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    • 21. 发明授权
    • Three metal process for optimizing layout density
    • 三金属工艺优化布局密度
    • US06459625B1
    • 2002-10-01
    • US09767341
    • 2001-01-23
    • Colin S. BillJonathan S. SuRavi P. Gutala
    • Colin S. BillJonathan S. SuRavi P. Gutala
    • G11C1604
    • G11C5/025G11C16/0408
    • The present invention discloses a method and system to optimize electrical interconnection of electrical components in a periphery area of a memory device thereby minimizing the periphery area. The periphery area is divided into a plurality of sub-circuits formed by selectively electrically connecting the electrical components. Electrical interconnection of the electrical components to form the sub-circuits is accomplished using a first metal layer and a second metal layer. The first metal layer is formed to create a plurality of first metal layer lines that are oriented to extend in substantially one direction on the memory device. The second metal layer is formed to create a plurality of second metal layer lines that are oriented to extend substantially perpendicular to the first metal layer lines. The plurality of sub-circuits are electrically interconnected using a third metal layer that is formed to create a plurality of third metal layer lines that are oriented to extend substantially parallel to the first metal layer lines.
    • 本发明公开了一种用于优化存储器件周边区域中的电气元件的电互连从而最小化外围区域的方法和系统。 周边区域被分成通过选择性地电连接电气部件而形成的多个子电路。 使用第一金属层和第二金属层实现电气部件的电互连以形成子电路。 形成第一金属层以形成多个第一金属层线,其被定向成在存储器件上沿基本上一个方向延伸。 形成第二金属层以形成多个第二金属层线,其被定向成基本上垂直于第一金属层线延伸。 多个子电路使用第三金属层电互连,第三金属层被形成以形成多个第三金属层线,其被定向成基本上平行于第一金属层线延伸。
    • 23. 发明授权
    • Multiple bits per-cell flash EEPROM capable of concurrently programming
and verifying memory cells and reference cells
    • 多位每单元闪存EEPROM能够同时编程和验证存储单元和参考单元
    • US5712815A
    • 1998-01-27
    • US635995
    • 1996-04-22
    • Colin S. BillSameer S. Haddad
    • Colin S. BillSameer S. Haddad
    • G11C11/56G11C16/34G11C16/06
    • G11C16/3486G11C11/5621G11C11/5628G11C16/3468G11C16/3481G11C2211/5621G11C2211/5622G11C2211/5624G11C2211/5642G11C2211/5645G11C2216/14
    • An improved programming structure for performing a program operation in an array of multiple bits-per-cell flash EEPROM memory cells is provided. A memory core array (12) includes a plurality of memory cells and a reference cell array (22) having a plurality of reference core cells which are selected together with a selected memory core cell. A precharge circuit (36a) is used to precharge all of the array bit lines and the reference bit lines to a predetermined potential prior to a program operation. A reference generator circuit (134) is used for selectively generating one of a plurality of target memory core cell bit line program-verify voltages, each one corresponding to one of a plurality of programmable memory states. A switching circuit (P1,N1) is used to selectively connect a program current source to the selected certain ones of the columns of array bit lines containing the selected memory core cells which are to be programmed. A sensing logic circuit (26,27) continuously compares a potential on one of the selected bit lines and one of the plurality of target program-verify voltages. The sensing logic circuit generates a logic signal which is switched to a low logic level when the potential on the selected bit line falls below the selected one of the plurality of target program-verify voltages. The switching circuit is responsive to the low logic level for disconnecting the program current source so as to inhibit further programming of the selected memory core cells.
