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21. 发明专利

JPH01214096A MANUFACTURE OF FLEXIBLE PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH01214096A
公开(公告)日：1989-08-28
申请号：JP3904688
申请日：1988-02-22
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KUMAZAWA KINYA , SEKI OSAMU , YAMANAKA NOBUMITSU , KOMATSU MASAYA
IPC分类号： H05K3/38
摘要： PURPOSE:To obtain a board with excellent contact and having excellent dimensional stability by processing the surface of a film made of liquid crystal polymer or a sheet board using low temperature plasma of oxidizing gas under a specific pressure, and then by forming a conductive layer on the surface thereof by physical deposition. CONSTITUTION:One or both surfaces of a film made of liquid crystal polymer or a sheet board 1 is processed by low temperature plasma of oxidizing gas in pressures of 10 Torr-10Torr. Then, a conductive layer 2 is formed on the processed surface by physical deposition. For example, liquid crystal polymer film 1 (polyester copolymer containing parahydroxy benzoic acid) of 50mum thick is set in a sputtering device having a plasma processing mechanism. After the device is discharged fully, oxygen gas is introduced to process by plasma for ten seconds at a gas pressure of 3X10 Torr and at a high-frequency power of 100W. After this, argon gas is introduced inside the device. Copper is sputtered for 120sec. at a gas pressure of 3X10 Torr and a high-frequency power of 100W, forming the conductive layer 2 of 1mum on the film 1.

22. 发明专利

JPH01205495A MANUFACTURE OF FLEXIBLE PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH01205495A
公开(公告)日：1989-08-17
申请号：JP2980688
申请日：1988-02-10
申请人： FURUKAWA ELECTRIC CO LTD
发明人： SEKI OSAMU , KOMATSU MASAYA , YAMANAKA NOBUMITSU , KUMAZAWA KINYA
IPC分类号： H05K3/02 , H05K3/04
摘要： PURPOSE:To form a flexible printed circuit board with a conductor circuit whose edge section is sharp in shape and high in dimensional accuracy, by a method wherein the thickness of a resist film is not less than ten times as large as the film thickness of a metallic thin-film of the conductor circuit which is attachedly formed. CONSTITUTION:An unnecessary section for shaping a conductor circuit pattern on the surface of a plastic film substrate 1 is coated with a resist 2, and desired metals 3, 4 are attached onto the surface of the substrate through a physical evaporation method. When the conductor circuit pattern is formed by peeling a resist film, the film thickness of the resist film is not less than ten times as large as the film thickness of an attachedly formed metallic film for a conductor circuit. Accordingly, the metallic film 3 bonded and formed onto the resist film 2 as a mask and the metallic film (a conductor layer) 4 on a film as the conductor circuit are not continued, thus acquiring a conductor circuit layer, an edge section of which is sharpened, after peeling the resist film.

23. 发明专利

JPH01147055A MANUFACTURE OF METAL-COATED PLASTIC FILM 失效
公开(公告)号：JPH01147055A
公开(公告)日：1989-06-08
申请号：JP30629987
申请日：1987-12-03
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KUMAZAWA KINYA , KOMATSU MASAYA , YAMANAKA NOBUMITSU , SEKI OSAMU
IPC分类号： C23C14/24 , C23C14/20
摘要： PURPOSE:To improve the surface smoothness of a metal-coated film by forming a thin metallic film layer of the desired thickness on the surface of a plastic film by the PVD method and then forming a thin metallic film layer on the above at low vapor deposition velocity. CONSTITUTION:Plasma treatment is applied to a plastic film 1 to form a plasma treated layer 2. Then, a thin metallic film layer 3 of the desired thickness is formed at a vapor deposition rate of >=0.1mum/min by a PVD method. Successively, vapor deposition is carried out at a vapor deposition rate as low as

