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1. 发明授权

US06887643B2 Photosensitive resin precursor composition 有权
标题翻译：感光树脂前体组合物
公开(公告)号：US06887643B2
公开(公告)日：2005-05-03
申请号：US10623680
申请日：2003-07-22
申请人： Yoji Fujita , Mitsuhito Suwa , Masao Tomikawa
发明人： Yoji Fujita , Mitsuhito Suwa , Masao Tomikawa
IPC分类号： C08G73/10 , G03F7/004 , G03F7/023 , G03F7/30
CPC分类号： G03F7/0233 , G03F7/0048 , Y10S430/108
摘要： A photosensitive resin precursor composition exhibiting an excellent film thickness uniformity contains: a heat resistant resin precursor polymer; a radiation sensitive compound; and a solvent expressed by formula (1): R1 represents an alkyl group having a carbon number in the range of 1 to 3. R2, R3, R4, and R5 each represent hydrogen or an alkyl group having a carbon number in the range of 1 to 3, and l represents an integer in the range of 0 to 3.
摘要翻译：表现出优异的膜厚均匀性的感光性树脂前体组合物包含：耐热树脂前体聚合物; 辐射敏感化合物; 和由式（1）表示的溶剂：R 1表示碳数在1至3的范围内的烷基。R 2，R 3 R 4，R 4和R 5各自表示氢或碳数为1〜3的烷基，l表示范围为0到3。

2. 发明授权

US06524764B1 Positive-type photosensitive polyimide precursor composition 有权
标题翻译：正型光敏聚酰亚胺前体组合物
公开(公告)号：US06524764B1
公开(公告)日：2003-02-25
申请号：US09744734
申请日：2001-01-29
申请人： Masao Tomikawa , Mitsuhito Suwa , Yoji Fujita
发明人： Masao Tomikawa , Mitsuhito Suwa , Yoji Fujita
IPC分类号： G03F7023
CPC分类号： G03F7/0233 , C08G73/10 , G03F7/022
摘要： The present invention relates to a positive type photosensitive resin precursor composition which is characterized in that it contains polymer having, as its chief component, structural units represented by the following general formula (1) and, furthermore, in that it satisfies the following conditions (a) and/or (b). The invention provides an alkali-developable photosensitive composition. (a) There is included an ester of a naphthoquinone diazide sulphonic acid and a phenol compound of dipole moment 0.1 to 1.6 debye (b) There is included a phenol compound represented by general formula (8) and a naphthoquinone diazide sulphonic acid and/or an ester of a phenol compound represented by general formula (8) and a naphthoquinone diazide sulphonic acid (In general formula (1), R1 represents a bivalent to octavalent organic group with at least two carbon atoms, R2 represents a bivalent to hexavalent organic group with at least two carbon atoms, and R3 represents hydrogen or an organic group with from one to ten carbons. n is an integer in the range 10 to 100,000, m is an integer in the range 0 to 2, and p and q are integers in the range 0 to 4, but p and q are not simultaneously 0.) (In the formula, R23, R24, R26 and R27 each represents a hydrogen atom or a C1-8 alkyl group, alkoxy group, carboxyl group or ester group. At least one R25 is hydroxyl group, while the rest represent hydrogen atoms and C1-8 alkyl groups. aa, bb, cc and dd represent integers in the range 0 to 3. However, aa+bb≦5, bb+dd≦5 and aa+bb>0. ee represents an integer in the range 1 to 3.)
摘要翻译：本发明涉及一种正型感光性树脂前体组合物，其特征在于，其含有以下述通式（1）表示的结构单元作为主要成分的聚合物，此外，其具有满足以下条件（ a）和/或（b）。本发明提供一种碱显影性感光性组合物，（a）含有萘醌二叠氮磺酸的酯和偶极矩0.1〜1.6德烯的酚化合物（b）含有通式（8）表示的酚化合物）和萘醌二叠氮磺酸和/或由通式（8）表示的酚化合物和萘醌二叠氮磺酸的酯（通式（1）中，R 1表示具有至少两个碳的二价至八价有机基团原子，R2表示具有至少两个碳原子的二价至六价有机基团，并且R 3表示氢或具有1至10个碳的有机基团，n为10至100,000的整数，m为范围内的整数 0〜2，p和q为0〜4的整数，p和q不同时为0）（式中，R 23，R 24，R 26和R 27分别表示氢原子或C 1-8烷基基团，烷氧基，羧基或醚基 ter组。至少一个R 25是羟基，而其余的表示氢原子和C 1-8烷基。 aa，bb，cc和dd表示0至3范围内的整数。然而，aa + bb <= 5，bb + dd <= 5和aa + bb> 0。 ee表示1〜3的整数）

