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21. 发明申请

US20070253667A1 Optoelectronic Component with Multi-Part Housing Body 有权
标题翻译：多部件壳体的光电元件
公开(公告)号：US20070253667A1
公开(公告)日：2007-11-01
申请号：US10593794
申请日：2005-03-09
申请人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Hofer
发明人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Hofer
IPC分类号： H01L31/0203
CPC分类号： H01L33/60 , H01L31/0203 , H01L31/02325 , H01L33/486 , H01L33/54 , H01L2924/0002 , H01S5/02228 , H01S5/02244 , H01S5/02292 , H01L2924/00
摘要： An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.
摘要翻译：提出了一种光电子部件（1），其包括壳体（2）和设置在其上的至少一个半导体芯片（8），所述壳体具有包括连接器主体（16）的基部（13）导体材料（6,7）设置，并且所述壳体具有包括反射体（23）的反射器部分（14），反射器材料（9）设置在所述反射器部分上，其中所述连接器主体和所述反射器主体被预成型彼此分开，并且所述反射器主体以反射器顶部的形式设置在所述连接器主体上。

22. 发明授权

US07247940B2 Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body 有权
标题翻译：具有图案化金属化封装体的光电器件，用于制造这种器件的方法和用于含塑料体的图案化金属化的方法
公开(公告)号：US07247940B2
公开(公告)日：2007-07-24
申请号：US10792538
申请日：2004-03-01
申请人： Thomas Höfer , Herbert Brunner , Frank Möllmer , Günter Waitl , Rainer Sewald , Markus Zeiler
发明人： Thomas Höfer , Herbert Brunner , Frank Möllmer , Günter Waitl , Rainer Sewald , Markus Zeiler
IPC分类号： H01L23/03
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/01004 , H01L2924/01046 , H01L2924/01057 , H01L2924/01068 , H01L2924/01079 , H01L2924/12041 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic device, comprising a package body (57) and at least one semiconductor chip (50) arranged on the package body (57). The surface of the package body (57) has a metallized subregion (15) and a non-metallized subregion (20). The package body (57) includes at least two different plastics (53, 54), one of the plastics being non-metallizable (54) and this plastic determining the non-metallized subregion (20). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.
摘要翻译：一种光电子器件，包括封装主体（57）和布置在封装主体（57）上的至少一个半导体芯片（50）。封装主体（57）的表面具有金属化子区域（15）和非金属化子区域（20）。包装体（57）包括至少两种不同的塑料（53,54），塑料中的一种是不可金属化的（54），该塑料确定非金属化子区域（20）。还提供了用于制造这种组分的方法和用于含塑料体的图案化金属化的方法。

23. 发明授权

US06459130B1 Optoelectronic semiconductor component 有权
标题翻译：光电半导体元件
公开(公告)号：US06459130B1
公开(公告)日：2002-10-01
申请号：US09043840
申请日：1999-11-18
申请人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Günter Waitl
发明人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Günter Waitl
IPC分类号： H01L3300
CPC分类号： H01L33/486 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured. Wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.
摘要翻译：辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。芯片载体部分在其中固定半导体芯片的区域中形成槽。其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。

24. 发明授权

US06432745B1 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof 失效
标题翻译：用于半导体元件的两极SMT微型外壳及其制造方法
公开(公告)号：US06432745B1
公开(公告)日：2002-08-13
申请号：US08866064
申请日：1997-05-30
申请人： Guenther Waitl , Franz Schellhorn , Herbert Brunner
发明人： Guenther Waitl , Franz Schellhorn , Herbert Brunner
IPC分类号： H01L2144
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H05K3/3426 , H05K2201/10454 , H05K2201/10651 , H05K2201/10818 , Y02P70/613 , H01L2924/00014
摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.
摘要翻译：在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。芯片安装表面和部件的安装表面彼此成直角。

