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31. 发明申请

US20080186040A1 APPARATUS FOR TESTING DEVICES 有权
标题翻译：用于测试设备的设备
公开(公告)号：US20080186040A1
公开(公告)日：2008-08-07
申请号：US11864690
申请日：2007-09-28
申请人： Eric D. Hobbs , Andrew W. McFarland
发明人： Eric D. Hobbs , Andrew W. McFarland
IPC分类号： G01R31/26 , G01R1/02
CPC分类号： G01R31/2863 , G01R31/2889 , G01R31/31905
摘要： Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.
摘要翻译：本文提供了测试半导体器件的方法和装置。在一些实施例中，用于测试半导体器件的组件可以包括探针卡组件; 以及设置在探针卡组件的上表面附近的热障，热障可以限制测试仪侧边界条件与布置在热障下方的探针卡组件的部分之间的热传递。

32. 发明授权

US07285968B2 Apparatus and method for managing thermally induced motion of a probe card assembly 有权
标题翻译：用于管理探针卡组件的热诱导运动的装置和方法
公开(公告)号：US07285968B2
公开(公告)日：2007-10-23
申请号：US11306515
申请日：2005-12-30
申请人： Benjamin N. Eldridge , Gary W. Grube , Eric D. Hobbs , Gaetan L. Mathieu , Makarand S. Shinde , Alexander H. Slocum , A. Nicholas Sporck , Thomas N. Watson
发明人： Benjamin N. Eldridge , Gary W. Grube , Eric D. Hobbs , Gaetan L. Mathieu , Makarand S. Shinde , Alexander H. Slocum , A. Nicholas Sporck , Thomas N. Watson
IPC分类号： G01R31/02
CPC分类号： G01R31/2874 , G01R31/2863 , G01R31/2889 , Y10T29/5313
摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.
摘要翻译：探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。探针头组件可以电连接到布线基板并且机械地附接到加强板。布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。布线基板可以在布线基板的中心位置处附接到加强板。可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

33. 发明申请

US20180071730A1 Isolating Microfluidic Structures and Trapping Bubbles 审中-公开
公开(公告)号：US20180071730A1
公开(公告)日：2018-03-15
申请号：US15634097
申请日：2017-06-27
申请人： Keith Joseph Breinlinger , Eric D. Hobbs , Dorian Liepmann , Joshua Tanner Nevill , Mark P. White , Maria Jimena Loureiro
发明人： Keith Joseph Breinlinger , Eric D. Hobbs , Dorian Liepmann , Joshua Tanner Nevill , Mark P. White , Maria Jimena Loureiro
IPC分类号： B01L3/00 , C12M3/06
CPC分类号： B01L3/5027 , B01L2200/0647 , B01L2200/0684 , B01L2300/0864 , B01L2300/0883 , B01L2400/086 , C12M23/16 , Y10T436/2575
摘要： Some configurations of a microfluidic apparatus can comprise a fluidic circuit of interconnected fluidic structures into which a plurality of different media can be introduced or extracted. A variety of operations can be performed with the different media including isolating with a second medium one or more of the fluidic structures that is filled partially or fully with a first medium. Discrete volumes of a medium can be moved through the isolating second medium to deliver materials or micro-objects to or remove micro-objects or materials from a fluidic structure that is otherwise isolated by the second medium. Some configurations of a microfluidic apparatuses can isolate microfluidic structures in a microfluidic apparatus using flow rates or blocking structures, and some configurations can manage bubbles in fluidic structures.