24. 发明专利

JPS6431958A METHOD FOR ALLOWING THIN METALLIC FILM TO ADHERE TO PLASTIC FILM 失效
公开(公告)号：JPS6431958A
公开(公告)日：1989-02-02
申请号：JP18670087
申请日：1987-07-28
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOMATSU MASAYA , KUMAZAWA KINYA , YAMANAKA NOBUMITSU
IPC分类号： C23C14/02 , C23C14/20
摘要： PURPOSE:To allow a thin metallic film excellent in adhesive strength to adhere to a plastic film, by subjecting a plastic film to low-temp. plasma treatment of inert gas, forming a thin metallic film on the above by a physical vapor deposition method, and successively exposing the above film to a gaseous atmosphere having limited oxygen content. CONSTITUTION:A plastic film 11 is set in a vacuum tank 1 and the inside of the tank is evacuated. Ar is introduced from an exhaust nozzle 13 to regulate gas pressure to about 3.0X10 Torr and an A.C. voltage of about 1000V is applied to an electrode 12 to produce plasma, and then, plasma treatment is carried out while controlling the winding speed of the film 11. Subsequently, the inside of the tank 1 is evacuated and O2 gas is introduced until a pressure of about 1.0Torr is reached, and then, while being rewound, the film 11 is brought into contact with the atmosphere containing >=1% O2. The inside of the vacuum tank 1 is evacuated again and Ar is introduced, and, in a sputter chamber 2 equipped with a cathode to which a Cu target 8 is attached and an anode 10, a thin Cu film is formed on the film 11 by sputtering. By this method, the thin metallic film excellent in adhesive strength can be allowed to adhere to the plastic film 11.

25. 发明专利

JPS63270455A MANUFACTURE OF METAL-COATED PLASTIC FILM 失效
公开(公告)号：JPS63270455A
公开(公告)日：1988-11-08
申请号：JP10528287
申请日：1987-04-28
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KUMAZAWA KINYA , YAMANAKA NOBUMITSU , KOMATSU MASAYA
IPC分类号： C23C14/20
摘要： PURPOSE:To form a thin metallic film on a plastic film with high adhesion strength, by forming a thin metallic film after applying plasma treatment to the surface of a plastic film at a specific temp. or below at the time of forming a thin metallic film on the plastic-film surface. CONSTITUTION:A film of plastic such as polyethylene terephthalate is set in a sputtering device, and the inside of the device is sufficiently evacuated and then O2 gas is supplied at >=0.01Torr pressure to carry out plasma treatment by means of high-frequency electric power, so that surface temp. of the plastic film is maintained at a temp. of the glass-transition temp. or below. Subsequently, Ar gas is introduced into the sputtering device and, by using a metal such as Cu or Al as a target, a thin metallic film of Cu, Al, etc., excellent in surface smoothness and adhesive strength is formed on the sputtering film.

26. 发明专利

JPS6383255A FORMATION OF THIN METALLIC FILM 失效
公开(公告)号：JPS6383255A
公开(公告)日：1988-04-13
申请号：JP22799086
申请日：1986-09-29
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOMATSU MASAYA , KUMAZAWA KINYA , HORIGUCHI MASAO
IPC分类号： C23C14/06 , C23C14/20 , H05K1/00 , H05K3/14 , H05K3/38
摘要： PURPOSE:To form a thin metallic film having good adhesiveness by sticking a metal oxide film having an adequate thickness by a physical vapor deposition method on an org. high-polymer film, then sticking a thin metallic film of the same kind as said film under a reduced pressure thereon. CONSTITUTION:The org. high-polymer film 1 such as PE therephthalate film is run via a can roll 12 by a delivery roll 13 and a take-up roll 13' in a vacuum vessel 4. Said film 1 subjected to surface treatments including surface activation and cleaning by an ion bombardment device 5. A copper target 9 disposed between a cathode 7 and an anode 8 is thereafter sputtered with gaseous Ar/O2 in a 1st sputtering chamber 6 to stick the film 2 of the copper oxide to several tens - several hundreds Angstrom on the film 1. A copper target 9' disposed between a cathode 7' and anode 8' is then sputtered with gaseous Ar under a reduced pressure in a 2nd sputtering chamber 6' to stick and form the copper film 3 on the outside of the above-mentioned copper oxide film 2.

