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31. 发明授权

US07773203B2 Laser distance-measuring apparatus and control methods thereof 有权
标题翻译：激光测距装置及其控制方法
公开(公告)号：US07773203B2
公开(公告)日：2010-08-10
申请号：US12367629
申请日：2009-02-09
申请人： Tsung-Yueh Tsai
发明人： Tsung-Yueh Tsai
IPC分类号： G01C3/08
CPC分类号： G01C15/002 , G01S7/4811 , G01S7/4972
摘要： A distance-measuring apparatus is disclosed. The distance-measuring apparatus includes: an emitter, emitting a light to be measured toward a target, a receiver, receiving a reflected emitted light; a reflector, reflecting the emitted light to the receiver; a condensing lens, condensing the reflected emitted light, reflected by the target to the reflector; a driving module, adjusting the inclination angle of the reflector; and a control unit, controlling the driving module to rotate according to a result of comparing the intensity of the emitted light received by the receiver and a predetermined value.
摘要翻译：公开了一种测距装置。测距装置包括：发射器，朝向目标发射待测光，接收器，接收反射的发射光; 将发射的光反射到接收器的反射器; 聚光透镜，将反射的发射光聚焦，由目标反射到反射器; 驱动模块，调整反射器的倾斜角度; 以及控制单元，根据将接收机接收到的发射光的强度与预定值进行比较的结果来控制驱动模块的旋转。

32. 发明申请

US20100007009A1 SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE 有权
标题翻译：半导体封装和处理和接线的方法
公开(公告)号：US20100007009A1
公开(公告)日：2010-01-14
申请号：US12501285
申请日：2009-07-10
申请人： Hsiao Chuan CHANG , Tsung Yueh TSAI , Yi Shao LAI , Ho Ming TONG , Jian Cheng CHEN , Wei Chi YIH , Chang Ying HUNG , Cheng Tsung HSU , Chih Cheng HUNG
发明人： Hsiao Chuan CHANG , Tsung Yueh TSAI , Yi Shao LAI , Ho Ming TONG , Jian Cheng CHEN , Wei Chi YIH , Chang Ying HUNG , Cheng Tsung HSU , Chih Cheng HUNG
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L24/85 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05624 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/73265 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85047 , H01L2224/85201 , H01L2224/85365 , H01L2224/85947 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/48824 , H01L2924/00012
摘要： A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.
摘要翻译：铜接合线包括线部分和非球形块部分。非球形块部分物理连接到线路部分，非球形块部分的横截面面积大于线路部分的横截面面积。

34. 发明申请

US20090230564A1 CHIP STRUCTURE AND STACKED CHIP PACKAGE AS WELL AS METHOD FOR MANUFACTURING CHIP STRUCTURES 有权
标题翻译：芯片结构和堆叠芯片包装作为制造芯片结构的方法
公开(公告)号：US20090230564A1
公开(公告)日：2009-09-17
申请号：US12188621
申请日：2008-08-08
申请人： Tsung Yueh TSAI , Yi Shao Lai , Cheng Wei Huang
发明人： Tsung Yueh TSAI , Yi Shao Lai , Cheng Wei Huang
IPC分类号： H01L23/49 , H01L21/304
CPC分类号： H01L24/83 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/26 , H01L24/48 , H01L24/85 , H01L24/96 , H01L25/0657 , H01L29/0657 , H01L2221/68327 , H01L2224/48091 , H01L2224/48227 , H01L2224/8385 , H01L2224/85 , H01L2225/0651 , H01L2225/06555 , H01L2225/06575 , H01L2924/00014 , H01L2924/01033 , H01L2924/07802 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A chip structure according to the present invention is provided. A plurality of pedestals extends from the back surface of the chip structure. Each of the pedestals is located at a position away from the edge of the back surface for a non-zero distance so that the pedestals of an upper chip structure will not damage the bonding pads positioned on the edge of the active surface of a lower chip structure when the upper chip structure is stacked on the active surface of the lower chip structure with the pedestals.
摘要翻译：提供了根据本发明的芯片结构。多个基座从芯片结构的后表面延伸。每个基座位于远离背面的边缘的位置处非零距离，使得上部芯片结构的基座不会损坏位于下部芯片的有源表面的边缘上的接合焊盘当上芯片结构被堆叠在具有基座的下芯片结构的有源表面上时的结构。

