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21. 发明申请

US20060046623A1 Method and apparatus for reduced wear polishing pad conditioning 失效
标题翻译：降低磨损抛光垫调理的方法和装置
公开(公告)号：US20060046623A1
公开(公告)日：2006-03-02
申请号：US11209167
申请日：2005-08-22
申请人： Yan Wang , Stan Tsai , Yongqi Hu , Feng Liu , Liang-Yuh Chen , Daxin Mao , Huyen Tran , Martin Wohlert , Renhe Jia , Yuan Tian
发明人： Yan Wang , Stan Tsai , Yongqi Hu , Feng Liu , Liang-Yuh Chen , Daxin Mao , Huyen Tran , Martin Wohlert , Renhe Jia , Yuan Tian
IPC分类号： B24B1/00
CPC分类号： B24B53/017 , B23H5/08
摘要： Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.
摘要翻译：提供了用于原位调理和/或清洁CMP，ECMP或其它处理系统的处理垫的调节头的实施例。在一个实施例中，调节头包括设置在中心腔中的刷子。清洁流体通过调节头的中心空腔设置到处理垫。刷子旋转并横向移动到处理垫的表面上。通过调节头分配的清洁溶液溶解处理操作的副产物，同时刷子轻轻地擦拭处理垫。调节头的唇缘保持清洁流体和清洁废物，从而最小化调节头外部区域的污染。清洁废物通过在调节头的外周附近形成的通道从处理垫移除。

22. 发明申请

US20050233578A1 Method and composition for polishing a substrate 失效
标题翻译：抛光基材的方法和组合物
公开(公告)号：US20050233578A1
公开(公告)日：2005-10-20
申请号：US11130032
申请日：2005-05-16
申请人： Renhe Jia , Feng Liu , Stan Tsai , Liang-Yuh Chen
发明人： Renhe Jia , Feng Liu , Stan Tsai , Liang-Yuh Chen
IPC分类号： B23H5/08 , C09G1/02 , C09K13/00 , C11D3/14 , C11D3/39 , C11D11/00 , C25F3/02 , C25F3/08 , H01L21/321 , H01L21/44 , H01L21/4763 , H01L21/768
CPC分类号： B23H5/08 , C09G1/02 , C11D3/1213 , C11D3/124 , C11D3/14 , C11D3/3765 , C11D3/3947 , C11D11/0041 , C25F3/02 , C25F3/08 , H01L21/3212 , H01L21/32125 , H01L21/7684
摘要： Polishing compositions and methods for removing conductive materials and barrier materials from a substrate surface are provided. Polishing compositions are provided for removing at least a barrier material from a substrate surface by a chemical mechanical polishing process or by an electrochemical mechanical polishing process. The polishing compositions used in barrier removal may further be used after a process for electrochemical mechanical planarization process of a conductive material. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface with a reduction in planarization type defects.
摘要翻译：提供了抛光组合物和从衬底表面去除导电材料和阻挡材料的方法。提供抛光组合物用于通过化学机械抛光工艺或通过电化学机械抛光工艺从衬底表面去除至少一种阻挡材料。用于屏障去除的抛光组合物可以在导电材料的电化学机械平面化工艺的过程之后进一步使用。本文所述的抛光组合物和方法改善了材料从衬底表面的有效去除速率，同时降低了平面化型缺陷。

23. 发明申请

US20060175298A1 Method and composition for polishing a substrate 审中-公开
标题翻译：抛光基材的方法和组合物
公开(公告)号：US20060175298A1
公开(公告)日：2006-08-10
申请号：US11350051
申请日：2006-02-07
申请人： Junzi Zhao , You Wang , Feng Liu , Stan Tsai
发明人： Junzi Zhao , You Wang , Feng Liu , Stan Tsai
IPC分类号： C09K13/00 , C09K13/06 , H01L21/461 , B44C1/22 , C03C25/68
CPC分类号： H01L21/7684 , B24B37/044 , C09G1/02 , C09G1/04 , C25F3/02 , H01L21/32125
摘要： Polishing compositions and methods for removing barrier materials from a substrate surface are provided. In one aspect, a composition is provided for removing at least a barrier material from a substrate surface including an acid based electrolyte system, one or more chelating agents, one or more pH adjusting agents to provide a pH between about 3 and about 11, and a solvent. The composition may be used in an electrochemical mechanical planarization process. The polishing compositions and methods described herein improve the effective removal rate of barrier materials from the substrate surface with a reduction in planarization type defects.
摘要翻译：提供了用于从衬底表面去除阻挡材料的抛光组合物和方法。一方面，提供一种组合物，用于从基材表面至少除去阻挡材料，所述基材表面包括酸性电解质体系，一种或多种螯合剂，一种或多种pH调节剂以提供约3至约11的pH，以及溶剂。该组合物可用于电化学机械平面化工艺中。本文所述的抛光组合物和方法通过减小平坦化型缺陷来提高阻挡材料从衬底表面的有效去除速率。

