发明专利

JPH065749A HEAT DISSIPATING DEVICE 失效
公开(公告)号：JPH065749A
公开(公告)日：1994-01-14
申请号：JP16063092
申请日：1992-06-19
申请人： HITACHI LTD , HITACHI MICOM SYST KK
发明人： TAKAHASHI HIDEKAZU
IPC分类号： H01L23/36 , H01L23/42
摘要： PURPOSE:To enhance a heat dissipating efficiency by using liquid having high heat conductivity as heat dissipating medium, sealing the medium in a vessel which is partitioned to two stages in contact with a main surface of an electronic component to be heat dissipated, and externally dissipating heat from the component by utilizing a convection. CONSTITUTION:Heat generated from an electronic component 1 is transferred to a vessel body 2 of an upper heat dissipating device through a package 5. A temperature of liquid of a part in contact with the package is raised, and a convection occurs in the vessel. That is, heat is raised in a direction as indicated by a black arrow 8 via a hole 4, liquid having a low temperature is moved down in a direction indicated by a white arrow 9, and it is moved to be circulated in a direction for averaging a temperature of the entire liquid. The heat raised upward is dissipated externally as indicated by an arrow 12 through heat dissipating fins 6. Thus, its heat exchanging efficiency is improved, a ventilation space may be reduced, the number of components to be placed is increased on the same board, and a space efficiency is improved.

10. 发明专利

JPH05206315A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH05206315A
公开(公告)日：1993-08-13
申请号：JP1173892
申请日：1992-01-27
申请人： HITACHI LTD , HITACHI MICOM SYST KK
发明人： TAKAHASHI HIDEKAZU
IPC分类号： H01L23/12 , H01L23/50
摘要： PURPOSE:To realize high density due to three-dimensional packaging on a narrower side with a substrate by extending all of a plurality of electrode leads toward a narrower side of a board-shape packaging member, and exposing a part of ends of the leads on the surface of a package. CONSTITUTION:A semiconductor chip 4 is mounted on a tab 7. A plurality of electrode leads 3 surrounding the semiconductor chip 4 are extended with concentration toward individual external single side of the chip 4, and are sealed by a resin formed package member. The chip 4 are connected to electrode leads 3 through bonding wires 5 of gold or other metals. A plurality of electrode leads are bent on the opposite side alternately at the individual ends, and are exposed on individual sides. The exposed sides of these electrode leads correspond with the surface of the resin formed member 6. Each top of the leads is not projected out from the resin formed member 6. An exclusive socket is provided so that a plurality of contact arm 13 placed along the inside of a groove 12 can be contacted with the top of individual electrode leads 3. The package member is mounted by being incorporated in the groove 12.

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