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    • 32. 发明申请
    • COMPOUND, POSITIVE RESIST COMPOSITION AND METHOD FOR FORMATION OF RESIST PATTERN
    • 化合物,阳性抗蚀剂组合物和形成耐火图案的方法
    • US20090269698A1
    • 2009-10-29
    • US12439149
    • 2007-08-03
    • Daiju ShionoHideo Hada
    • Daiju ShionoHideo Hada
    • G03F7/20C07C69/708G03F7/004
    • G03F7/0045C07C69/712G03F7/0392G03F7/0397
    • The present invention provides a compound that can be used within a resist composition, an intermediate compound for the compound, a positive resist composition, and a method for forming a resist pattern.The present invention discloses a compound represented by a general formula (A-1) shown below [wherein, R′ represents a hydrogen atom or an acid dissociable, dissolution inhibiting group, provided that at least one of the plurality of R′ groups represents an acid dissociable, dissolution inhibiting group; R″ represents an alkyl group of 1 to 10 carbon atoms; R11 to R17 each independently represents an alkyl group of 1 to 10 carbon atoms or an aromatic hydrocarbon group, which may include a hetero atom within the structure; g and j each independently represents an integer of 1 or greater, and k and q each represents an integer of 0 or greater; a represents an integer of 1 to 3; b represents an integer of 1 or greater, and l and m each independently represents an integer of 0 or greater; c represents an integer of 1 or greater, and n and o each independently represents an integer of 0 or greater; and A represents a group represented by a general formula (Ia) shown below, a group represented by a general formula (Ib) shown below, or an aliphatic cyclic group].
    • 本发明提供可用于抗蚀剂组合物中的化合物,化合物的中间体化合物,正性抗蚀剂组合物和形成抗蚀剂图案的方法。 本发明公开了由下述通式(A-1)表示的化合物[其中,R'表示氢原子或酸解离,溶解抑制基团,条件是多个R'基团中的至少一个表示 酸解离,溶解抑制组; R“表示1〜10个碳原子的烷基; R 11〜R 17各自独立地表示1〜10个碳原子的烷基或芳香族烃基,其可以在结构内包含杂原子; g和j各自独立地表示1或更大的整数,并且k和q各自表示0或更大的整数; a表示1〜3的整数, b表示1或更大的整数,l和m各自独立地表示0或更大的整数; c表示1或更大的整数,n和o各自独立地表示0或更大的整数; A表示由下述通式(Ia)表示的基团,由下述通式(Ib)表示的基团或脂族环基]表示。
    • 33. 发明授权
    • Compound, positive resist composition and method for formation of resist pattern
    • 化合物,正性抗蚀剂组合物和形成抗蚀剂图案的方法
    • US08257903B2
    • 2012-09-04
    • US12439149
    • 2007-08-03
    • Daiju ShionoHideo Hada
    • Daiju ShionoHideo Hada
    • G03F7/039G03F7/20G03F7/30C07C69/612C07C69/66
    • G03F7/0045C07C69/712G03F7/0392G03F7/0397
    • The present invention provides a compound that can be used within a resist composition, an intermediate compound for the compound, a positive resist composition, and a method for forming a resist pattern.The present invention discloses a compound represented by a general formula (A-1) shown below [wherein, R′ represents a hydrogen atom or an acid dissociable, dissolution inhibiting group, provided that at least one of the plurality of R′ groups represents an acid dissociable, dissolution inhibiting group; R″ represents an alkyl group of 1 to 10 carbon atoms; R11 to R17 each independently represents an alkyl group of 1 to 10 carbon atoms or an aromatic hydrocarbon group, which may include a hetero atom within the structure; g and j each independently represents an integer of 1 or greater, and k and q each represents an integer of 0 or greater; a represents an integer of 1 to 3; b represents an integer of 1 or greater, and l and m each independently represents an integer of 0 or greater; c represents an integer of 1 or greater, and n and o each independently represents an integer of 0 or greater; and A represents a group represented by a general formula (Ia) shown below, a group represented by a general formula (Ib) shown below, or an aliphatic cyclic group].
