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    • 33. 发明授权
    • Method of making borderless contact having a sion buffer layer
    • 制造无边界接触的方法,具有隔离缓冲层
    • US06444566B1
    • 2002-09-03
    • US09845481
    • 2001-04-30
    • Ming Huan TsaiJyh Huei ChenChu Yun FuHun Jan Tao
    • Ming Huan TsaiJyh Huei ChenChu Yun FuHun Jan Tao
    • H01L214763
    • H01L21/76897H01L21/76802H01L21/76832H01L21/76834
    • Borderless contacts are used in integrated circuits in order to conserve chip real estate. As part of the process for manufacturing borderless contacts, an etch-stopping layer of silicon nitride is first laid over the area that is to be contacted. Investigation has now shown that this can lead to damage to the silicon at the edges of the via. The present invention eliminates this damage by introducing a buffer layer between the silicon surface and said sidon nitride layer. Suitable materials for the buffer layer that have been found to be infective include silicon oxide and silicon oxynitride with the latter offering some ditional advantages over the former. Experimental data confirming the effectiveness of the buffer layer are provided, together with a process for its manufacture.
    • 无边界接触用于集成电路,以节省芯片的不动产。 作为制造无边界接触的工艺的一部分,首先将氮化硅的蚀刻停止层铺设在要接触的区域上。 现在调查显示,这可能导致在通孔边缘的硅损坏。 本发明通过在硅表面和所述侧氮化物层之间引入缓冲层来消除这种损害。 已经发现感染的缓冲层的合适材料包括氧化硅和氮氧化硅,后者提供了比前者更多的优点。 提供确认缓冲层有效性的实验数据及其制造方法。
    • 34. 发明授权
    • Integrated high density plasma chemical vapor deposition (HDP-CVD) method and chemical mechanical polish (CMP) planarizing method for forming patterned planarized aperture fill layers
    • 集成高密度等离子体化学气相沉积(HDP-CVD)方法和用于形成图案化平面化孔径填充层的化学机械抛光(CMP)平面化方法
    • US06365523B1
    • 2002-04-02
    • US09177188
    • 1998-10-22
    • Syun-Ming JangChu-Yun FuYing-Ho Chen
    • Syun-Ming JangChu-Yun FuYing-Ho Chen
    • H01L21302
    • H01L21/76229H01L21/31053H01L21/31612
    • A method for forming a series of patterned planarized aperture fill layers within a series of apertures within a topographic substrate layer employed within a microelectronics fabrication. There is first provided a topographic substrate layer employed within a microelectronics fabrication, where the topographic substrate layer comprises a series of mesas of substantially equivalent height but of differing widths and the series of mesas is separated by a series of apertures. There is then formed upon the topographic substrate layer a blanket first aperture fill layer. The blanket first aperture fill layer is formed employing a first simultaneous deposition and sputter method. The blanket first aperture fill layer fills the series of apertures to a planarizing thickness at least as high as the height of the mesas while simultaneously forming a series of protrusions of the blanket first aperture fill layer corresponding with the series of mesas, where the thickness of a protrusion of the blanket first aperture fill layer over a narrow mesa is less than the thickness of a protrusion of the blanket first aperture fill layer over a wide mesa. The first simultaneous deposition and sputter method employs a first deposition rate:sputter rate ratio which provides sufficient thickness of the blanket first aperture fill layer over the narrow mesa such that upon chemical mechanical polish (CMP) planarizing the blanket first aperture fill layer to form a series of patterned planarized first aperture fill layers within the series of apertures erosion of the narrow mesa is attenuated. Finally, there is then chemical mechanical polish (CMP) planarized the blanket first aperture fill layer to form the series of patterned planarized first aperture fill layers within the series of apertures.