    • 提供了一种改进的编程结构,用于执行多个比特单元闪存EEPROM存储单元阵列中的程序操作。 存储器核心阵列(12)包括多个存储器单元和具有多个参考核心单元的参考单元阵列(22),所述参考单元阵列与选定的存储器核心单元一起选择。 预充电电路(36a)用于在编程操作之前将所有阵列位线和参考位线预充电至预定电位。 参考发生器电路(134)用于选择性地产生多个目标存储器核心单元位线程序验证电压中的一个,每一个对应于多个可编程存储器状态之一。 切换电路(P1,N1)用于选择性地将程序电流源连接到包含要编程的所选择的存储器核心单元的阵列位线列中选定的某些列。 感测逻辑电路(26,27)连续地比较所选位线之一上的电位和多个目标程序验证电压中的一个。 感测逻辑电路产生逻辑信号,当所选位线上的电位低于多个目标程序验证电压中选定的一个时,逻辑信号被切换到低逻辑电平。 开关电路响应于低逻辑电平以断开程序电流源,从而禁止进一步编程所选择的存储器核心单元。
    • 25. 发明授权
    • Variable breakdown characteristic diode
    • 可变击穿特性二极管
    • US07579631B2
    • 2009-08-25
    • US11087000
    • 2005-03-22
    • David GaunColin S. BillSwaroop Kaza
    • David GaunColin S. BillSwaroop Kaza
    • H01L29/00
    • H01L51/0575B82Y10/00G11C11/5664G11C11/5692G11C13/0009G11C13/0014G11C13/0016G11C2213/11G11C2213/12G11C2213/15G11C2213/56G11C2213/71G11C2213/77H01L27/285
    • A memory cell made of at least two electrodes with a controllably conductive media between the at least two electrodes is disclosed. The controllably conductive media includes a passive layer made of super ionic material and an active layer. When an external stimuli, such as an applied electric field, is imposed upon the first and second electrode, ions move and dope and/or de-dope the polymer. The applied external stimuli used to dope the polymer is larger than an applied external stimuli to operate the memory cell. The polymer functions as a variable breakdown characteristic diode with electrical characteristics which are a consequence of the doping degree. The memory element may have a current limited read signal. Methods of making the memory devices/cells, methods of using the memory devices/cells, and devices such as computers, hand-held electronic devices and memory devices containing the memory cell(s) are also disclosed.
    • 公开了一种由在至少两个电极之间具有可控导电介质的至少两个电极制成的存储单元。 可控导电介质包括由超离子材料和有源层制成的钝化层。 当诸如施加的电场的外部刺激施加在第一和第二电极上时,离子移动并掺杂和/或去透明聚合物。 用于掺杂聚合物的应用外部刺激物大于施加的外部刺激以操作记忆单元。 该聚合物用作具有电特性的可变击穿特性二极管,这是掺杂度的结果。 存储元件可以具有电流受限读取信号。 还公开了制造存储器件/单元的方法,使用存储器件/单元的方法,以及诸如计算机,手持式电子设备和包含存储单元的存储器件的设备。
    • 29. 发明授权
    • Method of programming, reading and erasing memory-diode in a memory-diode array
    • 在存储二极管阵列中编程,读取和擦除存储二极管的方法
    • US07379317B2
    • 2008-05-27
    • US11021958
    • 2004-12-23
    • Colin S. BillSwaroop KazaTzu-Ning FangStuart Spitzer
    • Colin S. BillSwaroop KazaTzu-Ning FangStuart Spitzer
    • G11C5/06G11C17/06
    • G11C11/36
    • A memory array includes first and second sets of conductors and a plurality of memory-diodes, each connecting in a forward direction a conductor of the first set with a conductor of the second set. An electrical potential is applied across a selected memory-diode, from higher to lower potential in the forward direction, intended to program the selected memory-diode. During this intended programming, each other memory-diode in the array has provided thereacross in the forward direction thereof an electrical potential lower than its threshold voltage. The threshold voltage of each memory-diode can be established by applying an electrical potential across that memory-diode from higher to lower potential in the reverse direction. By so establishing a sufficient threshold voltage, and by selecting appropriate electrical potentials applied to conductors of the array, problems related to current leakage and disturb are avoided.
    • 存储器阵列包括第一和第二组导体和多个存储器二极管,每个存储器二极管以正向方向连接第一组的导体与第二组的导体。 在选定的存储器二极管上施加电位,从正向上的较高电位到较低的电位,用于对所选存储二极管进行编程。 在该期望的编程期间,阵列中的每个其它存储器二极管在其正向方向上提供低于其阈值电压的电位。 每个存储器二极管的阈值电压可以通过在该存储器二极管上从相反方向上从较高电位向较低电位施加电位来建立。 通过这样建立足够的阈值电压,并且通过选择适用于阵列导体的适当电位,避免了与电流泄漏和干扰有关的问题。