3. 发明授权

US06933087B2 Precursor composition for positive photosensitive resin and display made with the same 有权
标题翻译：用于正性感光树脂的前体组合物和用其制成的显示器
公开(公告)号：US06933087B2
公开(公告)日：2005-08-23
申请号：US10258660
申请日：2002-02-21
申请人： Mitsuhito Suwa , Kazuto Miyoshi , Masao Tomikawa
发明人： Mitsuhito Suwa , Kazuto Miyoshi , Masao Tomikawa
IPC分类号： G03F7/022 , G03F7/023 , G03F7/30
CPC分类号： G03F7/0226 , G03F7/0233 , Y10S430/107
摘要： A positive photosensitive resin precursor composition which can be can be developed in an alkaline developer is provided. The positive photosensitive resin precursor composition comprises (a), one of (b1) and (b2), and (c): (a) a polyamic acid ester and/or a polyamic acid polymer, both of which are soluble in an alkaline aqueous solution; (b1) a phenolic-hydroxyl-group-containing thermally crosslinkable compound comprising an organic-group-R1-substituted methylol group represented by formula (1) (wherein R1 is not a hydrogen atom), CH2—OR1) (1); (b2) a thermally crosslinkable compound containing a ureal organic group substituted by an organic group R1 and represented by formula (2) (c) an esterified quinone diazide compound.
摘要翻译：提供可以在碱性显影剂中显影的正型感光性树脂前体组合物。正型感光性树脂前体组合物包含（a），（b1）和（b2）中的一种，（c）：（a）聚酰胺酸酯和/或聚酰胺酸聚合物，它们都可溶于碱性水溶液解; （b1）含有酚羟基的热交联性化合物，其包含由式（1）表示的有机基-R 1 - 取代羟甲基（其中R 1，不是氢原子），<？in-line-formula description =“In-line Formulas”end =“lead”？> CH （1）; <？in-line-formula description =“In-line Formulas”end =“tail”？>（b2）一种热交联性化合物，其含有被由式（2）（c）表示的有机基团R 1是酯化醌二叠氮化合物。

4. 发明授权

US06593043B2 Composition of positive photosensitive resin precursor, and display device thereof 有权
公开(公告)号：US06593043B2
公开(公告)日：2003-07-15
申请号：US09985059
申请日：2001-11-01
申请人： Mitsuhito Suwa , Kazuto Miyoshi , Masao Tomikawa
发明人： Mitsuhito Suwa , Kazuto Miyoshi , Masao Tomikawa
IPC分类号： G03F7023
CPC分类号： G03F7/0226 , G03F7/0233 , H01L27/32
摘要： A composition of a positive photosensitive resin precursor includes (a) a polyamic acid ester and/or a polyamic acid each having at least one selected from a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group at the end of a principal chain of the polymer, (b) a compound having a phenolic hydroxyl group, and (c) a quinonediazide sulfnate. The composition can be subjected to dissolution in an alkaline developer.

5. 发明申请

US20090123867A1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION PROMOTER 有权
标题翻译：光敏树脂组合物和粘合促进剂
公开(公告)号：US20090123867A1
公开(公告)日：2009-05-14
申请号：US11994300
申请日：2006-04-18
申请人： Tomoyuki Yuba , Yoji Fujita , Masao Tomikawa
发明人： Tomoyuki Yuba , Yoji Fujita , Masao Tomikawa
IPC分类号： G03F7/075 , G03F7/20 , C07F7/10
CPC分类号： G03F7/0751 , C08K5/0025 , C08K5/544 , G03F7/0045 , G03F7/0226 , G03F7/0755 , Y10S430/106 , Y10S430/111 , Y10S430/115 , Y10S430/117
摘要： The present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxy group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator. According to the present invention, it is possible to obtain a photosensitive resin composition which remarkably enhances the adhesion property with a substrate after curing without deteriorating storage stability of a solution, and does not cause peeling of a fine pattern even upon development.
摘要翻译：本发明提供一种感光性树脂组合物，其含有（a）碱溶性树脂，（b）具有仲芳香族氨基和烷氧基的硅化合物，和（c）选自光聚合引发剂，照片酸发生器和光源发生器。根据本发明，可以获得在固化后显着提高与基材的粘合性的感光性树脂组合物，而不会降低溶液的储存稳定性，并且即使在显影时也不会造成精细图案的剥离。

