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    • 23. 发明申请
    • PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE UTILIZING SAME AND SOLID-STATE IMAGING DEVICE
    • 感光树脂组合物,使用相同的层压体和固态成像装置
    • US20120244473A1
    • 2012-09-27
    • US13513464
    • 2010-10-26
    • Yumiko OkudaToru OkazawaMasao KamogawaMitsuhito Suwa
    • Yumiko OkudaToru OkazawaMasao KamogawaMitsuhito Suwa
    • G03F7/004
    • G03F7/037G03F7/031G03F7/091
    • A photosensitive resin composition which can impart insulating properties and light-shielding properties against light having a wavelength lying in an ultra-violet range, a visible range and a near-infrared range to a substrate more readily when applied onto the substrate, wherein the substrate has such properties that the permeability to light having a wavelength of 400 to 900 nm inclusive is less than 3.0% and the maximum value of the permeability to light having a wavelength of longer than 900 nm and not longer than 1300 nm is 3.0% or more. The photosensitive resin composition is characterized by comprising (a) an alkali soluble resin, (b) a specific tungsten oxide and/or a specific composite tungsten oxide, (c) a photopolymerizable compound having at least two polymerizable groups, (d) an oxime-type photopolymerization initiator, and (e) a solvent.
    • 一种光敏树脂组合物,其能够在施加到基板上时更容易地赋予波长在紫外范围,可见光范围和近红外范围内的光的绝缘性能和遮光性,其中基材 具有波长为400〜900nm以上的光的透过率小于3.0%,波长在900nm以上1300nm以下的光的透过率的最大值为3.0%以上的特性 。 光敏树脂组合物的特征在于包含(a)碱溶性树脂,(b)特定的氧化钨和/或特定的复合氧化钨,(c)具有至少两个可聚合基团的光聚合化合物,(d)肟 型光聚合引发剂,和(e)溶剂。
    • 25. 发明申请
    • PHOTOSENSITIVE SILOXANE COMPOSITION, CURED FILM FORMED THEREFROM AND DEVICE HAVING THE CURED FILM
    • 感光性硅氧烷组合物,其固化膜和具有固化膜的装置
    • US20100129618A1
    • 2010-05-27
    • US12517186
    • 2007-11-21
    • Mitsuhito Suwa
    • Mitsuhito Suwa
    • C08F2/50B32B3/10
    • G03F7/0233G03F7/0755G03F7/0757H01L21/02126H01L21/02216H01L21/02282H01L21/3122Y10T428/24802
    • It is intended to provide a photosensitive siloxane composition comprising (a) polysiloxane, (b) a quinone diazide compound, (c) a solvent and (d) one or more kinds of imidosilane compounds represented by the general formulas (1) to (3): which makes it possible to provide a cured film having low shrinkage during curing and high transparency after thermal curing, suppressing the occurrence of cracks after dipping in an alkaline solvent and exhibiting excellent adhesiveness to a substrate, wherein R1s may be the same or different and each represents an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a phenyl group, a phenoxy group or an organic group replaced with them, R2 and R4 represent each a divalent organic group having 1 to 10 carbon atoms, R3 represents an organic group not containing a silicon atom and having 2 to 20 carbon atoms (provided that R3 represents an organic group other than a phenyl group in the general formula (1) and represents an organic group not containing an unsaturated bond other than an alicyclic group in the general formula (2)), and Ra represents a hydrogen atom or an organic group not containing a silicon atom and having 1 to 20 carbon atoms.