25. 发明授权

US5999552A Radiation emitter component 失效
标题翻译：辐射发射器组件
公开(公告)号：US5999552A
公开(公告)日：1999-12-07
申请号：US9606
申请日：1998-01-20
申请人： Georg Bogner , Herbert Brunner , Heinz Haas , Johann Luft , Ernst Nirschl , Werner Spaeth , Norbert Stath , Wolfgang Teich
发明人： Georg Bogner , Herbert Brunner , Heinz Haas , Johann Luft , Ernst Nirschl , Werner Spaeth , Norbert Stath , Wolfgang Teich
IPC分类号： H01L33/56 , H01S3/00 , H01S5/00 , H01S5/022 , H01S3/18 , H01L33/00
CPC分类号： H01S5/02244 , H01S5/02228 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2933/0091 , H01L33/56
摘要： A radiation emitter component, in particular an infrared emitter component with a conventional light-emitting diode housing, includes two electrode connections, one of which has a well-shaped reflector. The housing has an optically transparent, electrically non-conducting encapsulation material. A semiconductor laser chip is fastened in a well-shaped reflector of the light-emitting diode housing. The semiconductor laser chip has a quantum well structure, in particular with a strained layer structure, for example MOVPE epitaxial layers with a layer sequence GaAlAs-InGaAs-GaAlAs. A diffusor material can be inserted into the optically transparent, electrically non-conducting material of the light-emitting diode housing. The diffusor material is constructed or inserted with regard to type and concentration in such a way that in connection with the semiconductor laser chip encapsulated in the light-emitting diode housing, a radiation characteristic curve or an increase of an effective emission surface is produced that is comparable to that of a conventional infrared light-emitting diode.
摘要翻译：辐射发射器部件，特别是具有传统发光二极管外壳的红外发射器部件包括两个电极连接件，其中之一具有良好形状的反射器。壳体具有光学透明的非导电封装材料。将半导体激光芯片紧固在发光二极管壳体的形状好的反射器中。半导体激光芯片具有量子阱结构，特别是具有应变层结构，例如具有层序列GaAlAs-InGaAs-GaAlAs的MOVPE外延层。漫射材料可以插入到发光二极管外壳的光学透明的非导电材料中。关于类型和浓度来构造或插入扩散材料，使得与封装在发光二极管外壳中的半导体激光器芯片有关，产生辐射特性曲线或有效发射表面的增加，即，与传统的红外发光二极管相当。

26. 发明授权

US5981979A Radiation-emitting semiconductor component 失效
标题翻译：辐射发射半导体元件
公开(公告)号：US5981979A
公开(公告)日：1999-11-09
申请号：US979535
申请日：1997-11-26
申请人： Herbert Brunner
发明人： Herbert Brunner
IPC分类号： H01L33/48 , H01L33/54 , H01L33/62 , H05K3/34 , H01L33/00
CPC分类号： H01L33/62 , H01L33/54 , H05K3/3426 , H01L2224/48091 , H01L2224/73265 , H01L2924/12041 , H01L33/486 , Y02P70/613
摘要： A surface-mountable radiation-emitting semiconductor component includes an integrally constructed sheath of radiation-permeable material. The sheath has mutually opposite sides with a bottom surface and a radiation exit surface. The sheath also has a PCB bearing surface which is substantially perpendicular to the bottom surface and is located in one and the same plane as soldering surfaces of terminal leads protruding through the bottom surface out of the sheath.
摘要翻译：可表面安装的辐射发射半导体部件包括一体构造的辐射可透过材料的护套。护套具有相互相对的侧面，其具有底表面和辐射出射表面。护套还具有基本上垂直于底表面的PCB支承表面，并且位于与通过底表面伸出护套的端子引线的焊接表面的同一平面中。

27. 发明授权

US4295745A Apparatus for conditioning bioinjurious waste 失效
标题翻译：生物危害废物调理装置
公开(公告)号：US4295745A
公开(公告)日：1981-10-20
申请号：US128815
申请日：1980-03-10
申请人： Herbert Brunner
发明人： Herbert Brunner
IPC分类号： B01F7/00 , B01F13/04 , B01F15/00 , G21F9/00 , G21F9/16 , G21F9/30 , G21F9/34 , G21F9/36 , B01F7/32
CPC分类号： B01F7/00175 , B01F13/04 , G21F9/008 , G21F9/165 , G21F9/34
摘要： A stirrer which permits homogenous and quick thorough mixing for the conditioning of bioinjurious waste, particularly radioactive waste, by means of a binder in the final storage container. The stirrer has a portion rotatable on another portion fixed in the container. The rotatable portion includes closed frame means having two or more opposite axially staggered stirrer arms secured to a hollow central bearing sleeve having axially spaced parts. The fixed portion includes a rod-like part upstanding centrally from the bottom of the container with the sleeve journalled thereon. The fixed portion is provided with one or more mixing elements secured thereto and disposed between the sleeve parts.
摘要翻译：一种搅拌器，其允许通过最终存储容器中的粘合剂均匀且快速地充分混合以调节生物危害废物，特别是放射性废物。搅拌器具有可在固定在容器中的另一部分上旋转的部分。可旋转部分包括闭合的框架装置，该框架装置具有两个或更多个相对的轴向交错的搅拌臂，该搅动臂固定到具有轴向间隔开的部分的空心中心轴承套筒上。固定部分包括从容器的底部中心竖立的杆状部分，套筒支承在其上。固定部分设置有固定到其上的一个或多个混合元件并且设置在套筒部分之间。

