会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 32. 发明专利
    • PROCESS FOR LIQUID PHASE GROWTH
    • JPS6021895A
    • 1985-02-04
    • JP12767983
    • 1983-07-15
    • HITACHI LTD
    • KASHIWADA YASUTOSHINAKAMURA MICHIHARU
    • C30B19/00C30B19/04C30B19/12C30B29/40H01L21/208
    • PURPOSE:To easily remove oxide formed naturally on the surface of a substrate in the stage of crystal growth of a III-V group compound semiconductor by adding an element having stronger oxidation effect than the element constituting the crystal on the substrate for the growth to the melt for washing the substrate. CONSTITUTION:To a substrate of III-V group compound semiconductor, particularly, to a substrate having mesa formed on a multilayered growth layer for the purpose of prepg. semiconductor laser of built-in hetero structure, when liquid phase growth for the purpose of built-in growth is performed, the substrate is washed with washing soln. for the substrate contg. an element having stronger oxidizing power than the element constituting the substrate is used before the soln. for the growth is brought into contact with the substrate. By the washing, oxides formed naturally on the surface of the substrate are removed. Then, by performing liquid phase growth while contacting the soln. for the growth with the substrate, the quality of the interface between the crystal surface of the substrate and freshly grown surface is improved.
    • 33. 发明专利
    • Semiconductor laser device
    • 半导体激光器件
    • JPS59171187A
    • 1984-09-27
    • JP4424383
    • 1983-03-18
    • Hitachi Ltd
    • KURODA TAKAROUKASHIWADA YASUTOSHIKAJIMURA TAKASHIKAYANE NAOKIOOUCHI HIROBUMI
    • H01L21/205H01L21/203H01S5/00H01S5/12
    • H01S5/1228H01S5/1237
    • PURPOSE:To enable to manufacture the titled device with good yield at a time of crystal growth by periodically varying the width of the stepwise difference of a stripe active layer in a specific range. CONSTITUTION:A groove or a projection is formed on a semiconductor substrate 1. In this case, the depth of the groove or the height of the projection is set at 0.2-0.5mum and the center value W of the width of the groove or the projection at 2-5mum. Besides, the stripe width is periodically varied in the range of + or -0.2- 0.5mum from the center value along the direction of photo propagation. Such a formation causes the scattering loss the light receives to become extremely large even when the stepwise difference itself is very small, and enables transverse basic mode oscillation stable with the inhibition of high degree mode even when the width (w) is enlarged. Further, the element of excellent performance can be manufactured with good yield by one time crystal growth.
    • 目的:通过周期性地改变条纹有源层在特定范围内的逐步差异的宽度,能够在晶体生长时以良好的收率制造标题器件。 构成:在半导体基板1上形成有槽或突起。在这种情况下,槽的深度或突起的高度设定为0.2〜0.5μm,槽的宽度的中心值W或 投影在2-5mum。 此外,条带宽度在沿着光传播方向的中心值的+或-0.2-0.5μm的范围内周期性地变化。 这样的形成即使当阶梯差本身非常小时也会使光接收的散射损失变得非常大,并且即使当宽度(w)增大时,也能够抑制高度模式而使横向基本模式振荡稳定。 此外,可以通过一次晶体生长以良好的产率制造出优异性能的元件。
    • 34. 发明专利
    • Liquid phase epitaxial growth
    • 液相外延生长
    • JPS59163821A
    • 1984-09-14
    • JP3738183
    • 1983-03-09
    • Hitachi Ltd
    • KASHIWADA YASUTOSHIKOUNO TOSHIHIROKAJIMURA TAKASHIKAYANE NAOKI
    • H01L21/208H01S5/00
    • H01L21/02538H01L21/02625
    • PURPOSE:To facilitate to control concentration of electrons when a III-V group compound semiconductor layer is to be formed by a method wherein the compound of Te and another element is used as the N type impurities of the III-V group compound semiconductor. CONSTITUTION:When a III-V group compound semiconductor is to be manufactured according to liquid phase epitaxial growth, a compositionally uniform compound of Te and another element is used as N type impurities. As the other element, at least one kind of elements to act as N type impurities to exert no adverse effect to the characteristic of the element, or to act as electrically neutral impurities is used. As the element thereof, Al, Ga, In, Si, Sn, Pb, As, Sb, Bi and Se are used. Te is used generally as N type impurities at liquid phase epitaxial growth of the III-V group compound semiconductor, while because the segragation factor of Te is large, the charge quantity thereof becomes extremely small, and precision of weighing is deteriorated. By using the compound of the other impurity and Te, enhancement of weighing precision can be attained.
    • 目的:为了通过其中使用Te和另一种元素的化合物作为III-V族化合物半导体的N型杂质的方法形成III-V族化合物半导体层,便于控制电子浓度。 构成:当根据液相外延生长制造III-V族化合物半导体时,使用组合均匀的Te和另一种元素的化合物作为N型杂质。 作为另一种元素,使用作为N型杂质的至少一种元素不会对元件的特性产生不利影响或用作电中性杂质。 作为其元素,使用Al,Ga,In,Si,Sn,Pb,As,Sb,Bi和Se。 Te通常在III-V族化合物半导体的液相外延生长中用作N型杂质,而由于Te的分离因子大,其电荷量变得非常小,称重精度降低。 通过使用其他杂质和Te的化合物,可以提高称重精度。
    • 35. 发明专利
    • Semiconductor laser element
    • 半导体激光元件
    • JPS58196083A
    • 1983-11-15
    • JP7824182
    • 1982-05-12
    • Hitachi Ltd
    • YAMASHITA SHIGEOKASHIWADA YASUTOSHIOOUCHI HIROBUMI
    • H01S5/00H01S5/042
    • H01S5/0422
    • PURPOSE:To reduce the value of oscillation threshold current and thus obtain a high reliability by a method wherein the element is formed in a structure of internal current stricture regardless of the conductivity type of substrate crystal. CONSTITUTION:A P-GaAs layer 2 and an N-GaAs layer 3 are formed on an N- GaAs substrate 1 by a liquid phase growing method. Next, a groove 4 is provided in a stripe shape by a photo lithography process, and a P-Ga1-xAlxAs clad layer 5, an undoped Ga1-yAlyAs active layer 6, an N-Ga1-xAlxAs clad layer 7, and an N-GaAs cap layer 8 are grown thereon. Then, using the mask of Al2O3- SiO2, Zn is selectively diffused at a part until it reaches the P-GaAs layer 2. The clearance between an active region and a Zn diffused region 9 is etched to the layer 3, and protected with an SiO2 film 11. Finally, Ti-Pa-Au is evaporated as a surface P-side electrode 12, and AuGeNi-Pd-Au as an N-side electrode 13.
    • 目的:为了降低振荡阈值电流的值,并且通过其中元件形成为内部电流限制的结构而不管衬底晶体的导电类型如何的方法获得高可靠性。 构成:通过液相生长法在N-GaAs衬底1上形成P-GaAs层2和N-GaAs层3。 接着,通过光刻工艺形成条状的槽4,将P-Ga1-xAlxAs包覆层5,未掺杂的Ga1-yAlyAs有源层6,N-Ga1-xAlxAs覆盖层7和N -GaAs覆盖层8生长在其上。 然后,使用Al2O3-SiO2的掩模,Zn在一部分选择性地扩散,直到其到达P-GaAs层2.有源区和Zn扩散区9之间的间隙蚀刻到层3上,并用 最后,作为N面电极13,作为表面P侧电极12,AuGeNi-Pd-Au蒸镀Ti-Pa-Au。