    • 旨在提供一种感光性硅氧烷组合物,其包含(a)聚硅氧烷,(b)醌二叠氮化合物,(c)溶剂和(d)一种或多种由通式(1)至(3)表示的酰氨基硅烷化合物 ):这使得可以提供固化后的低收缩率和热固化后的高透明度的固化膜,抑制在碱溶剂中浸渍之后出现裂纹,并且对基材具有优异的粘合性,其中R 1可以相同或不同 各自表示碳原子数1〜6的烷基,碳原子数1〜6的烷氧基,苯基,苯氧基或被它们取代的有机基,R2和R4分别表示1〜 10个碳原子,R 3表示不含硅原子且具有2〜20个碳原子的有机基团(条件是R 3表示通式(1)中的苯基以外的有机基团,表示 n通式(2)中不含脂环族基团以外的不饱和键的有机基团),Ra表示氢原子或不含硅原子且具有1〜20个碳原子的有机基团。
    • 26. 发明授权
    • Photosensitive resin precursor composition
    • 感光树脂前体组合物
    • US07507518B2
    • 2009-03-24
    • US10885100
    • 2004-07-07
    • Yoji FujitaTomoyuki YubaMitsuhito Suwa
    • Yoji FujitaTomoyuki YubaMitsuhito Suwa
    • G03F7/021G03F7/023G03F7/30
    • G03F7/0233G03F7/0045G03F7/0751
    • The present invention relates to a positive photosensitive resin precursor composition which exhibits good storage stability after exposure.A photosensitive resin precursor composition comprises (a) a polymer essentially composed of a structural unit expressed by formula (1); (b) at least two photo acid generators; and (c) a compound having an alkoxymethyl group: wherein R1 represents an organic group with a valence of 2 to 8, having at least two carbon atoms; R2 represents an organic group with a valence of 2 to 6, having at least two carbon atoms; R3 represents hydrogen or an organic group having a carbon number in the range of 1 to 20; n represents a number ranging from 10 to 100,000; m represents an integer in the range of 0 to 2; and p and q represent integers in the range of 0 to 4 and satisfy p+q>0.
    • 本发明涉及曝光后显示良好的储存稳定性的正型感光性树脂前体组合物。 光敏树脂前体组合物包含(a)基本上由式(1)表示的结构单元组成的聚合物; (b)至少两个光酸产生剂; 和(c)具有烷氧基甲基的化合物:其中R1表示具有至少两个碳原子的价数为2至8的有机基团; R2表示具有至少2个碳原子的2价至6价的有机基团; R3表示氢或碳数为1〜20的有机基团; n表示10〜100,000的数; m表示0〜2的整数, p和q表示0〜4的整数,满足p + q> 0。
    • 30. 发明申请
    • Photosensitive resin precursor composition
    • 感光树脂前体组合物
    • US20050014876A1
    • 2005-01-20
    • US10885100
    • 2004-07-07
    • Yoji FujitaTomoyuki YubaMitsuhito Suwa
    • Yoji FujitaTomoyuki YubaMitsuhito Suwa
    • G03F7/022G03F7/004G03F7/023G03F7/075C08L1/00
    • G03F7/0233G03F7/0045G03F7/0751
    • The present invention relates to a positive photosensitive resin precursor composition which exhibits good storage stability after exposure. A photosensitive resin precursor composition comprises (a) a polymer essentially composed of a structural unit expressed by formula (1); (b) at least two photo acid generators; and (c) a compound having an alkoxymethyl group: wherein R1 represents an organic group with a valence of 2 to 8, having at least two carbon atoms; R2 represents an organic group with a valence of 2 to 6, having at least two carbon atoms; R3 represents hydrogen or an organic group having a carbon number in the range of 1 to 20; n represents a number ranging from 10 to 100,000; m represents an integer in the range of 0 to 2; and p and q represent integers in the range of 0 to 4 and satisfy p+q>0.
    • 本发明涉及曝光后显示良好的储存稳定性的正型感光性树脂前体组合物。 光敏树脂前体组合物包含(a)基本上由式(1)表示的结构单元组成的聚合物; (b)至少两个光酸产生剂; 和(c)具有烷氧基甲基的化合物:其中R 1表示具有至少两个碳原子的价数为2至8的有机基团; R 2表示具有至少两个碳原子的价数为2至6的有机基团; R 3表示氢或碳数为1〜20的有机基团; n表示10〜100,000的数; m表示0〜2的整数, p和q表示0〜4的整数,满足p + q> 0。