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    • 21. 发明申请
    • Writing implement
    • 书写工具
    • US20060182489A1
    • 2006-08-17
    • US10569283
    • 2004-07-21
    • Takeshi Kobayashi
    • Takeshi Kobayashi
    • B43M11/02
    • B43K7/10B43K5/1881B43K7/02
    • A writing implement, wherein elements forming a reverse flow prevention mechanism are formed in rather simple shapes and assembly process for the reverse flow prevention mechanism is rather simplified. The reverse flow prevention mechanism (19) comprises a valve chamber (54b), an inflow port (55) opened to the ink storage part (16) side of the valve chamber (54b), an outflow port (56) opened to the writing tip (17) side of the valve chamber (54b), a valve element (57) stored in the valve chamber (54b), a restricting body (58) stored in the valve chamber (54b) at a position on the outflow port (56) side of the valve element (57), and a valve seat (54c) formed around the inflow port (55). When the writing tip (17) is faced upward, the inflow port (55) is closed by the valve element (57), and when faced downward, the valve element (57) is allowed to touch the restricting body (58) and does not reach the outflow port (56).
    • 一种书写工具,其中形成逆流防止机构的元件形成为相当简单的形状,并且用于逆流防止机构的组装过程相当简化。 逆流防止机构(19)包括阀室(54b),向阀室(54b)的墨水储存部(16)侧开口的流入口(55),向外侧开口的流出口 阀室(54b)的书写尖端(17)侧,存储在阀室(54b)中的阀元件),在阀室(54b)中存储的位置处的限制体(58) 在阀元件(57)的流出口(56)侧,以及形成在流入口(55)周围的阀座(54c)。 当书写尖端(17)面向上方时,流入口(55)由阀体(57)封闭,当面向下时,阀元件(57)被允许接触限制体(58),并且 不到达流出口(56)。
    • 22. 发明申请
    • Annealed wafer and anneald wafer manufacturing method
    • 退火晶片和退火晶圆制造方法
    • US20060075957A1
    • 2006-04-13
    • US10530557
    • 2003-09-29
    • Hiroshi TakenoMasahiro SakuradaTakeshi Kobayashi
    • Hiroshi TakenoMasahiro SakuradaTakeshi Kobayashi
    • C30B23/00C30B25/00C30B28/14C30B28/12
    • C30B33/02C30B29/06H01L21/3225
    • The present invention provides an annealed wafer which has a wafer surface layer serving as a device fabricating region and having an excellent oxide film dielectric breakdown characteristic, and a wafer bulk layer in which oxide precipitates are present at a high density at the stage before the wafer is loaded into the device fabrication processes to give an excellent IG capability, and a method for manufacturing the annealed wafer. The present invention is directed to an annealed wafer obtained by performing heat treatment on a silicon wafer manufactured from a silicon single crystal grown by the Czochralski method, wherein a good chip yield of an oxide film dielectric breakdown characteristic in a region having at least a depth of up to 5 μm from a wafer surface is 95% or more, and a density of oxide precipitates detectable in the wafer bulk and each having a size not smaller than a size showing a gettering capability is not less than 1×109/cm3.
    • 本发明提供了一种退火晶片,其具有用作器件制造区域的晶片表面层并且具有优异的氧化膜介电击穿特性,以及晶片本体层,其中氧化物沉淀物以高密度存在于晶片前的阶段 被加载到器件制造工艺中以提供优异的IG能力,以及用于制造退火晶片的方法。 本发明涉及通过对由通过切克劳斯基法生长的硅单晶制造的硅晶片进行热处理而获得的退火晶片,其中在具有至少一深度的区域中的氧化膜介电击穿特性的良好的芯片产量 从晶片表面达到5μm的母体的密度为95%以上,并且在晶片体中可检测到的氧化物析出物的密度和每个具有不小于显示吸气能力的尺寸的尺寸不小于1×10 9 / SUP> / cm 3。
    • 29. 发明授权
    • Ink bag for ink jet type recording apparatus and package suitable for packing such ink bag
    • 用于喷墨式记录装置的墨水袋和适于包装这种墨水袋的包装
    • US06220702B1
    • 2001-04-24
    • US09471335
    • 1999-12-23
    • Masahiro NakamuraTakeshi KobayashiMasanori KamijyoTadatoshi HonzawaMichinari Tsukahara
    • Masahiro NakamuraTakeshi KobayashiMasanori KamijyoTadatoshi HonzawaMichinari Tsukahara
    • B41J2175
    • B41J2/17503B41J2/17513
    • The ink bag is structured as follows: To the respective long side portions (1a, 1b, 2a, 2b) of a rectangular-shaped, thermally fusible first film forming the surface portions (1, 2) of the ink bag, there are attached, by thermal fusion, the long side portions of a rectangular-shaped, thermally fusible second film forming the side surface portions (3, 4) of the ink bag and having lower rigidity than the first film to thereby form a cylindrical body. The one-side short side portions (1c, 2c) of the surface portions of the ink bag are attached together by thermal fusion to form a bag body. An ink supply hole forming member (5) is attached by thermal fusion to the other-side short side portions of the surface portions of the ink bag. In the four corners of the ink bag, there are formed band-shaped connecting portions (6 to 9) each starting from one of the two mutually adjoining sides of the ink bag and reaching the other of the two sides.
    • 油墨袋的结构如下:形成形成墨水袋的表面部分(1,2)的矩形的,热熔融的第一薄膜的各个长边部分(1a,1b,2a,2b)附着 通过热熔接,形成形成墨袋的侧表面部分(3,4)的矩形的热熔第二膜的长边部分,并且具有比第一膜低的刚性,从而形成圆柱体。 油墨袋的表面部分的一侧短边部分(1c,2c)通过热熔粘合在一起形成袋体。 供墨孔形成构件(5)通过热熔融附接到墨袋的表面部分的另一侧短边部分。 在墨水袋的四个角部,形成有从油墨袋的两个相邻侧之一开始并到达两侧的另一侧的带状连接部(6〜9)。