24. 发明申请

US20080035882A1 COMPOSITION FOR POLISHING A SUBSTRATE 审中-公开
标题翻译：用于抛光基材的组合物
公开(公告)号：US20080035882A1
公开(公告)日：2008-02-14
申请号：US11877344
申请日：2007-10-23
申请人： Junzi Zhao , You Wang , Feng Liu , Stan Tsai
发明人： Junzi Zhao , You Wang , Feng Liu , Stan Tsai
IPC分类号： C09K13/06 , C09K13/00 , C09K13/04
CPC分类号： H01L21/7684 , B24B37/044 , C09G1/02 , C09G1/04 , C25F3/02 , H01L21/32125
摘要： Polishing compositions and methods for removing barrier materials from a substrate surface are provided. In one aspect, a composition is provided for removing at least a barrier material from a substrate surface including an acid based electrolyte system, one or more chelating agents, one or more pH adjusting agents to provide a pH between about 3 and about 11, and a solvent. The composition may be used in an electrochemical mechanical planarization process. The polishing compositions and methods described herein improve the effective removal rate of barrier materials from the substrate surface with a reduction in planarization type defects.
摘要翻译：提供了用于从衬底表面去除阻挡材料的抛光组合物和方法。一方面，提供一种组合物，用于从基材表面至少除去阻挡材料，所述基材表面包括酸性电解质体系，一种或多种螯合剂，一种或多种pH调节剂以提供约3至约11的pH，以及溶剂。该组合物可用于电化学机械平面化工艺中。本文所述的抛光组合物和方法通过减小平坦化型缺陷来改善阻挡材料从衬底表面的有效去除速率。

25. 发明申请

US20060169597A1 Method and composition for polishing a substrate 审中-公开
标题翻译：抛光基材的方法和组合物
公开(公告)号：US20060169597A1
公开(公告)日：2006-08-03
申请号：US11356352
申请日：2006-02-15
申请人： Feng Liu , Tianbao Du , Alain Duboust , Wei-Yung Hsu , Robert Ewald , Yuan Tian , You Wang , Stan Tsai
发明人： Feng Liu , Tianbao Du , Alain Duboust , Wei-Yung Hsu , Robert Ewald , Yuan Tian , You Wang , Stan Tsai
IPC分类号： B23H9/00 , B23H7/00
CPC分类号： C25F3/02 , B23H5/08
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, a corrosion inhibitor having an azole group, an organic acid salt, a pH adjusting agent to provide a pH between about 2 and about 10, and a solvent, and a solvent. The composition may be used in a conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as copper, with a reduction in planarization type defects and yielding a desirable surface finish.
摘要翻译：提供了抛光组合物和从衬底表面去除导电材料的方法。在一个方面，组合物包括酸基电解质体系，具有唑基的腐蚀抑制剂，有机酸盐，pH调节剂以提供约2至约10的pH以及溶剂和溶剂。该组合物可以用于导电材料去除工艺中，包括在包括电极的工艺设备中设置其上形成有导电材料层的衬底，在电极和衬底之间提供组合物，在电极和衬底之间施加偏压，以及从导电材料层去除导电材料。本文所述的抛光组合物和方法提高了材料从衬底表面（例如铜）的有效去除速率，同时平坦化型缺陷减少并产生理想的表面光洁度。

26. 发明授权

US07569134B2 Contacts for electrochemical processing 失效
标题翻译：电化学处理接点
公开(公告)号：US07569134B2
公开(公告)日：2009-08-04
申请号：US11424170
申请日：2006-06-14
申请人： Paul Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai
发明人： Paul Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai
IPC分类号： B23H5/06 , C25D17/00
CPC分类号： H01L21/32125 , B23H5/08 , B24B37/046 , B24B37/24 , B24B53/017
摘要： Systems and methods for electrochemically processing a substrate. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.
摘要翻译：用于电化学处理衬底的系统和方法。接触元件限定在处理期间可定位成接触衬底的衬底接触表面。在一个实施例中，接触元件包括线元件。在另一个实施例中，接触元件是旋转构件。在一个实施例中，接触元件包括贵金属。

27. 发明授权

US07384534B2 Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP 失效
标题翻译：电解质具有良好的平坦化能力，高电镀速度和光滑表面光洁度
公开(公告)号：US07384534B2
公开(公告)日：2008-06-10
申请号：US11074274
申请日：2005-03-07
申请人： Lizhong Sun , Feng Q. Liu , Siew Neo , Stan Tsai , Liang-Yuh Chen
发明人： Lizhong Sun , Feng Q. Liu , Siew Neo , Stan Tsai , Liang-Yuh Chen
IPC分类号： C25F3/00 , C09K13/06
CPC分类号： B23H3/08 , B23H5/08 , B24B37/0056 , B24B37/044 , B24B37/046 , C09G1/04 , C25F3/02 , H01L21/32125 , H01L21/32134
摘要： Electrolyte compositions and methods for planarizing a surface of a substrate using the electrolyte compositions are provided. In one aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, and one or more pH adjusting agents. In another aspect, an electrolyte composition includes one or more chelating agents, two or more corrosion inhibitors, and one or more pH adjusting agents. In another aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, one or more pH adjusting agents, and one or more electrically resistive additives.
摘要翻译：提供了电解质组合物和使用电解质组合物平坦化基材表面的方法。一方面，电解质组合物包括一种或多种螯合剂，一种或多种腐蚀抑制剂和一种或多种pH调节剂。另一方面，电解质组合物包括一种或多种螯合剂，两种或更多种腐蚀抑制剂和一种或多种pH调节剂。另一方面，电解质组合物包括一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种pH调节剂和一种或多种电阻添加剂。

