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1. 发明授权

US08518190B2 Electronic device and manufacturing method thereof 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US08518190B2
公开(公告)日：2013-08-27
申请号：US12703495
申请日：2010-02-10
申请人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F1/14 , H01F1/153 , H01F17/04
CPC分类号： H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要： An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
摘要翻译：提供了包括磁体和电线的电子设备。磁体具有与第一磁性粉末混合的第一磁性粉末和第二磁性粉末。第一磁粉的维氏硬度大于第二磁粉的硬度，第一磁粉的平均粒径大于第二磁粉的平均粒径。

2. 发明申请

US20120299687A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20120299687A1
公开(公告)日：2012-11-29
申请号：US13561266
申请日：2012-07-30
申请人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F27/255
CPC分类号： H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要： An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
摘要翻译：提供了包括磁体和电线的电子设备。磁体具有与第一磁性粉末混合的第一磁性粉末和第二磁性粉末。第一磁粉的维氏硬度大于第二磁粉的硬度，第一磁粉的平均粒径大于第二磁粉的平均粒径。

3. 发明授权

US08922312B2 Electronic device and manufacturing method thereof 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US08922312B2
公开(公告)日：2014-12-30
申请号：US13853083
申请日：2013-03-29
申请人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F27/02
CPC分类号： H01F3/08 , H01F41/0246 , H01F2017/048
摘要： An electronic device comprising a first magnetic powder, a second magnetic powder and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder is provided. The conducting wire comprises an insulating encapsulant and a conducting metal encapsulated by the insulating encapsulant. The Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder, and the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder. By means of the hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at the temperature lower than the melting point of the insulating encapsulant.
摘要翻译：提供包括第一磁粉，第二磁粉和埋在第一磁粉和第二磁粉混合物中的导线的电子装置。导线包括由绝缘密封剂封装的绝缘密封剂和导电金属。第一磁性粉末的维氏硬度大于第二磁性粉末的维氏硬度，第一磁性粉末的平均粒径大于第二磁性粉末的平均粒径。通过第一磁性粉末和第二磁性粉末的硬度差，将第一磁性粉末和第二磁性粉末与埋入其中的导线的混合物组合在一起形成一个低于熔化温度的整体磁体点绝缘密封剂。

4. 发明授权

US08771436B2 Electronic device and manufacturing method thereof 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US08771436B2
公开(公告)日：2014-07-08
申请号：US13561266
申请日：2012-07-30
申请人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F1/22 , H01F1/153 , H01F27/255
CPC分类号： H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要： An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
摘要翻译：提供了包括磁体和电线的电子设备。磁体具有与第一磁性粉末混合的第一磁性粉末和第二磁性粉末。第一磁粉的维氏硬度大于第二磁粉的硬度，第一磁粉的平均粒径大于第二磁粉的平均粒径。

5. 发明申请

US20130229251A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20130229251A1
公开(公告)日：2013-09-05
申请号：US13853083
申请日：2013-03-29
申请人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F3/08 , H01F41/02
CPC分类号： H01F3/08 , H01F41/0246 , H01F2017/048
摘要： An electronic device comprising a first magnetic powder, a second magnetic powder and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder is provided. The conducting wire comprises an insulating encapsulant and a conducting metal encapsulated by the insulating encapsulant. The Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder, and the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder. By means of the hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at the temperature lower than the melting point of the insulating encapsulant.
摘要翻译：提供包括第一磁粉，第二磁粉和埋在第一磁粉和第二磁粉混合物中的导线的电子装置。导线包括由绝缘密封剂封装的绝缘密封剂和导电金属。第一磁性粉末的维氏硬度大于第二磁性粉末的维氏硬度，第一磁性粉末的平均粒径大于第二磁性粉末的平均粒径。通过第一磁性粉末和第二磁性粉末的硬度差，将第一磁性粉末和第二磁性粉末与埋入其中的导线的混合物组合在一起形成一个低于熔化温度的整体磁体点绝缘密封剂。

6. 发明申请

US20100289609A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20100289609A1
公开(公告)日：2010-11-18
申请号：US12703495
申请日：2010-02-10
申请人： WEN-HSIUNG LIAO , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人： WEN-HSIUNG LIAO , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F27/255
CPC分类号： H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要： An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
摘要翻译：提供了包括磁体和电线的电子设备。磁体具有与第一磁性粉末混合的第一磁性粉末和第二磁性粉末。第一磁粉的维氏硬度大于第二磁粉的硬度，第一磁粉的平均粒径大于第二磁粉的平均粒径。

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