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21. 发明授权

US09208937B2 Choke having a core with a pillar having a non-circular and non-rectangular cross section 有权
标题翻译：扼流圈具有具有非圆形和非矩形横截面的柱的芯
公开(公告)号：US09208937B2
公开(公告)日：2015-12-08
申请号：US13331786
申请日：2011-12-20
申请人： Tsung-Chan Wu , Roger Hsieh , Yi-Min Huang , Lan-Chin Hsieh , Yu-Ching Kuo
发明人： Tsung-Chan Wu , Roger Hsieh , Yi-Min Huang , Lan-Chin Hsieh , Yu-Ching Kuo
IPC分类号： H01F27/02 , H01F27/06 , H01F27/29 , H01F5/00 , H01F27/28 , H01F27/255 , H01F17/04
CPC分类号： H01F27/255 , H01F17/045 , H01F2017/048
摘要： A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
摘要翻译：扼流圈包括完全由相同材料制成的单片式芯片，单片式芯片具有两块板和位于两块板之间的支柱，一个绕组空间位于两块板和支柱之间，其中支柱具有沿着与柱的轴向基本垂直的方向的非圆形和非矩形横截面，柱的横截面具有在柱的横截面的中心彼此相交的第一轴和第二轴并且基本上彼此垂直，所述第一轴线比所述第二轴线长，并且所述支柱的横截面与所述第一轴线和所述第二轴线基本对称。

22. 发明申请

US20100219924A1 CHOKE 有权
标题翻译：呛
公开(公告)号：US20100219924A1
公开(公告)日：2010-09-02
申请号：US12709912
申请日：2010-02-22
申请人： Tsung-Chan Wu , Roger Hsieh , Yi-Min Huang , Lan-Chin Hsieh
发明人： Tsung-Chan Wu , Roger Hsieh , Yi-Min Huang , Lan-Chin Hsieh
IPC分类号： H01F27/02
CPC分类号： H01F17/045 , H01F2017/048
摘要： An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. An area of the top board is smaller than an area of the bottom board. A winding space is fanned among the top board, the bottom board and the pillar. The wire is winded around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a metallic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 μm.
摘要翻译：提供了包括芯，至少线和磁性材料的电子设备。核心包括柱子，顶板和底板。支柱设置在顶板和底板之间。顶板的面积小于底板的面积。在顶板，底板和支柱之间蜿蜒的空间。电线缠绕在支柱上并位于绕组空间中。磁性材料填充绕组空间以封装电线。磁性材料包括树脂和金属粉末，其中磁粉的平均粒径小于20μm。

23. 发明授权

US09251944B2 Variable coupled inductor 有权
标题翻译：可变耦合电感
公开(公告)号：US09251944B2
公开(公告)日：2016-02-02
申请号：US13969486
申请日：2013-08-16
申请人： Lan-Chin Hsieh , Cheng-Chang Lee , Chih-Hung Chang , Chih-Siang Chuang , Tsung-Chan Wu , Roger Hsieh
发明人： Lan-Chin Hsieh , Cheng-Chang Lee , Chih-Hung Chang , Chih-Siang Chuang , Tsung-Chan Wu , Roger Hsieh
IPC分类号： H01F17/06 , H01F27/24 , H01F17/04 , H01F3/14 , H01F38/02 , H01F3/10
CPC分类号： H01F27/24 , H01F3/14 , H01F17/04 , H01F27/2823 , H01F38/023 , H01F2003/106
摘要： A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion.
摘要翻译：可变耦合电感器包括第一芯，两个导线，第二芯和磁结构。第一芯包括两个第一突出部分，第二突出部分和两个凹槽，其中第二突出部分位于两个第一突出部分之间，并且每个槽位于第一突出部分和第二突出部分之一之间。每个导线设置在一个凹槽中。第二芯设置在第一芯上。在第一突出部和第二芯之间形成有第一间隙，在第二突出部和第二芯之间形成有第二间隙。磁性结构设置在第二突出部和第二芯之间，并相对于第二突出部的中心线对称分布。

