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    • 23. 发明授权
    • Memory cell structure and fabrication
    • 存储单元结构和制造
    • US06265742B1
    • 2001-07-24
    • US09317662
    • 1999-05-24
    • Ulrike GrueningJochen BeintnerHans-Oliver Joachim
    • Ulrike GrueningJochen BeintnerHans-Oliver Joachim
    • H01L27108
    • H01L27/10864H01L27/10841
    • A pair of memory cells for use in a DRAM are formed in a monocrystalline bulk portion of a silicon wafer by first forming a pair of vertical trenches spaced apart by a bulk portion of the wafer. After a dielectric layer is formed over the walls of each trench, the trenches are each filled with polycrystalline silicon. By a pair of recess forming and recess filling steps there is formed at the top of each trench a silicon region that was grown epitaxially with the intermediate bulk portion. Each epitaxial region is made to serve as the body of a separate transistor having its drain in the lower polysilicon fill of a trench, and its source in the monocrystalline bulk intermediate between the two epitaxial regions. The lower polysilicon fill of each trench is also made to serve as the storage node of the capacitor of each cell, with the bulk serving as the other plate of the capacitor.
    • 通过首先形成由晶片的主体部分隔开的一对垂直沟槽,在硅晶片的单晶体部分中形成用于DRAM中的一对存储单元。 在每个沟槽的壁之上形成电介质层之后,沟槽各自填充有多晶硅。 通过一对凹陷形成和凹陷填充步骤,在每个沟槽的顶部形成有与中间体部分外延生长的硅区域。 使每个外延区域用作在沟槽的下多晶硅填充物中具有其漏极的单独晶体管​​的主体,并且其源于在两个外延区域之间的单晶体体中间。 每个沟槽的较低多晶硅填充物也用作每个电池的电容器的存储节点,其体积用作电容器的另一个板。
    • 25. 发明授权
    • Memory cell structure and fabrication
    • 存储单元结构和制造
    • US6093614A
    • 2000-07-25
    • US34519
    • 1998-03-04
    • Ulrike GrueningJochen BeintnerHans-Oliver Joachim
    • Ulrike GrueningJochen BeintnerHans-Oliver Joachim
    • H01L21/8242H01L27/108H01L21/20
    • H01L27/10864H01L27/10841
    • A pair of memory cells for use in a DRAM are formed in a monocrystalline bulk portion of a silicon wafer by first forming a pair of vertical trenches spaced apart by a bulk portion of the wafer. After a dielectric layer is formed over the walls of each trench, the trenches are each filled with polycrystalline silicon. By a pair of recess forming and recess filling steps there is formed at the top of each trench a silicon region that was grown epitaxially with the intermediate bulk portion. Each epitaxial region is made to serve as the body of a separate transistor having its drain in the lower polysilicon fill of a trench, and its source in the monocrystalline bulk intermediate between the two epitaxial regions. The lower polysilicon fill of each trench is also made to serve as the storage node of the capacitor of each cell, with the bulk serving as the other plate of the capacitor.
    • 通过首先形成由晶片的主体部分隔开的一对垂直沟槽,在硅晶片的单晶体部分中形成用于DRAM中的一对存储单元。 在每个沟槽的壁之上形成电介质层之后,沟槽各自填充有多晶硅。 通过一对凹陷形成和凹陷填充步骤,在每个沟槽的顶部形成有与中间体部分外延生长的硅区域。 使每个外延区域用作在沟槽的下多晶硅填充物中具有其漏极的单独晶体管​​的主体,并且其源于在两个外延区域之间的单晶体体中间。 每个沟槽的较低多晶硅填充物也用作每个电池的电容器的存储节点,其体积用作电容器的另一个板。
    • 26. 发明授权
    • Device having a high concentration region under the channel
    • 在通道下具有高浓度区域的奇偶装置
    • US5641980A
    • 1997-06-24
    • US557558
    • 1995-11-14
    • Yasuo YamaguchiHans-Oliver JoachimYasuo Inoue
    • Yasuo YamaguchiHans-Oliver JoachimYasuo Inoue
    • H01L29/40H01L21/336H01L27/12H01L29/417H01L29/78H01L29/786
    • H01L29/66757H01L27/1203H01L29/78606H01L29/78609H01L29/78621
    • It is an object to obtain a semiconductor device with the LDD structure having both operational stability and high speed and a manufacturing method thereof. A high concentration region (11) with boron of about 1.times.10.sup.18 /cm.sup.3 introduced therein is formed extending from under a channel formation region (4) to under a drain region (6) and a source region (6') in a silicon substrate (1). The high concentration region (11) is formed in the surface of the silicon substrate (1) under the channel formation region (4), and is formed at a predetermined depth from the surface of the silicon substrate (1) under the drain region (6) and the source region (6'). A low concentration region (10) is formed in the surface of the silicon substrate (1) under the drain region (6) and the source region (6'). The formation of the high concentration region only in the surface of the semiconductor substrate under the channel formation region surely suppresses an increase in the leakage current and an increase in the drain capacitance.
    • 本发明的目的是获得具有操作稳定性和高速度的LDD结构的半导体器件及其制造方法。 导入其中引入了约1×10 18 / cm 3的硼的高浓度区域(11)形成在沟道形成区域(4)下方延伸到漏极区域(6)下方的硅衬底(1)中的源极区域(6') )。 在硅衬底(1)的沟道形成区域(4)的表面上形成高浓度区域(11),并且形成在与硅衬底(1)的漏极区域 6)和源极区(6')。 在漏极区域(6)和源极区域(6')的下方的硅衬底(1)的表面中形成低浓度区域(10)。 仅在沟道形成区域的半导体衬底的表面形成高浓度区域确实地抑制了漏电流的增加和漏极电容的增加。