28. 发明授权

US08853732B2 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US08853732B2
公开(公告)日：2014-10-07
申请号：US13499622
申请日：2010-08-31
申请人： Klaus Müller , Günter Spath , Siegfried Herrmann , Ewald Karl Michael Günther , Herbert Brunner
发明人： Klaus Müller , Günter Spath , Siegfried Herrmann , Ewald Karl Michael Günther , Herbert Brunner
IPC分类号： H01L33/62 , H01L31/0224
CPC分类号： H01L31/0224 , H01L25/0753 , H01L25/167 , H01L33/0079 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/4554
摘要： The invention relates to an optoelectronic component, having —a carrier (1) comprising a first main surface (Ia), —at least one optoelectronic semiconductor chip (2) having no substrate, and —a contact metallization (3a, 3b), wherein —the carrier (1) is electrically insulating, —the at least one optoelectronic semiconductor chip (2) is fastened to the first main surface (Ia) of the carrier (1) by means of a bonding material (4), particularly a solder material, —the contact metallization (3a, 3b) covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (2), and —the contact metallization (3a, 3b) is electrically conductively connected to the optoelectronic semiconductor chip (2).
摘要翻译：本发明涉及一种具有载体（1）的光电子部件，载体（1）包括第一主表面（Ia）， - 至少一个不具有基板的光电子半导体芯片（2）和 - 接触金属化（3a，3b），其中 - 载体（1）是电绝缘的， - 至少一个光电子半导体芯片（2）通过接合材料（4）紧固到载体（1）的第一主表面（1a），特别是焊料材料， - 接触金属化（3a，3b）覆盖不含光电子半导体芯片（2）的第一主表面（1a）的至少一个区域，并且接触金属化层（3a，3b）导电地连接到光电半导体芯片（2）。

29. 发明授权

US08716729B2 Lighting device 有权
标题翻译：照明设备
公开(公告)号：US08716729B2
公开(公告)日：2014-05-06
申请号：US12809729
申请日：2008-12-11
申请人： Burkard Wiesmann , Herbert Brunner , Joerg Strauss , Julius Muschaweck , Kirstin Petersen
发明人： Burkard Wiesmann , Herbert Brunner , Joerg Strauss , Julius Muschaweck , Kirstin Petersen
IPC分类号： H01L33/00
CPC分类号： H01L33/50 , H01L33/44 , H01L2224/48091 , H01L2924/00014
摘要： A lighting device (1) comprises at least one element (2) emitting light which is at least in part visible, and at least one conversion medium (3), which converts at least part of the radiation emitted by the element (2) into radiation of another frequency. In addition, the lighting device (1) comprises at least one filter medium (4) which filters at least part of the radiation, and which is configured such that the quantity of the conversion medium (4) to be used is reduced for at least one predetermined color saturation and/or one predetermined hue. This means that, compared with a light source corresponding to the lighting device (1) apart from the filter medium (4), savings are made in conversion medium (3) while achieving the same color saturation or the same hue. Light of a predetermined color saturation or of a predetermined hue may be efficiently generated by such a lighting device (1) and the lighting device (1) may be inexpensively produced. In operation, it also has high light intensities and a long service life.
摘要翻译：照明装置（1）包括发射至少部分可见的光的至少一个元件（2）和至少一个转换介质（3），其将由元件（2）发射的辐射的至少一部分转换成另一个频率的辐射。此外，照明装置（1）包括至少一个过滤介质（4），其过滤至少部分辐射，并且被配置为使得要使用的转化介质（4）的量至少减少一个预定的色彩饱和度和/或一个预定色调。这意味着与对应于照明装置（1）的与过滤介质（4）相对应的光源相比，在转换介质（3）中节省了同样的颜色饱和度或相同的色相。可以通过这种照明装置（1）有效地生成预定色彩饱和度的光或预定色调的光，并且可以廉价地制造照明装置（1）。使用寿命长，光线强度高，使用寿命长。

30. 发明授权

US07718451B2 Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body 有权
标题翻译：用于制造具有图案化金属化封装体的光电子器件的方法和用于含塑料体的图案化金属化的方法
公开(公告)号：US07718451B2
公开(公告)日：2010-05-18
申请号：US11880717
申请日：2007-07-23
申请人： Thomas Höfer , Herbert Brunner , Frank Möllmer , Günter Waitl , Rainer Sewald , Markus Zeiler
发明人： Thomas Höfer , Herbert Brunner , Frank Möllmer , Günter Waitl , Rainer Sewald , Markus Zeiler
IPC分类号： H01L21/00
CPC分类号： H01L33/60 , B29C45/14639 , B29C45/1671 , B29C2045/0079 , H01L24/48 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.
摘要翻译：一种用于含塑料体的图案化金属化的方法，其包括以下步骤：通过具有至少两种塑料的双组分注射成型工艺生产所述主体，其中一种是不可金属化的，并且将所述主体金属化在这种形成金属化区域和非金属化区域的方式，其中非金属化区域由非金属化塑料确定。还提供了一种用于含塑料体的图案化金属化的方法，特别是用于光电子器件的封装体。

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