24. 发明申请

US20140055226A1 VARIABLE COUPLED INDUCTOR 有权
标题翻译：可变耦合电感器
公开(公告)号：US20140055226A1
公开(公告)日：2014-02-27
申请号：US13969486
申请日：2013-08-16
申请人： Lan-Chin Hsieh , Cheng-Chang Lee , Chih-Hung Chang , Chih-Siang Chuang , Tsung-Chan Wu , Roger Hsieh
发明人： Lan-Chin Hsieh , Cheng-Chang Lee , Chih-Hung Chang , Chih-Siang Chuang , Tsung-Chan Wu , Roger Hsieh
IPC分类号： H01F17/04
CPC分类号： H01F27/24 , H01F3/14 , H01F17/04 , H01F27/2823 , H01F38/023 , H01F2003/106
摘要： A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion.
摘要翻译：可变耦合电感器包括第一芯，两个导线，第二芯和磁结构。第一芯包括两个第一突出部分，第二突出部分和两个凹槽，其中第二突出部分位于两个第一突出部分之间，并且每个槽位于第一突出部分和第二突出部分之一之间。每个导线设置在一个凹槽中。第二芯设置在第一芯上。在第一突出部和第二芯之间形成有第一间隙，在第二突出部和第二芯之间形成有第二间隙。磁性结构设置在第二突出部和第二芯之间，并相对于第二突出部的中心线对称分布。

25. 发明授权

US5896081A Resistance temperature detector (RTD) formed with a surface-mount-device (SMD) structure 失效
标题翻译：电阻温度检测器（RTD）由表面贴装器件（SMD）结构形成
公开(公告)号：US5896081A
公开(公告)日：1999-04-20
申请号：US872564
申请日：1997-06-10
申请人： Jackel Tzeng , Roger Hsieh , Duen-Jen Cheng
发明人： Jackel Tzeng , Roger Hsieh , Duen-Jen Cheng
IPC分类号： G01K7/18 , H01C7/10 , H01C17/00
CPC分类号： H01C17/006 , G01K7/183 , H01C7/10 , Y10T29/49082 , Y10T29/49085
摘要： The present invention discloses a surface-mount resistance-temperature-detector (RTD) supported on a substrate. The surface-mount RTD includes a resistive strip disposed on a top surface of the substrate having a substantially linear temperature resistance coefficient (TCR) over a predetermined temperature range for measurement. The surface-mount RTD further includes two top terminals disposed on two opposite end on the top surface of the substrate wherein each of the top terminal connected to one end of the resistive strip. The surface-mount RTD further includes two bottom terminals disposed on a bottom surface of the substrate wherein each of the bottom terminals is disposed below one of the top terminals. The surface-mount RTD further includes two edge conductive plates each disposed on an edge surface of the substrate connected to one of the top terminals to a corresponding bottom terminal below. The surface-mount RTD further includes two surface mount solder electrodes wherein each solder electrode constituting a conductive layer overlying the top terminal, the edge conductive plate and the bottom terminal provided for performing a surface-mount soldering operation thereon. In a preferred embodiment, the surface-mount RTD further includes a passivation protective layer covering and protecting the resistive strip. In a preferred embodiment, the surface-mount RTD further includes two terminal-solder buffer pastes each disposed on top of the top surface terminal under the surface-mount solder electrode for buffering the top terminal and the solder electrode. In a preferred embodiment, the resistive strip is a platinum resistive strip having a temperature coefficient of resistance (TCR) ranging from 3000 to 3900 ppm/.degree.C.
摘要翻译：本发明公开了一种支撑在基板上的表面安装电阻温度检测器（RTD）。表面贴装RTD包括设置在基板的顶表面上的电阻条，该电阻条在预定的温度范围内具有基本线性的耐温系数（TCR），用于测量。表面安装RTD还包括两个顶部端子，其设置在基板的顶表面上的两个相对端上，其中每个顶部端子连接到电阻带的一端。表面安装RTD还包括设置在基板的底表面上的两个底部端子，其中每个底部端子设置在顶部端子之一的下方。表面安装RTD还包括两个边缘导电板，每个边缘导电板设置在连接到顶部端子中的一个的基板的边缘表面上，到下面的相应的底部端子。表面贴装RTD还包括两个表面贴装焊料电极，其中每个焊料电极构成覆盖顶部端子的导电层，边缘导电板和底部端子，用于在其上执行表面贴装焊接操作。在优选实施例中，表面安装RTD还包括覆盖并保护电阻带的钝化保护层。在优选实施例中，表面贴装RTD还包括两个末端焊料缓冲浆料，每个末端焊料缓冲浆料均设置在表面安装焊料电极下面的顶表面端子的顶部，用于缓冲顶部端子和焊料电极。在优选实施例中，电阻条是具有3000至3900ppm /℃范围内的电阻温度系数（TCR）的铂电阻条。