35. 发明申请

US20090175312A1 BONDING STRENGTH MEASURING DEVICE 有权
标题翻译：粘结强度测量装置
公开(公告)号：US20090175312A1
公开(公告)日：2009-07-09
申请号：US12350643
申请日：2009-01-08
申请人： Yi-Shao Lai , Tsung-Yueh Tsai , Hsiao-Chuan Chang
发明人： Yi-Shao Lai , Tsung-Yueh Tsai , Hsiao-Chuan Chang
IPC分类号： G01N3/00
CPC分类号： G01N19/04
摘要： A bonding strength measuring device for measuring the bonding strength between a substrate and a molding compound disposed on the substrate is provided. The measuring device includes a heating platform, a heating slide plate, and a fixing bracket. The heating platform has a first heating area and a first replaceable fixture. The substrate is disposed on the first heating area, and the first replaceable fixture is used to fix the substrate and has an opening exposing the molding compound. The heating slide plate has a second heating area and a second replaceable fixture. The second heating area is used to heat the molding compound, and the second replaceable fixture has a cavity for accommodating the molding compound. The fixing bracket is used to fix the heating slide plate above the heating platform.
摘要翻译：提供了用于测量基板和设置在基板上的模塑料之间的接合强度的接合强度测量装置。测量装置包括加热平台，加热滑板和固定支架。加热平台具有第一加热区域和第一可更换夹具。基板设置在第一加热区域上，并且第一可更换夹具用于固定基板，并具有露出模塑料的开口。加热滑板具有第二加热区域和第二可更换夹具。第二加热区域用于加热模塑料，第二可更换夹具具有用于容纳模塑料的空腔。固定支架用于将加热滑板固定在加热平台上。

36. 发明申请

US20090051031A1 Package structure and manufacturing method thereof 审中-公开
标题翻译：包装结构及其制造方法
公开(公告)号：US20090051031A1
公开(公告)日：2009-02-26
申请号：US12219955
申请日：2008-07-31
申请人： Yi-Shao Lai , Tsung-Yueh Tsai
发明人： Yi-Shao Lai , Tsung-Yueh Tsai
IPC分类号： H01L23/488 , H01L21/56
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/3107 , H01L24/48 , H01L2224/48091 , H01L2224/73257 , H01L2224/85005 , H01L2224/9222 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2224/85 , H01L2224/11 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package structure and a manufacturing method thereof are provided. The package structure comprises a carrier, a chip, at least one wire, a molding compound, at least one first solder ball and at least one second solder ball. The carrier has a chip chamber passing through the first surface and the second surface. The chip is disposed in the chip chamber, and an active surface of the chip is coplanar with the first surface. During packaging, the first surface and the active surface are both tightly pasted on a carrier tape to facilitate the subsequent wire bonding and sealing process. Afterwards, the carrier tape is removed for exposing the active surface and the first surface, and the active surface of the chip is coplanar with the first surface of the carrier, hence simplifying the packaging process and reducing the thickness of the package structure.
摘要翻译：提供一种封装结构及其制造方法。封装结构包括载体，芯片，至少一个线，模制化合物，至少一个第一焊球和至少一个第二焊球。载体具有通过第一表面和第二表面的芯片室。芯片设置在芯片室中，芯片的有源表面与第一表面共面。在包装过程中，第一表面和活性表面都紧密地粘贴在载带上，以便随后的引线接合和密封过程。之后，移除载带以使活性表面和第一表面露出，并且芯片的活性表面与载体的第一表面共面，从而简化封装工艺并减小封装结构的厚度。

37. 发明授权

US06854900B2 Method of fabricating a wavelength division multiplexed (WDM) unit 失效
标题翻译：制造波分复用（WDM）单元的方法
公开(公告)号：US06854900B2
公开(公告)日：2005-02-15
申请号：US10195497
申请日：2002-07-16
申请人： I-Jen Lai , Pie-Yau Chien , Chin-Hsiang Wang , Yu-Ting Lee , Tsung-Yueh Tsai , Chih-Hsien Lin
发明人： I-Jen Lai , Pie-Yau Chien , Chin-Hsiang Wang , Yu-Ting Lee , Tsung-Yueh Tsai , Chih-Hsien Lin
IPC分类号： G02B6/293 , G02B6/32 , G02B6/34 , G02B6/42 , G02B6/36 , H04J14/02
CPC分类号： G02B6/2938 , G02B6/2937 , G02B6/327 , G02B6/4233 , G02B6/4239
摘要： A method of fabricating a WDM unit consists of attaching a first and a second GRIN lenses to opposite faces of a WDM filter. A dual fiber pigtail and a single fiber pigtail are mounted in corresponding glass tubes. The glass tube with the dual fiber pigtail and the glass tube with the single fiber pigtail are mounted on the second GRIN lens and the first GRIN lens respectively. The position of the dual fiber pigtail and the single fiber pigtail are adjusted with respect to the second GRIN lens and the first GRIN lens respectively to obtain the best optical property. The invention prevents the WDM filter from tilting during temperature variation by sandwiching the WDM filter in between the two GRIN lenses, and further prevents the WDM unit from increasing the reflection loss and insertion loss.
摘要翻译：制造WDM单元的方法包括将第一和第二GRIN透镜附接到WDM滤光器的相对面。双纤尾纤和单纤尾纤安装在相应的玻璃管中。具有双纤维尾纤的玻璃管和带有单纤维尾纤的玻璃管分别安装在第二GRIN透镜和第一GRIN透镜上。相对于第二GRIN透镜和第一GRIN透镜分别调整双光纤尾纤和单纤尾纤的位置，以获得最佳的光学性能。本发明通过将WDM滤光片夹在两个GRIN透镜之间来防止WDM滤光器在温度变化期间倾斜，并且进一步防止WDM单元增加反射损耗和插入损耗。

