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    • 30. 发明授权
    • Thin-film capacitor device and RAM device using ferroelectric film
    • 薄膜电容器和使用铁电薄膜的RAM器件
    • US5889696A
    • 1999-03-30
    • US45958
    • 1998-03-23
    • Takashi KawakuboNoburu FukushimaKazuhide Abe
    • Takashi KawakuboNoburu FukushimaKazuhide Abe
    • H01L27/10G11C11/22H01L21/8242H01L21/8246H01L27/105H01L27/108
    • G11C11/22
    • A semiconductor memory device is constituted by arranging a plurality of memory cells in a matrix format, each of which includes a thin-film capacitor having a ferroelectric film and a pair of electrodes facing each other via the ferroelectric film, and a transfer gate transistor connected to the thin film capacitor. A voltage corresponding to the width of a hysteresis curve obtained when the thin-film capacitor is saturated and polarized falls within the range of 5% or higher to 20% or lower of the voltage difference between the positive and negative directions in a writing operation. A remanent polarization amount obtained when the thin-film capacitor is saturated and polarized falls within the range of 5% or higher to 30% or lower of the total polarization amount obtained upon application of a voltage in the writing operation.
    • 半导体存储器件通过以矩阵形式布置多个存储单元而构成,每个存储单元包括具有铁电膜的薄膜电容器和经由铁电体膜相互面对的一对电极,并且连接有传输栅极晶体管 到薄膜电容器。 当薄膜电容器饱和和极化时获得的滞后曲线的宽度对应的电压落在写入操作中正负方向之间的电压差的5%以上至20%以下的范围内。 当薄膜电容器饱和和极化时获得的剩余极化量落在在写入操作中施加电压时获得的总极化量的5%以上至30%以下的范围内。