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    • 1. 发明专利
    • SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
    • JPH09298334A
    • 1997-11-18
    • JP11338796
    • 1996-05-08
    • HITACHI LTD
    • HAGA TORUKONO TOSHIHIRO
    • H01S5/00H01S3/18
    • PROBLEM TO BE SOLVED: To reduce the threshold of an buried hetero-junction laser by burying and growing a first conductivity type semiconductor layer and second conductivity type semiconductor layer, diffusing a dopant into the surface of this semiconductor layer to change it to a first conductivity type one and burying and growing a first and second conductivity semiconductor layers. SOLUTION: A p-type clad layer 2 is grown on a p-type substrate 1 and an undoped MQW active layer 3 an n-type clad layer 4 are grown. A SiO2 film 15 is deposited. After a photolithographic step, a mesa stripe having smooth side faces is formed by etching while using this film 15 as a mask. Its side faces are filled with a Zn-doped p-type InP layer 5 and Si-doped n-type InP layer 6 to form a p-type Zn diffused layer 7 on the surface of the InP layer 6. A Zn-doped p-type InP layer 8 and Si-doped n-type InP layer 9 are grown and the mesa stripe is buried. The SiO2 film is removed and n-type InP layer 10 and n-type InGaAs cap layer 11 are buried flat.
    • 3. 发明专利
    • SEMICONDUCTOR LASER DEVICE
    • JPH07221388A
    • 1995-08-18
    • JP1238694
    • 1994-02-04
    • HITACHI LTD
    • HAGA TORUKONO TOSHIHIROITO KAZUHIROMITANI KATSUHIKO
    • H01S5/00H01S3/18
    • PURPOSE:To provide a surface emission laser using an excellent reflection surface which is inclined 45 deg. against the surface of a substrate by forming the reflection surface regardless of the kind of the semiconductor crystal used. CONSTITUTION:A semiconductor laser 4 is formed on an InP substrate 1 which is inclined 9 deg. to 10 deg. in (110) direction against (100) face so that the emitting direction of laser light 5 can become coincident with (110). After forming the laser 4, an SiNX film is deposited on the entire surface of the substrate 1 by using the CVD method. A part where the semiconductor layer is exposed is formed near a laser light emitting surface by treating the SiNX film by photolithography and etching and an InP layer 2 is selectively grown on the part by metal organic chemical vapor deposition. The angle between one side face of the selectively grown layer 2 in (110) direction and the substrate l becomes 45 deg.. When the laser light 5 emitted from the laser 4 is made incident to the side face, the light 5 is reflected in the direction perpendicular to the substrate 1.
    • 4. 发明专利
    • SEMICONDUCTOR LIGHT-EMITTING ELEMENT
    • JPH0385774A
    • 1991-04-10
    • JP22143689
    • 1989-08-30
    • HITACHI LTD
    • HANEDA MAKOTOKONO TOSHIHIROTSUJI SHINJIONO YUICHIAIKI KUNIO
    • H01L33/06H01L33/10H01L33/14H01L33/24H01L33/28H01L33/30H01L33/40
    • PURPOSE:To obtain a light-emitting element with improved external quantum efficiency and improved light-collecting and coupling properties by forming a high-reflection layer on one side of a p-n junction having a function for emitting light by injection of current and enabling light to be taken out to the other side and then forming a recessed shape in the direction of irradiation of light. CONSTITUTION:By etching only the central part of a current block layer 4a selectively and then creating a P-type clad layer 4 and a contact layer 5 by LPE(Liquid Phase Epitaxy), planes 2a and 3 can be formed not in parallel with a light taking-out plane 10. Also, since the center of each radius of curvature is located at the outside of an element, it is possible to obtain the element with extremely improved light-collecting property. Also, with this structure, since there is a current blocking layer 4a, it is possible to enable current to be fed to a hetero junction layer and to obtain a high multiplex quantum effect. Also, approximately 90% of light projected onto the rear from a light-emitting part is reflected by a light-reflecting multilayer film 3, is collected by a recessed shape, and can be taken out through the light take-out window 10.