6. 发明授权

US07977028B2 Photosensitive resin composition and adhesion promoter 有权
标题翻译：感光树脂组合物和粘合促进剂
公开(公告)号：US07977028B2
公开(公告)日：2011-07-12
申请号：US11994300
申请日：2006-04-18
申请人： Tomoyuki Yuba , Yoji Fujita , Masao Tomikawa
发明人： Tomoyuki Yuba , Yoji Fujita , Masao Tomikawa
IPC分类号： G03F7/075 , G03F7/028 , G03F7/032 , G03F7/20 , G03F7/30
CPC分类号： G03F7/0751 , C08K5/0025 , C08K5/544 , G03F7/0045 , G03F7/0226 , G03F7/0755 , Y10S430/106 , Y10S430/111 , Y10S430/115 , Y10S430/117
摘要： The present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxy group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator. According to the present invention, it is possible to obtain a photosensitive resin composition which remarkably enhances the adhesion property with a substrate after curing without deteriorating storage stability of a solution, and does not cause peeling of a fine pattern even upon development.
摘要翻译：本发明提供一种感光性树脂组合物，其含有（a）碱溶性树脂，（b）具有仲芳香族氨基和烷氧基的硅化合物，和（c）选自光聚合引发剂，照片酸发生器和光源发生器。根据本发明，可以获得在固化后显着提高与基材的粘合性的感光性树脂组合物，而不会降低溶液的储存稳定性，并且即使在显影时也不会造成精细图案的剥离。

7. 发明授权

US09188860B2 Method for producing polyamide and resin composition 有权
标题翻译：生产聚酰胺和树脂组合物的方法
公开(公告)号：US09188860B2
公开(公告)日：2015-11-17
申请号：US12676448
申请日：2008-09-04
申请人： Tomoyuki Yuba , Masao Tomikawa
发明人： Tomoyuki Yuba , Masao Tomikawa
IPC分类号： G03F7/004 , C08G69/04 , C08L77/00 , G03F7/023 , C08G69/00 , C08L77/10 , C08G77/00 , G03F7/037
CPC分类号： G03F7/0233 , C08G69/00 , C08G77/70 , C08L77/10 , G03F7/037
摘要： Disclosed is a method for producing polyamide, wherein a diimidazolide compound represented by the general formula (1) shown below is reacted with a diamine compound represented by the general formula (2) shown below. The present invention provides a method for producing a chlorine-free high molecular weight alkali-soluble polyamide by simple process.
摘要翻译：公开了一种聚酰胺的制造方法，其中由下述通式（1）表示的二咪唑化合物与下述通式（2）表示的二胺化合物反应。本发明提供一种通过简单的方法生产无氯高分子量碱溶性聚酰胺的方法。

8. 发明申请

US20130289202A1 POLYAMIC ACID RESIN COMPOSITION AND METHOD OF PRODUCING THE SAME 审中-公开
标题翻译：聚酰胺树脂组合物及其制造方法
公开(公告)号：US20130289202A1
公开(公告)日：2013-10-31
申请号：US13978291
申请日：2011-12-21
申请人： Daichi Miyazaki , Kazuto Miyoshi , Masao Tomikawa
发明人： Daichi Miyazaki , Kazuto Miyoshi , Masao Tomikawa
IPC分类号： C08L79/08 , C08G73/10
CPC分类号： C08L79/08 , C08G73/101 , C08G73/1014 , C08G73/1017 , C08G73/1042 , C08G73/1067 , C08G73/1071 , C08G73/14 , C09D179/08
摘要： The disclosed polyamic acid resin composition contains (a) a polyamic acid represented by general formula (1) or (2), and (b) a solvent. (A, A′, C, C′ are end-capped polyamic acid blocks comprising diaminobenzanilide and pyromellitic dianhydride or benzophenone tetracarboxylic dianhydride, and B, or D, is a polyamic acid block comprising a repeating unit other than A, A′, or C, C′. A-B-A′ (1) C-D-C′ (2)
摘要翻译：所公开的聚酰胺酸树脂组合物含有（a）由通式（1）或（2）表示的聚酰胺酸，和（b）溶剂。（A，A'，C，C'是包含二氨基苯甲酰苯胺和均苯四甲酸二酐或二苯甲酮四羧酸二酐的封端聚酰胺酸嵌段，B或D是包含除A，A'或以外的重复单元的聚酰胺酸嵌段 C，C'，AB-A'（1）CD-C'（2）

