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1. 发明授权

US07659736B2 Mechanically reconfigurable vertical tester interface for IC probing 有权
标题翻译：用于IC探测的机械可重构垂直测试仪接口
公开(公告)号：US07659736B2
公开(公告)日：2010-02-09
申请号：US11761912
申请日：2007-06-12
申请人： Benjamin N. Eldridge , Barbara Vasquez , Makarand S. Shinde , Gaetan L. Mathieu , A. Nicholas Sporck
发明人： Benjamin N. Eldridge , Barbara Vasquez , Makarand S. Shinde , Gaetan L. Mathieu , A. Nicholas Sporck
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R1/0416 , G01R1/07307
摘要： A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.
摘要翻译：晶片测试组件包括多个探针头基底，其布置成瓦片，其中连接器连接到一侧，探针支撑在相对侧上。在一个实施例中，柔性电缆连接器将探头头瓦片上的连接器直接连接到测试头，而在另一个实施例中，柔性电缆将探头头瓦片连接到PCB，从而向测试头连接器提供水平布线。在一个实施例中，调平销提供连接到附接到瓦片的保持元件以提供施加推挽平整力的简化支撑结构。测试头连接器接口框架能够重新布置测试头和探针卡之间的连接器，以提供完整的晶片接触或部分晶片接触。测试头连接器通过在轨道上滑动来重新布置，或者可插拔和可拔出，使得能够在一定范围的位置上移动。

2. 发明授权

US07616016B2 Probe card assembly and kit 失效
标题翻译：探针卡组合和套件
公开(公告)号：US07616016B2
公开(公告)日：2009-11-10
申请号：US12060753
申请日：2008-04-01
申请人： Benjamin N. Eldridge , Igor Y. Khandros , A. Nicholas Sporck
发明人： Benjamin N. Eldridge , Igor Y. Khandros , A. Nicholas Sporck
IPC分类号： G01R31/02
CPC分类号： H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/07342 , G01R1/07364 , G01R1/07378 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/76897 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45014 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4092 , H05K7/1069 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/48 , H01L2224/05599
摘要： In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.
摘要翻译：在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。一个优选的主要接触是弹性弹簧接触。空间变压器中的导电元件以更放松的间距被路由到第二触点。在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

3. 发明授权

US07548055B2 Testing an electronic device using test data from a plurality of testers 失效
标题翻译：使用来自多个测试器的测试数据测试电子设备
公开(公告)号：US07548055B2
公开(公告)日：2009-06-16
申请号：US11696582
申请日：2007-04-04
申请人： Igor Y. Khandros , Benjamin N. Eldridge , Charles A. Miller , A. Nicholas Sporck
发明人： Igor Y. Khandros , Benjamin N. Eldridge , Charles A. Miller , A. Nicholas Sporck
IPC分类号： G01R31/28
CPC分类号： G01R1/0491 , G01R1/073 , G01R31/3025
摘要： A method and apparatus for testing a set of electronic devices can comprise placing electronic devices into a test station. A plurality of testers can provide test data to the test station. The test station can test the electronic devices using test data received from the plurality of testers. One of the testers can communication with another of the testers regarding the testing of the electronic devices. Probes can be used to contact the electronic devices, and one of the electronic devices can be contacted by more than one of the probes.
摘要翻译：用于测试一组电子设备的方法和装置可以包括将电子设备放置在测试台中。多个测试者可以向测试台提供测试数据。测试台可以使用从多个测试器接收的测试数据来测试电子设备。其中一个测试人员可以与其他测试人员进行电子设备测试的通信。探针可用于接触电子设备，并且其中一个电子设备可以被多个探针接触。

4. 发明申请

US20080180121A1 PROBE CARD ASSEMBLY AND KIT 失效
标题翻译：探针卡大会和工具包
公开(公告)号：US20080180121A1
公开(公告)日：2008-07-31
申请号：US12060753
申请日：2008-04-01
申请人： Igor Y. Khandros , A. Nicholas Sporck , Benjamin N. Eldrdge
发明人： Igor Y. Khandros , A. Nicholas Sporck , Benjamin N. Eldrdge
IPC分类号： G01R1/073
CPC分类号： H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/07342 , G01R1/07364 , G01R1/07378 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/76897 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45014 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4092 , H05K7/1069 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/48 , H01L2224/05599
摘要： In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.
摘要翻译：在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。硅空间变压器可以以非常紧的间距以与半导体器件的间距相当的主要触点阵列制造。一个优选的主要接触是弹性弹簧接触。空间变压器中的导电元件以更放松的间距被路由到第二触点。在一个优选实施例中，第二触头适于直接连接带状电缆，带状电缆又可连接以提供与每个主触点的选择性连接。硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

5. 发明授权

US07821255B2 Test system with wireless communications 有权
标题翻译：无线通信测试系统
公开(公告)号：US07821255B2
公开(公告)日：2010-10-26
申请号：US12485677
申请日：2009-06-16
申请人： Igor Y. Khandros , Benjamin N. Eldridge , Charles A. Miller , A. Nicholas Sporck
发明人： Igor Y. Khandros , Benjamin N. Eldridge , Charles A. Miller , A. Nicholas Sporck
IPC分类号： G01R31/02
CPC分类号： G01R1/0491 , G01R1/073 , G01R31/3025
摘要： A test system for testing electronic devices can include a plurality of testers and a test station. The test station can include probes to contact the devices and the tester can control testing. Test data can be received by the test station from the testers using wireless communications links.
摘要翻译：用于测试电子设备的测试系统可以包括多个测试器和测试台。测试站可以包括与设备接触的探头，测试仪可以控制测试。测试台可以使用无线通信链路从测试人员接收测试数据。