34. 发明授权

US08120373B2 Stiffener assembly for use with testing devices 有权
标题翻译：用于测试装置的加强装置
公开(公告)号：US08120373B2
公开(公告)日：2012-02-21
申请号：US13022443
申请日：2011-02-07
申请人： Eric D. Hobbs , Andrew W. McFarland
发明人： Eric D. Hobbs , Andrew W. McFarland
IPC分类号： G01R31/20 , G01R31/00
CPC分类号： G01R1/07378
摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.
摘要翻译：本文提供了一种与测试装置一起使用的加强装置。在一些实施例中，用于与测试装置一起使用的加强件组件可以是探针卡组件的一部分，其可以包括加强件组件，该加强件组件包括联接到多个下加强件的上加强件; 以及限制在所述上加强件和所述多个下加强件之间的衬底，所述加强件组件限制所述衬底的非平面弯曲，同时促进所述衬底相对于所述加强件组件的径向移动。

35. 发明授权

US07999375B2 Electronic device with integrated micromechanical contacts and cooling system 失效
标题翻译：具有集成微机电触点和冷却系统的电子设备
公开(公告)号：US07999375B2
公开(公告)日：2011-08-16
申请号：US11548668
申请日：2006-10-11
申请人： Eric D. Hobbs , Gaetan L. Mathieu
发明人： Eric D. Hobbs , Gaetan L. Mathieu
IPC分类号： H01L23/34
CPC分类号： H01L23/34 , B81B7/0006 , B81B7/0093 , H01L23/473 , H01L2924/0002 , H01L2924/14 , H01L2924/19041 , H01L2924/00
摘要： An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of electrically conductive elongate, contact structures, which can be disposed on input and/or output terminals of the semiconductor die. The micromechanical system can also comprise a cooling structure disposed on the semiconductor die.
摘要翻译：电子设备可以包括其上可以形成微机械系统的半导体管芯。微机械系统可以包括多个导电细长的接触结构，其可以设置在半导体管芯的输入和/或输出端子上。微机械系统还可以包括设置在半导体管芯上的冷却结构。

36. 发明申请

US20100327891A1 METHOD AND APPARATUS FOR THERMALLY CONDITIONING PROBE CARDS 有权
标题翻译：用于热调制探针卡的方法和装置
公开(公告)号：US20100327891A1
公开(公告)日：2010-12-30
申请号：US12492177
申请日：2009-06-26
申请人： Eric D. Hobbs
发明人： Eric D. Hobbs
IPC分类号： G01R31/02
CPC分类号： G01R31/2874
摘要： Embodiments of probe cards and methods for fabricating and using same are provided herein. In some embodiments, an apparatus for testing a device (DUT) may include a probe card configured for testing a DUT; a thermal management apparatus disposed on the probe card to heat and/or cool the probe card; a sensor disposed on the probe card and coupled to the thermal management apparatus to provide data to the thermal management apparatus corresponding to a temperature of a location of the probe card; a first connector disposed on the probe card and coupled to the thermal management apparatus for connecting to a first power source internal to a tester; and a second connector, different than the first connector, disposed on the probe card and coupled to the thermal management apparatus for connecting to a second power source external to the tester.
摘要翻译：本文提供了探针卡及其制造和使用方法的实施例。在一些实施例中，用于测试设备（DUT）的设备可以包括配置用于测试DUT的探针卡; 设置在探针卡上以加热和/或冷却探针卡的热管理装置; 传感器，设置在所述探针卡上并耦合到所述热管理装置，以向与所述探针卡的位置的温度相对应的所述热管理装置提供数据; 第一连接器，其设置在所述探针卡上并且耦合到所述热管理装置，用于连接到测试仪内部的第一电源; 以及与第一连接器不同的第二连接器，其设置在探针卡上并且耦合到热管理装置，用于连接到测试仪外部的第二电源。

