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    • 27. 发明授权
    • Semiconductor device fabrication method
    • 半导体器件制造方法
    • US5569628A
    • 1996-10-29
    • US535323
    • 1995-09-27
    • Kousaku YanoTomoyasu MurakamiMasayuki EndoNoboru Nomura
    • Kousaku YanoTomoyasu MurakamiMasayuki EndoNoboru Nomura
    • H01L21/28H01L21/768H01L21/465
    • H01L21/76841H01L21/76843
    • A silicon dioxide film is partly etched away to form an opening thereby exposing a silicon substrate. The surface of the opening, which is almost entirely covered with Si-OH, is coated with hexamethyldisilazane (HMDS) to bring about a silylation reaction. This causes the silicon substrate surface to be covered with a molecular film formed by replacing the hydrogen part in Si-OH with Si((CH.sub.3).sub.3. Atoms of aluminum are ejected by a sputtering process. The ejected aluminum atoms collide with the molecular film. Although some hydrocarbons (CH.sub.x) are sputtered or ejected due to such collision, a SiO.sub.x C.sub.y H.sub.z film 12' transformed from the molecular film is left between an aluminum film deposited and the silicon substrate. This SiO.sub.x C.sub.y H.sub.z film 12' acts as a barrier metal. The presence of the SiO.sub.x C.sub.y H.sub.z film prevents the occurrence of counter diffusion in the Al-Si system. No spikes are formed as a result.
    • 部分地蚀刻掉二氧化硅膜以形成开口,从而暴露硅衬底。 几乎完全用Si-OH覆盖的开口的表面涂覆有六甲基二硅氮烷(HMDS)以进行甲硅烷基化反应。 这导致硅衬底表面被用Si((CH 3)3代替Si-OH中的氢部分而形成的分子膜覆盖,铝的原子通过溅射工艺喷射,喷射的铝原子与分子膜碰撞 虽然由于这种碰撞而使一些烃类(CHx)溅射或喷射,但是从分子膜转化的SiO x C y H z膜12'留在沉积的铝膜和硅基板之间,该SiOxCyHz膜12'作为阻挡金属, SiOxCyHz膜的存在防止了在Al-Si系统中产生反向扩散,结果不形成尖峰。