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1. 发明授权

US5896081A Resistance temperature detector (RTD) formed with a surface-mount-device (SMD) structure 失效
标题翻译：电阻温度检测器（RTD）由表面贴装器件（SMD）结构形成
公开(公告)号：US5896081A
公开(公告)日：1999-04-20
申请号：US872564
申请日：1997-06-10
申请人： Jackel Tzeng , Roger Hsieh , Duen-Jen Cheng
发明人： Jackel Tzeng , Roger Hsieh , Duen-Jen Cheng
IPC分类号： G01K7/18 , H01C7/10 , H01C17/00
CPC分类号： H01C17/006 , G01K7/183 , H01C7/10 , Y10T29/49082 , Y10T29/49085
摘要： The present invention discloses a surface-mount resistance-temperature-detector (RTD) supported on a substrate. The surface-mount RTD includes a resistive strip disposed on a top surface of the substrate having a substantially linear temperature resistance coefficient (TCR) over a predetermined temperature range for measurement. The surface-mount RTD further includes two top terminals disposed on two opposite end on the top surface of the substrate wherein each of the top terminal connected to one end of the resistive strip. The surface-mount RTD further includes two bottom terminals disposed on a bottom surface of the substrate wherein each of the bottom terminals is disposed below one of the top terminals. The surface-mount RTD further includes two edge conductive plates each disposed on an edge surface of the substrate connected to one of the top terminals to a corresponding bottom terminal below. The surface-mount RTD further includes two surface mount solder electrodes wherein each solder electrode constituting a conductive layer overlying the top terminal, the edge conductive plate and the bottom terminal provided for performing a surface-mount soldering operation thereon. In a preferred embodiment, the surface-mount RTD further includes a passivation protective layer covering and protecting the resistive strip. In a preferred embodiment, the surface-mount RTD further includes two terminal-solder buffer pastes each disposed on top of the top surface terminal under the surface-mount solder electrode for buffering the top terminal and the solder electrode. In a preferred embodiment, the resistive strip is a platinum resistive strip having a temperature coefficient of resistance (TCR) ranging from 3000 to 3900 ppm/.degree.C.
摘要翻译：本发明公开了一种支撑在基板上的表面安装电阻温度检测器（RTD）。表面贴装RTD包括设置在基板的顶表面上的电阻条，该电阻条在预定的温度范围内具有基本线性的耐温系数（TCR），用于测量。表面安装RTD还包括两个顶部端子，其设置在基板的顶表面上的两个相对端上，其中每个顶部端子连接到电阻带的一端。表面安装RTD还包括设置在基板的底表面上的两个底部端子，其中每个底部端子设置在顶部端子之一的下方。表面安装RTD还包括两个边缘导电板，每个边缘导电板设置在连接到顶部端子中的一个的基板的边缘表面上，到下面的相应的底部端子。表面贴装RTD还包括两个表面贴装焊料电极，其中每个焊料电极构成覆盖顶部端子的导电层，边缘导电板和底部端子，用于在其上执行表面贴装焊接操作。在优选实施例中，表面安装RTD还包括覆盖并保护电阻带的钝化保护层。在优选实施例中，表面贴装RTD还包括两个末端焊料缓冲浆料，每个末端焊料缓冲浆料均设置在表面安装焊料电极下面的顶表面端子的顶部，用于缓冲顶部端子和焊料电极。在优选实施例中，电阻条是具有3000至3900ppm /℃范围内的电阻温度系数（TCR）的铂电阻条。

2. 发明授权

US6151771A Resistance temperature detector (RTD) formed with a surface-mount-device (SMD) structure 有权
标题翻译：电阻温度检测器（RTD）由表面贴装器件（SMD）结构形成
公开(公告)号：US6151771A
公开(公告)日：2000-11-28
申请号：US274736
申请日：1999-03-23
申请人： Jackel Tzeng , Roger Hsieh , Duen-Jen Cheng
发明人： Jackel Tzeng , Roger Hsieh , Duen-Jen Cheng
IPC分类号： G01K7/18 , H01C7/10 , H01C17/00
CPC分类号： H01C17/006 , G01K7/183 , H01C7/10 , Y10T29/49082 , Y10T29/49085
摘要： The present invention discloses a method for manufacturing a surface mount resistance-temperature-detector (RTD) on a substrate. The manufacture method includes the steps of (a) depositing a resistive thin film on a top surface of the substrate having a substantially linear temperature resistance coefficient (TCR) over a predetermined temperature range for temperature measurement; (b) patterning the resistive film into a plurality of resistive strips and a plurality of top terminals near two opposite edges on the top surface of the substrate with each resistive strip connected between two top terminals; (c) forming a bottom electrode on a bottom surface of the substrate underneath each of the top terminals; (d) depositing two edge conductive plates on edge surfaces of the substrate for connecting one of the top terminals to a bottom terminal thereunder; and (e) forming two surface mount solder electrodes with a conductive layer overlying the top terminal, the edge conductive plate and the bottom terminal provided for performing a surface-mount soldering operation thereon.
摘要翻译：本发明公开了一种在基板上制造表面安装电阻温度检测器（RTD）的方法。该制造方法包括以下步骤：（a）在具有基本上线性的耐温系数（TCR）的基板的顶表面上沉积电阻薄膜超过预定温度范围进行温度测量; （b）将电阻膜图案化成多个电阻条和位于基板顶表面两个相对边缘附近的多个顶端，每个电阻条连接在两个顶端之间; （c）在每个顶端子下面的衬底的底表面上形成底电极; （d）在所述基板的边缘表面上沉积两个边缘导电板，用于将所述顶部端子中的一个连接到其下面的底部端子; 和（e）形成两个表面贴装的焊料电极，其上覆盖着顶部端子，边缘导电板和底部端子，用于在其上执行表面贴装焊接操作。

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