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    • 5. 发明专利
    • SEMICONDUCTOR OPTICAL ELEMENT
    • JPH04783A
    • 1992-01-06
    • JP15281990
    • 1990-06-13
    • HITACHI LTD
    • KAYANE NAOKISAKANO SHINJIOKA SATOHIKOUOMI KAZUHISAOTOSHI SOTSUCHIYA TOMONOBUOKAI MAKOTO
    • H01S5/00H01S5/042H01S3/18
    • PURPOSE:To stably oscillated light of a desired wavelength by differentiating the differentiation gain coefficient for an injected carrier density of a gain active layer oscillated through amplification of a light having a specific wavelength from that for a light amplifying active later. CONSTITUTION:A phase regulating region 102 having an optical waveguide 181 in which a refractive index is reduced upon increasing of injected carrier density and a light amplifying region 103 made of an active optical waveguide 105 having a second active layer structure are provided. When a material having shorter wavelength of the wavelength lambdaP2 of a gain peak than a laser oscillation wavelength lambdaL is used as an active waveguide 141, the wavelength lambdaP2 does not coincide with the wavelength lambdaL in the material having the short wavelength lambdaP2 at a gain peak. Accordingly, a gain gradient becomes smooth, and even if carrier density is increased, an increase in a photon density is suppressed, a reduction in carrier density upon inductive emission depending upon the photon density is suppressed to increase the carrier density. Therefore, a region 101 does not reach a gain to self-oscillation, and a wavelength variable width and particularly Bragg's reflection wavelength can be increased.
    • 8. 发明专利
    • SEMICONDUCTOR OPTICAL ELEMENT
    • JPH0210786A
    • 1990-01-16
    • JP15911688
    • 1988-06-29
    • HITACHI LTD
    • KAYANE NAOKITSUJI SHINJIUOMI KAZUHISAOKAI MAKOTO
    • H01L33/10H01L33/16H01L33/30H01L33/34H01S5/00H01S5/12
    • PURPOSE:To realize a longitudinal single mode which is stable in wave length by covering the end face to emit the light with amorphous material, and making the thickness enough larger than the wave length of the light in the material, and being near the refractive index of the material to the refraction of a semiconductor. CONSTITUTION:A diffraction grating 2 in which only the central member is shifted for phase is formed on an n-type InP substrate 1, and thereon a light guide layer 3, an active layer 4, a clad layer 5, a cap layer are grown in order by a liquid phase growth method. Hereafter, these grown layers are removed partially by chemical etching, and amorphous Si7 containing hydrogen is attached by CVD. Next, a p side electrode 8 and an n side electrode 9 are deposited and the element is cut off. Hereafter, an SiN film 10 is formed at the end face on the left by sputtering so as to reduce the reflection factor. For the thickness of amorphous Si, it is more than 2mum at least, desirably more than 4mum. Hereby, the low reflection factor end face excellent in reproducibility can be realized without recourse to crystal growth.
    • 9. 发明专利
    • SEMICONDUCTOR LASER DEVICE
    • JPH01187890A
    • 1989-07-27
    • JP1063388
    • 1988-01-22
    • HITACHI LTD
    • OKAI MAKOTOKAYANE NAOKI
    • H01S5/00H01S5/12H01S5/16H01S5/20
    • PURPOSE:To facilitate the reduction of the end surface reflectance of a semiconductor laser securely without giving a harmful influence upon the element characteristics of the semiconductor laser by providing a region into which ions are implanted so as to reach an active layer near the one end surface or both the end surfaces. CONSTITUTION:A diffraction lattice 2 is formed on the surface of an n-type InP substrate 1 by an interference exposure method. A phase shift part 3 is provided in the diffraction lattice 2. An n-type InGaAsP light guide layer 4, an undoped InGaAsP active layer 5, a p-type InGaAsP anti-meltback layer 6 and a p-type InP cladding layer 7 is successively built up on the substrate 1. Ions such as protons are implanted so as to reach the region below the active layer 5 with a gold pattern as a mask to form a region 8. After that, an n-type electrode 9 and a p-type electrode 10 are formed. By the ion implantation, recombination cores are produced in the active layer and the loss in the active layer is increased and the reflection at the end surface can be reduced. After a cleaving, a non-reflective coating film 11 is applied to the end surface into which ions are not implanted. If the reflectance is suppressed not to exceed 5% by this coating, a vertical single mode oscillation can be realized with a good reproducibility.