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    • 21. 发明申请
    • Semiconductor Memory Devices Including Diagonal Bit Lines
    • 包括对角位线的半导体存储器件
    • US20090218610A1
    • 2009-09-03
    • US12465234
    • 2009-05-13
    • Don-Hoon GooHan-Ku ChoJoo-Tac MoonSang-Gyun WooGi-Sung YeoKyoung-Yun Baek
    • Don-Hoon GooHan-Ku ChoJoo-Tac MoonSang-Gyun WooGi-Sung YeoKyoung-Yun Baek
    • H01L27/108
    • H01L27/10814H01L27/0207H01L27/10882H01L27/11502
    • A semiconductor memory device may include a semiconductor substrate having a plurality of active regions wherein each active region has a length in a direction of a first axis and a width in a direction of a second axis. The length may be greater than the width, and the plurality of active regions may be provided in a plurality of columns in the direction of the second axis. A plurality of wordline pairs may be provided on the substrate, with each wordline pair crossing active regions of a respective column of active regions defining a drain portion of each active region between wordlines of the respective wordline pair. A plurality of bitlines on the substrate may cross the plurality of wordline pairs, with each bitline being electrically coupled to a drain portion of a respective active region of each column, and with each bitline crossing drain portions of active regions of adjacent columns in different directions so that different portions of a same bitline are aligned in different directions on different active regions of adjacent columns.
    • 半导体存储器件可以包括具有多个有源区的半导体衬底,其中每个有源区具有在第一轴的方向上的长度和在第二轴的方向上的宽度。 长度可以大于宽度,并且多个有源区域可以在第二轴线的方向上以多个列设置。 可以在衬底上提供多个字线对,其中每个字线对跨越相应的有效区域列的有源区域,在相应字线对的字线之间限定每个有效区域的漏极部分。 衬底上的多个位线可以跨越多个字线对,每个位线电耦合到每列的相应有源区的漏极部分,并且每个位线在不同方向上与相邻列的有源区域的漏极部分交叉 使得相同位线的不同部分在相邻列的不同有效区域上在不同方向上对准。
    • 28. 发明申请
    • Method of forming self-aligned contact pads of non-straight type semiconductor memory device
    • 形成非直型半导体存储器件的自对准接触焊盘的方法
    • US20050070080A1
    • 2005-03-31
    • US10944151
    • 2004-09-16
    • Eun-Mi LeeDoo-Hoon GooJung-Hyeon LeeGi-Sung Yeo
    • Eun-Mi LeeDoo-Hoon GooJung-Hyeon LeeGi-Sung Yeo
    • H01L21/28H01L21/4763H01L21/60H01L23/485
    • H01L21/76897H01L23/485H01L2924/0002H01L2924/00
    • Embodiments of the invention provide methods of forming SAC pads in non-straight semiconductor device having non-straight type or separate type active regions. A plurality of gate line structures extending in one direction may be formed on a semiconductor substrate having non-straight active regions. An interlayer insulating layer covering gate line structures may be formed on the gate line structures. Then, a photo-resist layer may be formed on the interlayer insulating layer. A photo-resist pattern may be formed through exposing and developing the photo-resist layer by using a photo-mask having, for example, a bar type, a wave type, or a reverse active type pattern. Then, contact holes exposing source/drain regions may be formed by etching the interlayer insulating layer using the photo-resist pattern as an etching mask. Contact pads may then be formed by filling the contact holes with a conductive material.
    • 本发明的实施例提供了在具有非直型或分离型有源区的非直线半导体器件中形成SAC焊盘的方法。 可以在具有非直线活性区域的半导体衬底上形成沿一个方向延伸的多个栅极线结构。 覆盖栅极线结构的层间绝缘层可以形成在栅极线结构上。 然后,可以在层间绝缘层上形成光致抗蚀剂层。 可以通过使用具有例如棒型,波型或反向活性型图案的光掩模,通过曝光和显影光致抗蚀剂层来形成光致抗蚀剂图案。 然后,可以通过使用光刻胶图案作为蚀刻掩模蚀刻层间绝缘层来形成暴露源极/漏极区的接触孔。 然后可以通过用导电材料填充接触孔来形成接触垫。