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1. 发明授权

US06459130B1 Optoelectronic semiconductor component 有权
标题翻译：光电半导体元件
公开(公告)号：US06459130B1
公开(公告)日：2002-10-01
申请号：US09043840
申请日：1999-11-18
申请人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Günter Waitl
发明人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Günter Waitl
IPC分类号： H01L3300
CPC分类号： H01L33/486 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured. Wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.
摘要翻译：辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。芯片载体部分在其中固定半导体芯片的区域中形成槽。其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。

2. 发明授权

US07199454B2 Optoelectronic semiconductor component 有权
标题翻译：光电半导体元件
公开(公告)号：US07199454B2
公开(公告)日：2007-04-03
申请号：US11002959
申请日：2004-12-02
申请人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Günter Waitl
发明人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Günter Waitl
IPC分类号： H01L23/497
CPC分类号： H01L33/486 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.
摘要翻译：辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。芯片载体部分在其中固定半导体芯片的区域中形成槽，其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。

3. 发明授权

US06975011B2 Optoelectronic semiconductor component having multiple external connections 有权
标题翻译：具有多个外部连接的光电半导体元件
公开(公告)号：US06975011B2
公开(公告)日：2005-12-13
申请号：US10819638
申请日：2004-04-06
申请人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Günter Waitl
发明人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Günter Waitl
IPC分类号： H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/48 , H01L33/60 , H01L33/64 , H01L23/29 , H01L33/00 , H01L27/14 , H01L23/795 , G03F7/075
CPC分类号： H01L33/486 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.
摘要翻译：辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。芯片载体部分在其中固定半导体芯片的区域中形成槽，其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。

4. 发明授权

US06927469B2 Surface mountable light emitting or receiving device 有权
标题翻译：表面贴装发光或接收装置
公开(公告)号：US06927469B2
公开(公告)日：2005-08-09
申请号：US10173055
申请日：2002-06-17
申请人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Günter Waitl
发明人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Günter Waitl
IPC分类号： H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/48 , H01L33/60 , H01L33/64 , H01L33/00 , H01L23/29 , H01L27/14 , H01L23/795 , H01L31/08
CPC分类号： H01L33/486 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A radiation-emitting and/or radiation-receiving semiconductor component, in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.
摘要翻译：辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。芯片载体部分在其中固定半导体芯片的区域中形成槽，其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。

5. 发明申请

US20050116238A1 Optoelectronic semiconductor component 有权
标题翻译：光电半导体元件
公开(公告)号：US20050116238A1
公开(公告)日：2005-06-02
申请号：US11002959
申请日：2004-12-02
申请人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Gunter Waitl
发明人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Gunter Waitl
IPC分类号： H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/48 , H01L33/60 , H01L33/64 , H01L27/15
CPC分类号： H01L33/486 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.
摘要翻译：辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。芯片载体部分在其中固定半导体芯片的区域中形成槽，其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。

6. 发明授权

US07288606B2 Transparent liquid resin material for SMT-enabled LED-applications at higher temperatures and higher luminosities 有权
标题翻译：透明液体树脂材料，用于在更高温度和更高的照度下使用SMT的LED应用
公开(公告)号：US07288606B2
公开(公告)日：2007-10-30
申请号：US11305402
申请日：2005-12-16
申请人： Klaus Höhn , Günter Waitl , Karlheinz Arndt
发明人： Klaus Höhn , Günter Waitl , Karlheinz Arndt
IPC分类号： B05D5/06 , C08L63/02 , C08L63/04
CPC分类号： C08G59/38 , C08G59/42 , H01L23/293 , H01L33/56 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： A casting resin compound as an assembly and encapsulation material for electronic and optoelectronic component parts, modules and components, for example for casting out optoelectronic components on the basis of acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak. This casting resin compound exhibits a clearly increased glass transition temperature, is suitable for mass-production, exhibits no health deteriorations, and supplies SMT-capable products that can be utilized in the automotive sector.
摘要翻译：作为用于电子和光电子部件，模块和部件的组装和封装材料的浇铸树脂化合物，例如用于在酸酐可固化的环氧化合物，特别是双酚A-二缩水甘油醚的基础上流出光电组件，包含多功能环氧酚醛清漆树脂，特别是环氧甲酚酚醛清漆。该铸塑树脂组合物显示出明显提高的玻璃化转变温度，适合批量生产，不会出现健康恶化，并提供可用于汽车行业的具有SMT能力的产品。

7. 发明授权

US07009008B1 Transparent liquid resin material for SMT-enabled led-applications at higher temperatures and higher luminosities 有权
标题翻译：透明液体树脂材料，用于在更高温度和更高的光度下用于SMT的LED应用
公开(公告)号：US07009008B1
公开(公告)日：2006-03-07
申请号：US10048667
申请日：2000-08-04
申请人： Klaus Höhn , Günter Waitl , Karlheinz Arndt
发明人： Klaus Höhn , Günter Waitl , Karlheinz Arndt
IPC分类号： B05D5/06 , C08L63/02 , C08L63/04
CPC分类号： C08G59/38 , C08G59/42 , H01L23/293 , H01L33/56 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： A casting resin compound as an assembly and encapsulation material for electronic and optoelectronic component parts, modules and components, for example for casting out optoelectronic components on the basis of acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak. This casting resin compound exhibits a clearly increased glass transition temperature, is suitable for mass-production, exhibits no health deteriorations, and supplies SMT-capable products that can be utilized in the automotive sector.
摘要翻译：作为用于电子和光电子部件，模块和部件的组装和封装材料的浇铸树脂化合物，例如用于在酸酐可固化的环氧化合物，特别是双酚A-二缩水甘油醚的基础上流出光电组件，包含多功能环氧酚醛清漆树脂，特别是环氧甲酚酚醛清漆。该铸塑树脂组合物显示出明显提高的玻璃化转变温度，适合批量生产，不会出现健康恶化，并提供可用于汽车行业的具有SMT能力的产品。