38. 发明申请

US20050023657A1 STACKED CHIP-PACKAGING STRUCTURE 有权
标题翻译：堆叠芯片包装结构
公开(公告)号：US20050023657A1
公开(公告)日：2005-02-03
申请号：US10711575
申请日：2004-09-25
申请人： Yu-Fang Tsai , Jung-Kun Kang , Tsung-Yueh Tsai
发明人： Yu-Fang Tsai , Jung-Kun Kang , Tsung-Yueh Tsai
IPC分类号： H01L23/31 , H01L23/433 , H01L25/10 , H01L23/02
CPC分类号： H01L24/73 , H01L23/3128 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L25/105 , H01L2224/45144 , H01L2224/48227 , H01L2224/73207 , H01L2224/8592 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2225/1094 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A stacked chip-packaging structure consisting of a plurality of chip-packaging units is provided. Each of the chip-packaging units includes a substrate, a chip, a plurality of wires, a molding compound, and a plurality of solder balls. The chip-packaging units are, for example, of a BGA structure with high pin count, and are stacked up one over another and electrically connected through solder balls. With such structural features, the space that the stacked chip-packaging structure occupies is reduced and consequently the entire structure can be miniaturized.
摘要翻译：提供由多个芯片封装单元组成的堆叠式芯片封装结构。每个芯片封装单元包括基板，芯片，多根电线，模塑料和多个焊球。芯片封装单元例如是具有高引脚数的BGA结构，并且一个接一个堆叠并通过焊球电连接。利用这种结构特征，堆叠的芯片封装结构占据的空间减小，因此整个结构可以小型化。

39. 发明授权

US06801429B2 Package structure compatible with cooling system 有权
标题翻译：封装结构兼容冷却系统
公开(公告)号：US06801429B2
公开(公告)日：2004-10-05
申请号：US10605081
申请日：2003-09-08
申请人： Tsung-Yueh Tsai , Sheng-Yang Peng
发明人： Tsung-Yueh Tsai , Sheng-Yang Peng
IPC分类号： H05K720
CPC分类号： G06F1/20 , G06F2200/201 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a package structure compatible with a cooling system, the package structure comprising a carrier, a chip, a mold compound and a cooling tubule that can be connected to a cooling system. The chip is arranged on the carrier and electrically connected to the carrier, while the mold compound covers the chip and one surface of the carrier. The cooling tubule is disposed either within the mold compound or on an outer surface of the mold compound. The cooling tubule is connected to a cooling tubing of the cooling system and a fluid driven by a pump circulates in the cooling tubing and the cooling tubule for heat dissipation.
摘要翻译：本发明涉及一种与冷却系统兼容的封装结构，该封装结构包括可连接到冷却系统的载体，芯片，模具化合物和冷却小管。芯片布置在载体上并电连接到载体上，而模具化合物覆盖芯片和载体的一个表面。冷却管被设置在模具化合物内或模具化合物的外表面上。冷却管与冷却系统的冷却管连接，由泵驱动的流体在冷却管和冷却管中循环，用于散热。

40. 发明授权

US08592982B2 Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof 有权
标题翻译：具有接近通信信号输入端子的半导体封装及其制造方法
公开(公告)号：US08592982B2
公开(公告)日：2013-11-26
申请号：US13252850
申请日：2011-10-04
申请人： Yi-Shao Lai , Tsung-Yueh Tsai , Ming-Kun Chen , Tai-Ping Wang , Ming-Hsiang Cheng
发明人： Yi-Shao Lai , Tsung-Yueh Tsai , Ming-Kun Chen , Tai-Ping Wang , Ming-Hsiang Cheng
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L23/48 , H01L23/3114 , H01L23/522 , H01L23/552 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L2224/13009 , H01L2224/13099 , H01L2224/16145 , H01L2225/06513 , H01L2225/06531 , H01L2225/06565 , H01L2924/07811 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor package includes a semiconductor structure. The semiconductor structure includes a plurality of dielectric layers and a plurality of conductive interconnects embedded in the semiconductor structure. The semiconductor structure also includes a plurality of proximity communication signal input terminals. At least one of the plurality of proximity communication signal input terminals includes a first electrode and a second electrode. The first electrode and the second electrode are spaced apart so as to be configured to provide proximity communication through capacitive coupling. The first electrode is exposed proximate to a surface of the semiconductor structure.
摘要翻译：半导体封装包括半导体结构。半导体结构包括多个介电层和嵌入在半导体结构中的多个导电互连。半导体结构还包括多个邻近通信信号输入端。多个邻近通信信号输入端中的至少一个包括第一电极和第二电极。间隔开第一电极和第二电极，以便配置成通过电容耦合提供邻近通信。第一电极在半导体结构的表面附近露出。

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