37. 发明申请

US20100164323A1 BIASED GAP-CLOSING ACTUATOR 有权
标题翻译：偏心缝隙致动器
公开(公告)号：US20100164323A1
公开(公告)日：2010-07-01
申请号：US12345292
申请日：2008-12-29
申请人： Eric D. Hobbs , Gaetan L. Mathieu
发明人： Eric D. Hobbs , Gaetan L. Mathieu
IPC分类号： H02N11/00
CPC分类号： H02N1/006
摘要： A gap-closing actuator includes a stator having one or more first electrodes, a mover having one or more second electrodes interposed among the first electrodes, and a biasing mechanism for applying a non-capacitive bias to the mover for urging the mover to move in a desired direction with respect to the stator. The non-capacitive bias is different from a capacitive force generated between the first and second electrodes when the gap-closing actuator is in operation.
摘要翻译：间隙关闭致动器包括具有一个或多个第一电极的定子，具有插入在第一电极中的一个或多个第二电极的移动器，以及用于向移动器施加非电容性偏压以推动移动器移动的偏置机构相对于定子的期望方向。当间隙关闭致动器运行时，非电容性偏压不同于在第一和第二电极之间产生的电容性力。

38. 发明授权

US07746089B2 Method and apparatus for indirect planarization 失效
标题翻译：用于间接平面化的方法和装置
公开(公告)号：US07746089B2
公开(公告)日：2010-06-29
申请号：US11537164
申请日：2006-09-29
申请人： Eric D. Hobbs , Alexander H. Slocum
发明人： Eric D. Hobbs , Alexander H. Slocum
IPC分类号： G01R31/02
CPC分类号： G01R1/07364
摘要： Methods and apparatus for indirect planarization of a substrate are provided herein. In one embodiment, an apparatus for indirectly planarizing a probe card assembly includes an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly; a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from the adjustment portion; and a mechanism coupling the adjustment portion to the force application portion.
摘要翻译：本文提供了用于衬底的间接平面化的方法和装置。在一个实施例中，用于间接平面化探针卡组件的装置包括用于控制施加到探针卡组件的探针基板的力的调节部分; 力施加部，其构造成在从所述调节部侧向偏移的位置处向所述探针基板施加力; 以及将调节部联接到力施加部的机构。

39. 发明授权

US07622935B2 Probe card assembly with a mechanically decoupled wiring substrate 有权
标题翻译：具有机械去耦接线基板的探头卡组件
公开(公告)号：US07622935B2
公开(公告)日：2009-11-24
申请号：US11551545
申请日：2006-10-20
申请人： Eric D. Hobbs , Alexander H. Slocum , Benjamin N. Eldridge , Keith J. Breinlinger , Shawn Powell
发明人： Eric D. Hobbs , Alexander H. Slocum , Benjamin N. Eldridge , Keith J. Breinlinger , Shawn Powell
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2893
摘要： A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.
摘要翻译：探针卡组件可以包括探针头组件和布线衬底。探针头组件可以包括多个探针，其设置成接触设置在测试壳体中的保持器上的电子设备。布线基板可以包括与测试控制器的电接口以及构成电接口和探针之间的电气路径的多个电线，并且布线基板可以包括其上设置有电接口的第一部分和第二部分组成探头组件的部分。布线基板的第二部分能够相对于布线基板的第一部分移动。

40. 发明申请

US20090079452A1 COMPONENT ASSEMBLY AND ALIGNMENT 失效
标题翻译：组件装配和对准
公开(公告)号：US20090079452A1
公开(公告)日：2009-03-26
申请号：US11861559
申请日：2007-09-26
申请人： Benjamin N. Eldridge , Eric D. Hobbs , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Eric D. Hobbs , Gaetan L. Mathieu
IPC分类号： G01R1/073 , G01R31/02 , H01L21/68
CPC分类号： G01R31/2891 , G01R1/06716 , G01R1/07342 , G11C29/56 , G11C29/56016 , G11C2029/5602 , H01L21/682 , Y10T29/49002
摘要： A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.
摘要翻译：用于对准多个结构的方法或设备可以包括将第一平面中的第一力施加到第一结构。该方法还可以包括在第一平面中约束相对于第二结构的第一结构，使得第一结构相对于将第一结构上的第一特征与第二结构上的第二特征对准的第二结构处于相对位置。第二特征可以在通常平行于第一平面的第二平面中。第一和第二结构可以是第一和第二电子部件，其可以是探针卡组件的部件。

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