8. 发明授权

US07271425B2 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US07271425B2
公开(公告)日：2007-09-18
申请号：US10535794
申请日：2003-11-27
申请人： Karlheinz Arndt , Georg Bogner , Günter Waitl , Matthias Winter
发明人： Karlheinz Arndt , Georg Bogner , Günter Waitl , Matthias Winter
IPC分类号： H01L29/22
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48247 , H01L2224/48465 , H01L2924/00
摘要： The invention relates to an optoelectronic component containing an optoelectronic chip (1) and containing a chip carrier (2) that has a central region (3) on which the chip is fixed and that comprises terminals (41, 42, 43, 44) extending outwardly from the central region of the chip carrier (2) to the outside, wherein the chip and portions of the chip carrier are enveloped by a body (5) and wherein the projection of the body and that of each of the longitudinal axes of the terminals onto the contact plane between the chip and the chip carrier are substantially point-symmetrical with respect to the central point of the chip. The invention further relates to an arrangement comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced failures of the component is reduced.
摘要翻译：本发明涉及一种含有光电子芯片（1）并包含芯片载体（2）的光电子部件，芯片载体（2）具有芯片固定在其上的中心区域（3），并且包括端子（41,42,43,44）向外从芯片载体（2）的中心区域延伸至外部，其中芯片和芯片载体的部分被主体（5）包围，并且其中主体的突起和纵向轴线的突出部分在芯片和芯片载体之间的接触平面上的端子相对于芯片的中心点基本上是点对称的。本发明还涉及包括所述部件的装置。组件的对称构型的优点在于降低了组织的热力学诱导故障的风险。

9. 发明授权

US07427806B2 Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component 有权
标题翻译：发射和/或接收电磁辐射的半导体部件和用于这种部件的壳体基座
公开(公告)号：US07427806B2
公开(公告)日：2008-09-23
申请号：US11179028
申请日：2005-07-18
申请人： Karlheinz Arndt , Georg Bogner , Bert Braune , Günter Waitl
发明人： Karlheinz Arndt , Georg Bogner , Bert Braune , Günter Waitl
IPC分类号： H01L23/20
CPC分类号： H01L33/486 , H01L33/52 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated with an encapsulant (4) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (1). The recess (2) comprises a chip well (21) in which the semiconductor chip (1) is secured, and a trench (22) that runs at least partway around the chip well (21) inside the recess (2), such that between the chip well (21) and the trench (22) the housing base body (3) comprises a wall (23) whose apex, viewed from a bottom face of the chip well (21), lies below the level of the surface of the housing base body (3) from which the recess (2) leads into the housing base body (3), and the encapsulant (4) extends outward from the chip well (21) over the wall into the trench (22). A corresponding housing base body is also disclosed.
摘要翻译：公开了一种辐射发射和/或接收半导体部件，其包括至少一个辐射发射和/或接收半导体芯片（1），其布置在壳体基体（3）的凹部（2）中，并且被封装有对由半导体芯片（1）发射和/或接收的电磁辐射容易透明的密封剂（4）。凹部（2）包括其中固定有半导体芯片（1）的芯片阱（21）和在凹部（2）内部至少沿芯片阱（21）延伸的沟槽（22），使得在芯片井（21）和沟槽（22）之间，壳体基体（3）包括壁（23），其从芯片井（21）的底面观察其顶点位于下表面的水平面所述壳体基体（3）从所述凹部（2）引导到所述壳体基体（3）中，并且所述密封剂（4）从所述芯片孔（21）向外延伸到所述壁上进入所述沟槽（22）。还公开了相应的壳体基体。

10. 发明授权

US07435997B2 Component comprising a large number of light-emitting-diode chips 有权
标题翻译：包含大量发光二极管芯片的部件
公开(公告)号：US07435997B2
公开(公告)日：2008-10-14
申请号：US10362554
申请日：2001-08-22
申请人： Karlheinz Arndt , Georg Bogner , Herbert Brunner , Gunter Waitl
发明人： Karlheinz Arndt , Georg Bogner , Herbert Brunner , Gunter Waitl
IPC分类号： H01L21/00
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A device (1) with a number of light emitting diode chips (5) in a reflector (3) is formed in such a way that the direct line of sight between the light emitting diode chips (5) is interrupted by a partition (11). This improves the efficiency of the device (1) substantially.
摘要翻译：在反射器（3）中具有多个发光二极管芯片（5）的装置（1）形成为使得发光二极管芯片（5）之间的直接视线被隔板（11）中断）。这实质上提高了装置（1）的效率。

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