9. 发明授权

US06929890B2 Positive-type photosensitive resin composition 有权
标题翻译：正型感光性树脂组合物
公开(公告)号：US06929890B2
公开(公告)日：2005-08-16
申请号：US10819177
申请日：2004-04-07
申请人： Kazuto Miyoshi , Ryoji Okuda , Masao Tomikawa
发明人： Kazuto Miyoshi , Ryoji Okuda , Masao Tomikawa
IPC分类号： G03F7/00 , G03F7/022 , G03F7/023 , G03F7/105 , G03F7/30
CPC分类号： G03F7/0226 , G03F7/0007 , G03F7/0233 , G03F7/105
摘要： Disclosed is a positive-type photosensitive resin composition comprising: (a) an alkali-soluble resin; (b) a quinone diazide compound; (c) a heatsensitive compound which colors upon being heated and which shows an absorption maximum at a wavelength of not less than 350 nm and not more than 700 nm; and (d) a compound which does not have an absorption maximum at a wavelength of not less than 350 nm to less than 500 nm, and has an absorption maximum at a wavelength of not less than 500 nm and not more than 750 nm. The composition is preferably used for forming light-blocking separators or black matrices of organic electroluminescent devices and liquid crystal display elements.
摘要翻译：公开了一种正型感光性树脂组合物，其包含：（a）碱溶性树脂; （b）醌二叠氮化合物; （c）加热时着色的热敏化合物，并且在不小于350nm且不大于700nm的波长下显示最大吸收; 和（d）在波长不小于350nm至小于500nm处不具有吸收最大值的化合物，并且在不小于500nm且不大于750nm的波长下具有最大吸收。该组合物优选用于形成有机电致发光器件和液晶显示元件的阻光隔离器或黑色矩阵。

10. 发明授权

US08709552B2 Resin composition and display device using the same 有权
标题翻译：树脂组合物和使用其的显示装置
公开(公告)号：US08709552B2
公开(公告)日：2014-04-29
申请号：US13146794
申请日：2010-01-15
申请人： Kazuto Miyoshi , Mika Koshino , Masao Tomikawa
发明人： Kazuto Miyoshi , Mika Koshino , Masao Tomikawa
IPC分类号： C08F2/50 , G03F7/23 , G03F7/30
CPC分类号： G02B1/04 , C08G73/10 , C08G73/22 , C08K5/13 , C08K5/17 , C09K11/06 , C09K2211/1007 , C09K2211/1014 , C09K2211/1044 , C09K2211/1059 , G03F7/0007 , G03F7/037 , G03F7/039 , G03F7/40 , H01L27/322 , H01L27/3246 , H01L27/3258 , H01L51/5284 , H01L2224/18 , H05B33/10 , H05B33/14 , Y10T428/10 , Y10T428/1018 , Y10T428/1023 , Y10T428/105 , Y10T428/1095 , C08L79/04 , C08L79/08
摘要： The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.
摘要翻译：本发明的树脂组合物是一种树脂组合物，其特征在于包括（a）聚酰亚胺，聚苯并恶唑，聚酰亚胺前体或聚苯并恶唑前体，（b）1,5-二羟基萘，1,6-二羟基萘，二羟基萘或2,3-二羟基萘，和（c）具有特定结构的热交联剂。通过使用本发明的树脂组合物，可以在固化前保持树脂膜的透射率，降低固化膜的可见光区域的透射率。

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