6. 发明授权

US07550842B2 Integrated circuit assembly 失效
标题翻译：集成电路组件
公开(公告)号：US07550842B2
公开(公告)日：2009-06-23
申请号：US10317661
申请日：2002-12-12
申请人： Igor Y. Khandros , Benjamin N. Eldridge , Charles A. Miller , A. Nicholas Sporck , Gary W. Grube , Gaetan L. Mathieu
发明人： Igor Y. Khandros , Benjamin N. Eldridge , Charles A. Miller , A. Nicholas Sporck , Gary W. Grube , Gaetan L. Mathieu
IPC分类号： H01L23/34
CPC分类号： H01L23/13 , H01L23/4951 , H01L23/5386 , H01L23/5387 , H01L24/48 , H01L24/49 , H01L24/50 , H01L25/0655 , H01L2224/0401 , H01L2224/05554 , H01L2224/06136 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/4824 , H01L2224/49 , H01L2224/73215 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/0105 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2924/15192 , H01L2924/181 , H01L2924/19043 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： In an integrated circuit assembly, know good die (KGD) are assembled on a substrate. Interconnect elements electrically connect pads on a die attached to the substrate to traces or other electrical conductors on the substrate or to pads on another die attached to the substrate. The substrate may have one or more openings, exposing pads of the die. The assembly may comprise one or more dice.
摘要翻译：在集成电路组件中，将好的芯片（KGD）组装在基板上。互连元件将附接到衬底的芯片上的焊盘电连接到衬底上的迹线或其它电导体或连接到衬底的另一芯片上的焊盘。衬底可以具有一个或多个开口，暴露管芯的焊盘。组件可以包括一个或多个骰子。

7. 发明申请

US20090085590A1 Method And Apparatus For Testing Devices Using Serially Controlled Intelligent Switches 有权
标题翻译：使用串行智能开关测试设备的方法和装置
公开(公告)号：US20090085590A1
公开(公告)日：2009-04-02
申请号：US11862751
申请日：2007-09-27
申请人： Tommie Edward Berry , A. Nicholas Sporck
发明人： Tommie Edward Berry , A. Nicholas Sporck
IPC分类号： G01R1/02 , G01R31/26
CPC分类号： G01R1/07342 , G01R31/2889
摘要： Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line.
摘要翻译：已经描述了使用串行控制的智能开关来测试装置的方法和装置。在一些实施例中，可提供探针卡组件，其包括串联耦合以形成链的多个集成电路（IC），所述链耦合到至少一个串行控制线，所述多个IC包括耦合到测试探针的开关，每个开关可响应于至少一个串行控制线上的控制信号来编程。

8. 发明申请

US20080054917A1 METHOD AND APPARTUS FOR SWITCHING TESTER RESOURCES 有权
标题翻译：用于切换测试资源的方法和应用
公开(公告)号：US20080054917A1
公开(公告)日：2008-03-06
申请号：US11469788
申请日：2006-09-01
申请人： Roy J. Henson , A. Nicholas Sporck
发明人： Roy J. Henson , A. Nicholas Sporck
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R1/07385
摘要： A contactor device comprising a plurality of probes disposed to contact ones of the electronic devices can be electrically connected to a source of test signals. A switch can be activated electrically connecting a connection to the source of test signals to a selected one of a first group of electrically connected ones of the probes disposed to contact a first set of a plurality of the electronic devices or a second group of electrically connected ones of the probes disposed to contact a second set of a plurality of the electronic devices.
摘要翻译：包括设置成与电子设备接触的多个探针的接触器装置可电连接到测试信号源。可以激活开关，将连接到测试信号源的连接电连接到被设置为接触多个电子设备的第一组的第一组电连接的探针中的选定的一个或第二组电连接探针中的一个被设置为接触多个电子设备的第二组。

9. 发明授权

US07064566B2 Probe card assembly and kit 失效
公开(公告)号：US07064566B2
公开(公告)日：2006-06-20
申请号：US09042606
申请日：1998-03-16
申请人： Igor Y. Khandros , A. Nicholas Sporck , Benjamin N. Eldridge
发明人： Igor Y. Khandros , A. Nicholas Sporck , Benjamin N. Eldridge
IPC分类号： G01R31/02
CPC分类号： H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/07342 , G01R1/07364 , G01R1/07378 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/76897 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45014 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4092 , H05K7/1069 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/48 , H01L2224/05599
摘要： In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

10. 发明申请

US20110267085A1 METHOD AND APPARATUS FOR TESTING DEVICES USING SERIALLY CONTROLLED INTELLIGENT SWITCHES 有权
标题翻译：使用连续控制的智能开关测试设备的方法和装置
公开(公告)号：US20110267085A1
公开(公告)日：2011-11-03
申请号：US13179185
申请日：2011-07-08
申请人： Tommie Edward Berry , A. Nicholas Sporck
发明人： Tommie Edward Berry , A. Nicholas Sporck
IPC分类号： G01R1/073
CPC分类号： G01R1/07342 , G01R31/2889
摘要： Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line.
摘要翻译：已经描述了使用串行控制的智能开关来测试装置的方法和装置。在一些实施例中，可以提供探针卡组件，其包括串联耦合以形成链的多个集成电路（IC），所述链耦合到至少一个串行控制线，所述多个IC包括耦合到测试探针的开关，每个开关可响应于至少一个串行控制线上的控制信号来编程。

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