    • 本发明提供可用于抗蚀剂组合物中的化合物,化合物的中间体化合物,正性抗蚀剂组合物和形成抗蚀剂图案的方法。 本发明公开了由下述通式(A-1)表示的化合物[其中,R'表示氢原子或酸解离,溶解抑制基团,条件是多个R'基团中的至少一个表示 酸解离,溶解抑制组; R“表示1〜10个碳原子的烷基; R 11〜R 17各自独立地表示1〜10个碳原子的烷基或芳香族烃基,其可以在结构内包含杂原子; g和j各自独立地表示1或更大的整数,并且k和q各自表示0或更大的整数; a表示1〜3的整数, b表示1或更大的整数,l和m各自独立地表示0或更大的整数; c表示1或更大的整数,n和o各自独立地表示0或更大的整数; A表示由下述通式(Ia)表示的基团,由下述通式(Ib)表示的基团或脂族环基]表示。
    • 38. 发明申请
    • METHOD OF FORMING RESIST PATTERN
    • 形成电阻图案的方法
    • US20120208131A1
    • 2012-08-16
    • US13372740
    • 2012-02-14
    • Tomoyuki HiranoDaiju Shiono
    • Tomoyuki HiranoDaiju Shiono
    • G03F7/20
    • G03F7/325G03F7/0397G03F7/2041
    • A method of forming a resist pattern including: forming a resist film on a substrate using a resist composition containing a base component (A) which exhibits increased solubility in an organic solvent under action of acid and an acid generator component which generates acid upon exposure; conducting exposure of the resist film; and patterning the resist film by positive development using a developing solution containing the organic solvent to form a resist pattern, wherein a resin component containing a structural unit derived from an acrylate ester which may have a hydrogen atom bonded to a carbon atom on the α-position substituted with a substituent and contains an acid decomposable group which exhibits increased polarity by action of acid is used as the component (A), and a developing solution that contains a polar organic solvent but contains substantially no alkali components is used as the developing solution.
    • 一种形成抗蚀剂图案的方法,包括:使用含有在酸的作用下在有机溶剂中显示增加的溶解度的基础组分(A)的抗蚀剂组合物和在曝光时产生酸的酸产生剂组分的抗酸剂组合物在基材上形成抗蚀剂膜; 进行抗蚀剂膜的曝光; 通过使用含有有机溶剂的显影液进行正显影来形成抗蚀剂膜以形成抗蚀剂图案,其中含有可以具有与α-碳原子上的碳原子键合的氢原子的丙烯酸酯的结构单元的树脂组分, 作为成分(A),使用被取代基取代的含有酸分解性基团的酸分解性基团,作为成分(A),使用含有极性有机溶剂但不含碱成分的显影液作为显影液 。
    • 40. 发明申请
    • RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN
    • 耐蚀组合物和形成耐力图案的方法
    • US20120196226A1
    • 2012-08-02
    • US13343481
    • 2012-01-04
    • Shinji KumadaSatoshi MaemoriMasatoshi AraiDaiju Shiono
    • Shinji KumadaSatoshi MaemoriMasatoshi AraiDaiju Shiono
    • G03F7/20G03F7/004
    • G03F7/0045G03F7/0397G03F7/20
    • A resist composition including a base component (A), which exhibits changed solubility in a developing solution under the action of acid and can be used in a lithography process that employs light having a wavelength of 193 nm or less as the exposure light source, an acid generator component (B) which generates acid upon exposure, and a polymeric compound (C) having a structural unit (c0) represented by general formula (c0) shown below, wherein the amount of the polymeric compound (C) is less than 25 parts by mass relative to 100 parts by mass of the base component (A). In the formula, R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms, and R1 represents an organic group having one or more primary or secondary alcoholic hydroxyl groups, or a chain-like tertiary alcoholic hydroxyl group.
    • 一种抗蚀剂组合物,其包含在酸的作用下在显影液中溶解度变化的碱成分(A),可以用于使用波长为193nm以下的光作为曝光光源的光刻工序, 暴露时产生酸的酸产生剂组分(B)和具有如下所示的通式(c0)表示的结构单元(c0)的聚合化合物(C),其中聚合化合物(C)的量小于25 相对于100质量份的基础成分(A)为质量份。 在该式中,R表示氢原子,1〜5个碳原子的烷基或1〜5个碳原子的卤代烷基,R1表示具有一个或多个伯或仲醇羟基的有机基团,或 链状叔醇羟基。