27. 发明专利

JPS6212008A MANUFACTURE OF TAPE WIRE 失效
公开(公告)号：JPS6212008A
公开(公告)日：1987-01-21
申请号：JP14990285
申请日：1985-07-10
申请人： FURUKAWA ELECTRIC CO LTD
发明人： HORIGUCHI MASAO , KUMAZAWA KINYA , NOJIRI AKIO
IPC分类号： H01B7/08 , H01B13/00

28. 发明专利

JPS6057810A HEAT-RESISTING OPTICAL FIBER UNIT 失效
公开(公告)号：JPS6057810A
公开(公告)日：1985-04-03
申请号：JP16621083
申请日：1983-09-09
申请人： FURUKAWA ELECTRIC CO LTD
发明人： SHIRASAKA ARIO , FUSE KENICHI , KUMAZAWA KINYA
IPC分类号： G02B6/44
摘要： PURPOSE:To hold the mechanical strength that an optical composite overhead earth-wire requires by storing plural optical fibers having a protective coating in a heat-resisting thermosplastic pipe, and covering the pipe with a protective layer made of fiber-reinforced thermosetting plastic. CONSTITUTION:Optical fibers 2 having a protective coating are stored in the pipe 7 made of thermoplastic material such as polyether ether ketone having superior heat resistance while a gap is left and the pipe is covered with the protective layer 4 made of thermosetting plastic containing reinforcing fiber such as long-sized glass fibers. Consequently, if the pipe is exposed to a high temperature of about 400 deg.C momentarily in case of lightning, the heat-resisting thermoplastic pipe 7 under the protective layer 4 expands thermally, but there is the gap part inside, so stress large enough to break the protective layer 4 internally is not generated.

29. 发明专利

JPH0551545B2 失效
公开(公告)号：JPH0551545B2
公开(公告)日：1993-08-02
申请号：JP24748783
申请日：1983-12-29
申请人： FURUKAWA ELECTRIC CO LTD , NIPPON TELEGRAPH & TELEPHONE
发明人： YANAGAWA HISAHARU , KUMAZAWA KINYA , KOKAYU MIKIO , MURATA HISASHI , MURAKAMI TAIJI
IPC分类号： C03C25/10 , G02B6/44 , C03C25/02

30. 发明专利

JPH02109390A HIGH-DENSITY FLEXIBLE PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH02109390A
公开(公告)日：1990-04-23
申请号：JP26058788
申请日：1988-10-18
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KUMAZAWA KINYA , SEKI OSAMU
IPC分类号： H05K1/02 , H05K3/24
摘要： PURPOSE:To obtain high density of circuits, freedom in design and shortening of time without deterioration in heat resistance and stability in sizes by forming a circuit pattern on a board so that a microcircuit part is very thin in comparison with a part for a large current without providing a bonding agent. CONSTITUTION:A conductor layer 2 comprising copper and the like having a thickness of 5mum or less is formed on one surface or on both surfaces of a film board 1 comprising polyimide, polyester and the like without providing a bonding agent and the like by a sputtering method and the like. Then the surface other than a large-current circuit pattern is covered with plating resist. A conductor layer 3 having a thickness of 18mum or more is formed by a electrolytic copper plating method and the like. Since the bonding agent is not used, causes for deteriorating heat resistance and stability in sizes can be decreased. Since the conductor layer of a microcircuit is very thin, the pitch of the circuit patterns can be made 200mum or less, and high density can be provided. Therefore, freedom in design for wiring of circuit at mounting positions and the like can be increased, and the design time can be shortened.

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