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    • 21. 发明专利
    • Manufacturing method for polishing tool
    • 抛光工具的制造方法
    • JP2007253308A
    • 2007-10-04
    • JP2006084464
    • 2006-03-27
    • Hitachi Ltd株式会社日立製作所
    • CHIBA HIROSHIINABA HIROSHISASAKI SHINJIYASUI HIROTOYO KIYOKUTO
    • B24D3/00
    • PROBLEM TO BE SOLVED: To obtain a smooth polished surface in processing of an electronic device formed by various materials having different hardnesses, and to satisfy a specific characteristic required by the device.
      SOLUTION: A polishing tool is manufactured through a substrate polishing process for smoothing the surface of a substrate, the process for forming a polishing grain layer used for polishing the surface of the electronic device on the substrate, and a surface processing process for making polishing grains project on the surface of the polishing grain layer. Thus, a smooth polishing of the device can be obtained so that the surface of the polishing tool and a polished section of the device are brought into contact with each other and slid with each other.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了在由具有不同硬度的各种材料形成的电子装置的加工中获得光滑的抛光表面,并且满足该装置所需的特定特性。 解决方案:通过用于平滑基板的表面的基板抛光工艺制造抛光工具,用于形成用于抛光基板上的电子器件的表面的抛光晶粒层的工艺,以及用于 使抛光颗粒在抛光颗粒层的表面上突出。 因此,可以获得装置的平滑抛光,使得抛光工具的表面和装置的抛光部分彼此接触并相互滑动。 版权所有(C)2008,JPO&INPIT
    • 26. 发明专利
    • SPUTTERING DEVICE AND FILM FORMATION USING SAME
    • JPH0463267A
    • 1992-02-28
    • JP17274090
    • 1990-07-02
    • HITACHI LTD
    • KATAOKA HIROYUKIABE KATSUOINABA HIROSHIFURUSAWA KENJI
    • C23C14/34
    • PURPOSE:To obtain a sputtering device forming uniform film thickness distribution independently of film forming conditions by constituting, in a still and opposed type sputtering device, target plates into strip shape, arranging these plural target plates so that they are in parallel with each other in a longitudinal direction, and regulating the distance between respective centers of these adjacent target plates so that it is longer than the distance between these target plates and a substrate. CONSTITUTION:Three rectangular target plates (referred to as strip-like target plates) 101, 102, 103 electrically connected to respective sputter electrodes are arranged in parallel so that they are practically in parallel with each other in the longitudinal direction, and a substrate 3 to be subjected to film formation is disposed in a manner to be opposed to respective surfaces, on the sides to be sputtered, of the target plates. At this time, the spacing (distance) D between the target plates 101-103, each having a width of about 120mm, and the substrate 3 is about 95mm and also is regulated to about one-half the distance (d) 200mm, between respective centers of the adjacent target plates. By this method, uniform film thickness distribution can be formed over the region from the front of the target plate 101 to the front of the target plate 103.
    • 27. 发明专利
    • Grinding surface plate and its manufacturing method
    • 研磨面板及其制造方法
    • JP2007152545A
    • 2007-06-21
    • JP2006258237
    • 2006-09-25
    • Hitachi Ltd株式会社日立製作所
    • SASAKI SHINJIINABA HIROSHICHIBA HIROSHIYO KIYOKUTOYASUI HIROTO
    • B24D3/00
    • B24D18/0054B24B37/12
    • PROBLEM TO BE SOLVED: To reduce surface roughness occurring on a grinding portion, and thereby to reduce damage caused by machining and to improve grinding efficiency.
      SOLUTION: Abrasive grains are pushed and fixed on the surface of the grinding surface plate with mechanical pressure, and then the surface of the grinding surface plate containing the abrasive grains is subjected to plasma treatment, thereby improving the adhesiveness between the abrasive grains and the surface plate, and reducing the number of rolling particles separating from the surface of the surface plate, so as to realize flat abrasive machining of the device surface consisting of a plurality of materials.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了减少在研磨部分上发生的表面粗糙度,从而减少由机械加工引起的损坏并提高研磨效率。 解决方案:磨料颗粒以机械压力推压固定在研磨面板的表面上,然后对包含磨粒的研磨面板的表面进行等离子体处理,从而提高磨粒之间的粘附性 和表面板,并且减少从表面板的表面分离的滚动颗粒的数量,以实现由多种材料组成的装置表面的平面磨料加工。 版权所有(C)2007,JPO&INPIT