    • 一种用于在微电子学制造中使用的地形衬底层内的一系列孔内形成一系列图案化的平坦化孔填充层的方法。 首先提供了在微电子制造中使用的地形衬底层,其中地形衬底层包括基本上等同的高度但具有不同宽度的一系列台面,并且一系列台面由一系列孔分隔开。 然后在地形衬底层上形成毯子第一孔填充层。 毯子第一孔填充层使用第一同时沉积和溅射方法形成。 毯子第一孔填充层将一系列孔填充至至少与台面的高度相同的平坦化厚度,同时形成与一系列台面相对应的毯子第一孔填充层的一系列突起,其中厚度 毯子第一孔填充层在窄台面上的突起小于宽台面上的第一孔填充层的突起的厚度。 第一同时沉积和溅射方法使用第一沉积速率:溅射速率比,其在窄台面上提供足够厚度的第一孔填充层,使得在化学机械抛光(CMP)上平坦化第一孔填充层以形成 一系列图案化的平面化的第一孔径填充层在一系列孔径内的狭窄台面的侵蚀被衰减。 最后,然后是化学机械抛光(CMP)平坦化第一孔填充层,以在一系列孔内形成一系列图案化的平坦化的第一孔填充层。
    • 35. 发明授权
    • Efficient lexical trending topic detection over streams of data using a modified sequitur algorithm
    • 使用修改的Sequitur算法对数据流进行有效的词汇趋势主题检测
    • US08838599B2
    • 2014-09-16
    • US12780850
    • 2010-05-14
    • Zhichen XuYun FuNeal Sample
    • Zhichen XuYun FuNeal Sample
    • G06F17/30
    • G06F17/30616
    • Embodiments are directed towards a Modified Sequitur algorithm (MSA) using pipelining and indexed arrays to identify trending topics within a plurality of documents having user generated content (UGC). The documents are parallelized and distributed across a plurality of network devices, which place at least some of the received documents into a buffer for which the MSA may then be applied to the documents within the buffer to identify n-grams or phrases within the documents' contents. The identified phrases are further analyzed to remove extraneous co-occurrences of phrases, and/or words based on a part of speech analysis. A weighting of the remaining phrases is used to identify trending topic phrases. Links to content in the plurality of UGC documents that is associated with the trending topic phrases may then be displayed to a client device.
    • 实施例针对使用流水线和索引数组来修改具有用户生成内容(UGC)的多个文档内的趋势主题的修改的序列算法(MSA)。 这些文档被并行化并且分布在多个网络设备上,这些网络设备将至少一些接收到的文档放置在缓冲器中,然后可以将MSA应用于缓冲器中的文档,以识别文档中的n个或多个短语, 内容。 进一步分析识别的短语,以消除基于词性分析的短语和/或单词的无关共存。 使用剩余短语的加权来识别趋势主题短语。 然后可以将与趋势主题短语相关联的多个UGC文档中的内容的链接显示给客户端设备。
    • 38. 发明授权
    • Method for fabricating an isolation structure
    • 隔离结构的制造方法
    • US08580653B2
    • 2013-11-12
    • US13775907
    • 2013-02-25
    • Tze-Liang LeePei-Ren JengChu-Yun FuChyi Shyuan ChernJui-Hei HuangChih-Tang PengHao-Ming Lien
    • Tze-Liang LeePei-Ren JengChu-Yun FuChyi Shyuan ChernJui-Hei HuangChih-Tang PengHao-Ming Lien
    • H01L21/76
    • H01L21/76224H01L21/76232
    • A method of fabricating an isolation structure including forming a trench in a top surface of a substrate and partially filling the trench with a first oxide, wherein the first oxide is a pure oxide. Partially filling the trench includes forming a liner layer in the trench and forming the first oxide over the liner layer using silane and oxygen precursors at a pressure less than 10 milliTorr (mTorr) and a temperature ranging from about 500° C. to about 1000° C. The method further includes producing a solid reaction product in a top portion of the first oxide. The method further includes sublimating the solid reaction product by heating the substrate in a chamber at a temperature from 100° C. to 200° C. and removing the sublimated solid reaction product by flowing a carrier gas over the substrate. The method further includes filling the trench with a second oxide.
    • 一种制造隔离结构的方法,包括在衬底的顶表面中形成沟槽并用第一氧化物部分地填充沟槽,其中第一氧化物是纯氧化物。 部分地填充沟槽包括在沟槽中形成衬层,并且在低于10毫托(mTorr)的压力和约500℃至约1000℃的温度下使用硅烷和氧前体在衬层上形成第一氧化物 该方法还包括在第一氧化物的顶部产生固体反应产物。 该方法还包括通过在室内在100℃至200℃的温度下加热基底来升华固体反应产物,并通过使载气流过基底而除去升华的固体反应产物。 该方法还包括用第二氧化物填充沟槽。