28. 发明申请

US20080017521A1 PROCESS CONTROL IN ELECTRO-CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：电化学机械抛光过程控制
公开(公告)号：US20080017521A1
公开(公告)日：2008-01-24
申请号：US11828937
申请日：2007-07-26
申请人： ANTOINE MANENS , Stan Tsai , Liang-Yuh Chen
发明人： ANTOINE MANENS , Stan Tsai , Liang-Yuh Chen
IPC分类号： B23H3/00
CPC分类号： B24B37/013 , B23H5/08 , B24B37/042 , B24B37/046 , B24B49/04 , H04N1/00
摘要： The present invention relates to method and apparatus for determining removal rate and polishing endpoint of electropolishing process. One embodiment provides a method for determining an amount of material removed from a substrate. The method comprises providing a counter electrode and a conductive polishing article disposed over the counter electrode, contacting the substrate with the conductive polishing article so that the substrate is electrically connected to the conductive polishing article, distributing an electrolyte to the substrate and the counter electrode, and polishing one or more conductive materials on the substrate by applying a bias between the conductive polishing article and the counter electrode. The method further comprises determining a total charge removed from the substrate, and correlating the total charge removed and a thickness of material removed from the substrate.
摘要翻译：本发明涉及用于确定电抛光工艺的去除速率和抛光终点的方法和装置。一个实施例提供了一种用于确定从基底去除的材料的量的方法。该方法包括提供对置电极和布置在对置电极上的导电抛光制品，使基底与导电抛光制品接触，使得基底电连接到导电抛光制品，将电解质分配到基底和对电极，并且通过在导电抛光制品和对电极之间施加偏压来抛光衬底上的一种或多种导电材料。该方法还包括确定从衬底去除的总电荷，以及将去除的总电荷与从衬底去除的材料的厚度相关联。

29. 发明授权

US07303662B2 Contacts for electrochemical processing 有权
标题翻译：电化学处理接点
公开(公告)号：US07303662B2
公开(公告)日：2007-12-04
申请号：US10210972
申请日：2002-08-02
申请人： Rashid Mavliev , Stan Tsai , Yongqi Hu , Paul Butterfield , Antoine Manens , Liang-Yuh Chen
发明人： Rashid Mavliev , Stan Tsai , Yongqi Hu , Paul Butterfield , Antoine Manens , Liang-Yuh Chen
IPC分类号： C25F3/16 , C25F3/30 , C25F7/00
CPC分类号： B23H5/08 , B24B37/046 , B24B37/20 , H01L21/32125
摘要： Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.
摘要翻译：电化学处理的系统和方法。接触元件限定在处理期间可定位成接触衬底的衬底接触表面。在一个实施例中，接触元件包括线元件。在另一个实施例中，接触元件是旋转构件。在一个实施例中，接触元件包括贵金属。

30. 发明申请

US20070066201A1 CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING 有权
标题翻译：电化学机械抛光导电抛光法
公开(公告)号：US20070066201A1
公开(公告)日：2007-03-22
申请号：US11556011
申请日：2006-11-02
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel Carl , Ralph Wadensweiler , Manoocher Birang , Paul Butterfield , Rashid Mavliev , Stan Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel Carl , Ralph Wadensweiler , Manoocher Birang , Paul Butterfield , Rashid Mavliev , Stan Tsai
IPC分类号： B23F21/03
CPC分类号： B82Y30/00 , B24B37/046 , B24B37/24 , B24B37/26 , B24D3/34
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be formed in the polishing article for flow of material therethrough. An electrode is also exposed to the polishing surface by at least a portion of the plurality of perforations. The article of manufacture may also include a polishing surface having a plurality of grooves, wherein a portion of the plurality of grooves intersect with a portion of the plurality of perforations.
摘要翻译：提供了一种用于平坦化基板表面的制造和设备。在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括抛光制品，所述抛光制品包括具有适于抛光所述衬底的至少部分导电表面的主体。可以在抛光制品中形成多个穿孔，以使材料流过其中。电极还通过多个穿孔的至少一部分暴露于抛光表面。制品还可以包括具有多个凹槽的抛光表面，其中多个凹槽的一部分与多个穿孔的一部分相交。

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