    • 5. 发明专利
    • SEMICONDUCTOR LASER ELEMENT
    • JPH02228087A
    • 1990-09-11
    • JP4650389
    • 1989-03-01
    • HITACHI LTD
    • TANAKA TOSHIAKIKONO TOSHIHIROKAJIMURA TAKASHI
    • H01S5/00H01S5/065H01S5/22H01S5/223H01S5/227H01S5/30H01S5/34H01S5/343
    • PURPOSE:To improve the high output and low noise characteristic by constructing an active layer of a single quantum well layer and superlattice multiple quantum well layers provided on the upper and lower surfaces thereof and forming a ridged waveguide structure for obtaining a self-oscillating laser element. CONSTITUTION:An active layer is constructed of a single quantum well layer 5 and superlattice multiple quantum well layers 4, 6 provided on the upper and lower surfaces thereof, and composition, film thickness, and impurity concentration of respective layers 4, 5, 6 are caused by have predetermined values. A light waveguide layer, on the opposite side of a semiconductor substrate with respect to the active layer, has a mesa-stripe-like ridged part extending in the resonator length direction, and light absorption and current constriction parts are formed on the light waveguide layer with the ridge part at the both ends of the ridged part, and self-oscillation is effected. Therefore, the laser light distribution is controlled and the light absorption layer is provided at a predetermined position relative to the active layer, so that the effective refraction index difference in the lateral direction of the active layer can be caused to have a desired value. Thus, a high output characteristic required by a writing and erasing light source for an optical disk, and a low noise characteristic required by a reading light source can be obtained.
    • 7. 发明专利
    • SEMICONDUCTOR LASER
    • JPS63281487A
    • 1988-11-17
    • JP11462287
    • 1987-05-13
    • HITACHI LTD
    • NAKATSUKA SHINICHISAITO KATSUTOSHIKONO TOSHIHIROKAJIMURA TAKASHI
    • H01S5/00
    • PURPOSE:To get rid of element failure caused by the deterioration of current constriction effect, and reduce a leak current caused by light, by a method wherein a p-n junction to constrict the current of a semiconductor laser is separated from a buried growth boundary surface, by providing a crystal surface before buried and grown with an n-type inverting region. CONSTITUTION:On an n-type GaAs substrate 1, the following are crystal-grown in order by MOCVD method; an n-type clad layer 2 of GaAlAs, an undoped active layer 3, a p-type clad layer 4, a p-type etching interruption layer 7, a p-type selective etching layer 8 and a p-type cap layer 9. Then, an SiO2 mask is formed, etching applying phosphoric acid system liquid is performed, in which the selective etching layer 8 outside stripes is left, and the residual selective etching layer is eliminated by heated hydrochloric acid. Thereby, the exact stop at the surface of the etching interruption layer 7 is enabled. Again by MOCVD method, an n-type GaAs 6 is buried, and eliminated after growth, by hydrofluoric system etching liquid. At that time, a junction is formed in a growth layer of the first time, and the characteristics are stabilized, by supplying n-type dopant material in order to invert the clad layer 4 side of the buried boundary surface into n-type. Further, this inverting layer 5 blocks a leak current of minority carrier generated in a light absorbing layer 6.
    • 9. 发明专利
    • CRYSTAL GROWING APPARATUS
    • JPS63185017A
    • 1988-07-30
    • JP1606987
    • 1987-01-28
    • HITACHI LTD
    • ONO YUICHIKONO TOSHIHIROHIRUMA TAKEYUKIKOBAYASHI JUNICHIIKEGAWA MASATOUSUI TAKETO
    • H01L21/205
    • PURPOSE:To provide excellent uniformity in a composition face and film thickness, and to prevent the hysteresis of the composition from occurring by disposing a substrate holder in a conical reactor, and disposing a cooler in the downstream section of a substrate to form a reacted gas passing section in a rectifying susceptor structure. CONSTITUTION:A material gas inlet tube 2 and a gas mixture chamber 3 are provided at the top of a reaction tube 1, and a reaction tube wall 4 for forming part of a conical shape, a rectifying susceptor, a susceptor 5 used as a substrate supporting susceptor, a substrate holder 6 disposed on the susceptor, and a substrate material 7 are provided. The holder 6 is always disposed in the conical section 4 at this time, a lower section from the upper end of the substrate is formed in a water-cooling structure, and a water inlet 8 and an outlet 9 are provided. The space of the upstream section of the substrate is formed in a conical shape to improve gas flowing velocity, and the surface temperature is held highly by the heat radiation effect of the holder. The inclining angle thetaof the substrate to the tube wall is set to 3-7 degrees to remarkably improve a crystal film thickness distribution on the surface.