26. 发明申请

US20100289609A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20100289609A1
公开(公告)日：2010-11-18
申请号：US12703495
申请日：2010-02-10
申请人： WEN-HSIUNG LIAO , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人： WEN-HSIUNG LIAO , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F27/255
CPC分类号： H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要： An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
摘要翻译：提供了包括磁体和电线的电子设备。磁体具有与第一磁性粉末混合的第一磁性粉末和第二磁性粉末。第一磁粉的维氏硬度大于第二磁粉的硬度，第一磁粉的平均粒径大于第二磁粉的平均粒径。

27. 发明授权

US08518190B2 Electronic device and manufacturing method thereof 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US08518190B2
公开(公告)日：2013-08-27
申请号：US12703495
申请日：2010-02-10
申请人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F1/14 , H01F1/153 , H01F17/04
CPC分类号： H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要： An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
摘要翻译：提供了包括磁体和电线的电子设备。磁体具有与第一磁性粉末混合的第一磁性粉末和第二磁性粉末。第一磁粉的维氏硬度大于第二磁粉的硬度，第一磁粉的平均粒径大于第二磁粉的平均粒径。

28. 发明申请

US20120299687A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20120299687A1
公开(公告)日：2012-11-29
申请号：US13561266
申请日：2012-07-30
申请人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F27/255
CPC分类号： H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要： An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
摘要翻译：提供了包括磁体和电线的电子设备。磁体具有与第一磁性粉末混合的第一磁性粉末和第二磁性粉末。第一磁粉的维氏硬度大于第二磁粉的硬度，第一磁粉的平均粒径大于第二磁粉的平均粒径。

29. 发明授权

US08922312B2 Electronic device and manufacturing method thereof 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US08922312B2
公开(公告)日：2014-12-30
申请号：US13853083
申请日：2013-03-29
申请人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F27/02
CPC分类号： H01F3/08 , H01F41/0246 , H01F2017/048
摘要： An electronic device comprising a first magnetic powder, a second magnetic powder and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder is provided. The conducting wire comprises an insulating encapsulant and a conducting metal encapsulated by the insulating encapsulant. The Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder, and the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder. By means of the hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at the temperature lower than the melting point of the insulating encapsulant.
摘要翻译：提供包括第一磁粉，第二磁粉和埋在第一磁粉和第二磁粉混合物中的导线的电子装置。导线包括由绝缘密封剂封装的绝缘密封剂和导电金属。第一磁性粉末的维氏硬度大于第二磁性粉末的维氏硬度，第一磁性粉末的平均粒径大于第二磁性粉末的平均粒径。通过第一磁性粉末和第二磁性粉末的硬度差，将第一磁性粉末和第二磁性粉末与埋入其中的导线的混合物组合在一起形成一个低于熔化温度的整体磁体点绝缘密封剂。

30. 发明授权

US08771436B2 Electronic device and manufacturing method thereof 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US08771436B2
公开(公告)日：2014-07-08
申请号：US13561266
申请日：2012-07-30
申请人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F1/22 , H01F1/153 , H01F27/255
CPC分类号： H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要： An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
摘要翻译：提供了包括磁体和电线的电子设备。磁体具有与第一磁性粉末混合的第一磁性粉末和第二磁性粉末。第一磁粉的维氏硬度大于第二磁粉的硬度，第一磁粉的平均粒径大于第二磁粉的平均粒径。

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